CN103545168A - Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus - Google Patents
Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus Download PDFInfo
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- CN103545168A CN103545168A CN201310284650.9A CN201310284650A CN103545168A CN 103545168 A CN103545168 A CN 103545168A CN 201310284650 A CN201310284650 A CN 201310284650A CN 103545168 A CN103545168 A CN 103545168A
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- adhesive tape
- band
- mentioned
- bonding strap
- carrier band
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
This invention provides an adhesive tape, an adhesive tape joining method and an adhesive tape joining apparatus. A raw material roll of a strip-shaped raw material tape of the adhesive tape is adhered to a strip-shaped carrier tape. The raw material tape has arc shapes on two sides of the raw material tape in the width direction and has line-shaped and ring-shaped cutting members which are positioned in the front and in the end along the length direction. The cutting members is positioned above the carrier tape and cut the half of the adhesive tape into a joining tape sheet, such that the carrier tape can perform turning-back movement at the cutting edge. The self carrier tape is stripped from the adhesive tape sheet while a retaining operation platform and a adhesive roll perform relative movement in synchronization speed with the stripping speed, and the adhesive tape sheet is adhered to the ring-shaped frame on the retaining platform.
Description
Technical field
The present invention relates to be pasted on for keep semiconductor crystal wafer ring frame adhesive tape and for by this adhesive tape joining in method of attaching and the adhesive tape joining apparatus of the adhesive tape of ring frame.
Background technology
In order to make to process because carrying on the back mill the semiconductor crystal wafer of slimming (following, suitably be called " wafer ") there is rigidity and easily processing, and in order to carry out cutting process, and wafer is carried out bonding and kept in the central authorities of ring frame by the adhesive tape (cutting belt) of supporting use.
The gluing treatment of cutting belt is for example implemented as follows like that.From the roll coil of strip, emit the banded bonding film of being located at banded substrate sheet.On this substrate sheet, this bonding film is cut into circle and forms cutting belt.The substrate sheet that is formed with cutting belt is guided to the labelling machine being formed by cutting edge parts, make substrate sheet turn back and cutting belt is peeled off.Make the cutting belt being stripped from be pasted on ring frame simultaneously and be disposed at the central wafer of this ring frame and will between this ring frame and wafer, couple together (with reference to TOHKEMY 2005-116928 communique).
As shown in Fig. 4 (c), this cutting belt form make circular cutting belt on substrate sheet across predetermined distance arrange.
In addition, as shown in Fig. 4 (a), also there is such cutting belt, banded blank hemisection is slit into the circular with line part all around at length direction on substrate sheet everywhere, and the cutting belt of multi-disc on fore-and-aft direction so that the line part mode of line contact be connected (with reference to TOHKEMY 2011-192850 communique) each other.
Cutting belt shown in Fig. 4 (c) is for to form across predetermined distance hemisect, if only from the angle at an interval between the cutting belt of front and back, this is spaced apart shorter distance.Therefore, can think that the remainder after discarded cut cutting belt can not exert an influence.But, if take stock roll as unit, because the sheet number by the rounded cutting belt cutting is a lot, so the discarded amount of accumulation increases.Therefore, ring frame and wafer are being carried out, in the gluing treatment of adhesive tape, having such problem: the replacement frequency that is wound with the stock roll of cutting belt increases, operating efficiency reduces.
In addition, for the cutting belt shown in Fig. 4 (a), the line contact each other of the line part of bonding strap, thus do not produce in the longitudinal direction discarded part.But, when from substrate sheet release adhesive strap, even if carried out hemisect, or the frequent situation that the bonding strap of object and the adhesive layer of follow-up bonding strap stick to each other of peeling off that produces.
Under such state, proceed with gluing treatment, can produce fold in the tip side of follow-up bonding strap.And produce, can not make cutting belt be closely attached on accurately the problem of ring frame.
Summary of the invention
The present invention makes in view of such situation, its object is, providing a kind of can will cut from banded adhesive tape efficiently for being pasted on the adhesive tape of ring frame, and can be pasted on accurately the adhesive tape of ring frame, the method for attaching of adhesive tape and adhesive tape joining apparatus.
The present invention adopts following technical scheme in order to reach such object.
That is, be a kind ofly pasted on ring frame and semiconductor crystal wafer and by the adhesive tape coupling together between ring frame and semiconductor crystal wafer, this adhesive tape comprises following structure.
This adhesive tape is configured to the bonding strap of multi-disc on the circular-arc end limit that has the end limit of relative linearity and link up with this limit, two ends of linearity, so that the near and relative mode alignment arrangements of the end edge joint of their linearities is each other on rectangular carrier band.
Adopt this adhesive tape, at the front and back position of the length direction of carrier band, there is the bonding strap of multi-disc on linearly end limit so that the end edge joint of their linearities is each other near and relative mode forms, thereby can reduce the use amount of the bonding strap of average a slice.
And the distance that cuts part being arranged between the bonding strap of the front and back on carrier band shortens, thereby can reduce the discarded part of the adhesive tape after hemisect.Therefore, the sheet number of the bonding strap of being located on carrier band can be increased, the replacement frequency of the roll coil of strip of adhesive tape can be reduced.
And bonding strap also can have along the end limit of the parallel a pair of linearity of the side end edge of carrier band.That is, bonding strap also can be for having the shape on the end limit of four linearities all around.Adopt this adhesive tape, in the situation that being cut into the adhesive tape of Rack, the stock roll of wide cut manufactures the roll coil of strip of a plurality of adhesive tapes, compare with the adhesive tape that forms the bonding strap on circular-arc end limit at Width, bandwidth can be shortened, thereby the roll coil of strip of more Rack can be produced by stock roll.And, also can reduce the discarded amount of stock roll.
And the present invention, in order to reach such object, adopts following technical scheme.
That is, a kind of by adhesive tape joining in the adhesive tape joining method of ring frame, said method comprises following process:
Emit process, the raw band that is fitted with the adhesive tape of strip on the carrier band of strip is emitted from stock roll;
Cutting process, utilization has circular shape in the both sides of the Width of above-mentioned raw materials band and at the front and back position of length direction, has the cutting part of the ring-type of rectilinear form, on carrier band, above-mentioned adhesive tape hemisection is slit into adhesive tape sheet;
Taping process, make above-mentioned carrier band turn back and advance at cutting edge parts place, thereby when the self-contained band of above-mentioned bonding strap is peeled off, Yi Bian holding table and Sticking roller and peeling rate are synchronously relatively moved, Yi Bian bonding strap is pasted on to the ring frame on holding table.
Adopt the method, can carry out hemisect to raw band and be formed on the bonding strap that fore-and-aft direction has the end limit of linearity, can from carrier band release adhesive strap, bonding strap be pasted on to ring frame on one side on one side.Therefore, can reduce use amount in the longitudinal direction of adhesive tape and be cut into the discarded part between this bonding strap after bonding strap.In other words, the amount that cuts out bonding strap that stock roll is average increases, thereby can reduce the replacement frequency of stock roll.
And, the bonding strap of peeling off object and follow-up bonding strap unlike type in the past each other line contact.Thus, after having peeled off the bonding strap of processing object, the tip side of follow-up bonding strap can be not bonding again by adhesive layer with the rear end of peeling off the bonding strap of object, and therefore the top of follow-up bonding strap can not produce fold etc.Therefore, can make bonding strap be close to ring frame.
In addition, cutting part is for example used the cutting roller of the cutting edge of the ring-type that having is connected with rectilinear form by circular shape forms.
Adopt the method, can synchronously make with the emitting rate of adhesive tape cutting roller press on adhesive tape to roll and hemisect goes out bonding strap.Namely, do not need to stop transferring raw material band.Therefore, can efficiently implement the hemisect of bonding strap and paste bonding strap to ring frame.
And the present invention in order to reach such object by the following technical solutions.
That is, a kind of by adhesive tape joining in the adhesive tape joining apparatus of ring frame, this device comprises following structure:
Band supply unit, it is for emitting the raw band that is fitted with the adhesive tape of strip on the carrier band of strip from stock roll;
Tape movement guide, it makes to advance along the band transport path of regulation from above-mentioned raw band of emitting with supply unit, and is guided to cutting edge parts;
Band pre-cutting mechanism, it utilizes the cutting part that has circular shape and have the ring-type of rectilinear form at the front and back position of length direction in the both sides that are disposed at the Width of the above-mentioned adhesive tape with transport path, on carrier band, adhesive tape hemisection is slit into adhesive tape sheet;
Cutting edge parts, it turns back and release adhesive strap above-mentioned carrier band;
Holding table, it is for keeping above-mentioned ring frame;
Band labelling machine, it makes synchronously to relatively move with band gait of march between above-mentioned holding table and Sticking roller on one side, with this Sticking roller, press the bonding strap that utilizes above-mentioned cutting edge parts and be stripped from from carrier band on one side, and be pasted on the ring frame on holding table;
Carrier band recoverer, it is for reclaiming the carrier band that has been stripped from above-mentioned bonding strap.
Adopt this structure, can with gait of march synchronously on transport path after the raw band hemisect of strip goes out bonding strap, on one side from carrier band, peel off this bonding strap, bonding strap is pasted on to ring frame on one side.That is, adopt this structure, can implement aptly said method.
In addition, preferably cutting part is to have be connected with the rectilinear form cutting roller of cutting edge of the ring-type that forms of circular shape.
Adopt this structure, when the bonding strap of adhesive tape hemisect of strip, need not stop transferring raw material band, just can carry out continuously the hemisect of adhesive tape and paste bonding strap to ring frame.
Accompanying drawing explanation
Fig. 1 is the vertical view of adhesive tape.
Fig. 2 is the amplification plan view of the part of being surrounded by two chain line of Fig. 1.
Fig. 3 is the vertical profile end view of adhesive tape.
Fig. 4 is the comparison diagram of adhesive tape of the present invention and adhesive tape in the past.
Fig. 5 is the front view of adhesive tape joining apparatus.
Fig. 6 is the vertical view of adhesive tape joining apparatus.
Fig. 7 is the stereogram of cutting roller.
Fig. 8 is the longitudinal section of pasting work table.
Fig. 9 means the flow chart that adhesive tape joining is processed.
Figure 10 is the stereogram with paste section.
Figure 11 means the summary side elevation of the adhesive tape joining action of the first stickup unit.
Figure 12 means the summary side elevation of the adhesive tape joining action of the first stickup unit.
Figure 13 means the summary side elevation of the adhesive tape joining action of the second stickup unit.
Figure 14 means the summary side elevation of the adhesive tape joining action of the second stickup unit.
Figure 15 is the vertical view of the rear side of wafer paster.
Figure 16 is the front view of the adhesive tape joining apparatus of variation.
Figure 17 is the vertical profile end view that second of variation is pasted unit.
Figure 18 means the flow chart of gluing treatment of the adhesive tape of variation.
Figure 19 means the summary side elevation that bonding strap is pasted on to the action of wafer.
Figure 20 means the summary side elevation that bonding strap is pasted on to the action of wafer.
Figure 21 means the summary side elevation that bonding strap is pasted on to the action of wafer.
Figure 22 is the front view of variation device.
Figure 23 is the vertical view of the adhesive tape of variation device.
Figure 24 is the vertical view of rear side of the wafer paster of variation.
Embodiment
For invention is described, illustrate several execution modes of thinking now suitable, wish to be interpreted as that the present invention is not limited to illustrate such structure and method.
Below, with reference to accompanying drawing, one embodiment of the invention are described.
(adhesive tape)
In the present embodiment, to comprising for banded adhesive tape semiconductor crystal wafer is bonding and that be held in the bonding strap of ring frame, describe in detail.
Fig. 1 shows the vertical view of adhesive tape of the present invention, and Fig. 2 shows the local amplification plan view of adhesive tape, and Fig. 3 shows the vertical profile end view of adhesive tape.
In adhesive tape T, on the carrier band ct of strip, be fitted with the adhesive tape with the strip of this carrier band ct same widths.Adhesive tape is from being slit into adhesive tape sheet ta by hemisection on carrier band ct, and this bonding strap ta has the circular-arc end limit e2 of the pair of right and left linking at the end limit e1 of the relative a pair of linearity of the front and back position with length direction quadrature with each end of this limit, two ends e1 of linearity.The bonding strap ta of multi-disc forms in tandem along the length direction of adhesive tape T, so that the end limit e1 of their linearity each other approaches and relative mode alignment arrangements.
Before and after the end limit e1 of linearity of bonding strap ta between distance be set as following distance: when peeling off the bonding strap ta in the place ahead that is positioned at throughput direction, the adhesive layer of the rear end of this bonding strap ta can be not bonding again with the adhesive layer of the front end of the bonding strap ta at rear.That is the top effect of bonding strap ta that can be not in the wings when, being set as bonding strap and being pasted on ring frame has unnecessary peel stress and produces the distance of fold.The generation of this fold changes according to the kind of adhesive tape T, environmental characteristics (such as temperature, humidity, tension force etc.).Therefore, bonding strap ta spacing each other by experiment, simulation determine in advance.Wherein, this distance is set as, for example, as shown in Figure 4, the situation (Fig. 4 (a)) contacting with each other with the end limit of the linearity of past case, past case bonding strap ta is cut into circle just and with prescribed distance, arrange before and after the situation (Fig. 4 (c)) of bonding strap ta compare, in the distance L between center P 1 to P2 2 of the bonding strap ta of the present embodiment and past case, distance L 1 in the heart and the pass of L3 are L1 < L2 < L3.
In addition, as shown in Figure 3, adhesive tape T forms according to the sequential cascade of carrier band ct, adhesive layer tb and base material tc.
(adhesive tape joining apparatus)
Fig. 5 shows the front of adhesive tape joining apparatus of the present invention, and Fig. 6 shows the side of this device.
This adhesive tape joining apparatus is by being with supply unit 1, band pre-cutting mechanism 2, dance roller 3, adhesive tape recoverer 4, band paste section 5 and carrier band recoverer 6 etc. to form.Below, each structure is described in detail.
With supply unit 1, comprise for the spool of the stock roll TR that is wound with adhesive tape T is installed.Carry the adhesive tape T that supply unit 1 emits and by dance roller 3, be directed to the band transport path of regulation, via band pre-cutting mechanism 2, be supplied to band paste section 5.
In band pre-cutting mechanism 2, relatively dispose up and down synchronously driven cutting roller 7 and backing roll 8.As shown in Figure 7, cutting roller 7 is configured to the thin slice 10 that is formed with cutting edge 9 is installed on to driven roller.Cutting edge 9 forms by the relative straight line portion 11 of level and the ring-type that forms with one end of two straight line portioies 11 a pair of circular arc portion 12 connected with each other.
When this thin slice 10 is installed on to driven roller, two straight line portioies 11 of cutting edge 9 are relative in the parallel and approaching mode of the length direction along driven roller.
As shown in Figure 5 and Figure 6, with paste section 5 comprise for bonding strap ta being pasted on to first of ring frame f paste unit 15, for bonding strap ta is pasted on below semiconductor crystal wafer W(, referred to as " wafer ") second paste unit 16 and pasting work table 17 etc.
The carrier band ct that cutting edge parts 18 make to carry the complete adhesive tape T of hemisect that pre-cutting mechanism 2 transports turns back and release adhesive strap ta, and this carrier band ct is guided to carrier band recoverer 6.
Sticking roller 20 is practised physiognomy and is configured over the ground from the top ends of top and cutting edge parts 18.And Sticking roller 20 is configured to by driving cylinder 23 liftings.Therefore, for the top at cutting edge parts 18, from carrier band ct, peel off and forwards released and mobile bonding strap ta, Sticking roller 20 is pressed this bonding strap ta from the upper surface of this bonding strap ta, and this bonding strap ta is pasted on to the upper surface of the ring frame f remaining on pasting work table 17.In addition, by Sticking roller 20 and driving cylinder 23, form band labelling machine of the present invention.In addition, the first stickup unit 15 is equivalent to band labelling machine of the present invention.
The second stickup unit 16 comprises can carry out by driving cylinder the Sticking roller 24 of lifting.This second is pasted unit 16 and is configured to not hinder the mode of advance route of the first stickup unit 15 and the throughput direction of adhesive tape T to report to the leadship after accomplishing a task mutually to move back and forth.In addition, Sticking roller 24 is coated by elastomer.
As shown in Figure 6 and Figure 8, pasting work table 17 consists of movable table 25, ring frame maintaining part 26 and the wafer maintaining part 27 of drawer type.
Movable table 25 is configured to along the guide rail at two ends, left and right and flatly moves forwards, backwards.
Ring frame maintaining part 26 is configured to for adsorbing and keeps loading in the ring frame f of the maintenance face of ring-type or fixedly load in the ring frame f of the maintenance face of ring-type by fulcrum post location.
By dance roller 3 and guide reel of not marking Reference numeral etc., form the band of the present invention guide of advancing.
Adhesive tape joining apparatus of the present invention forms as described above.With reference to flow chart shown in Fig. 9 and Figure 10 to Figure 15 illustrate use this adhesive tape joining apparatus bonding strap ta is pasted on to ring frame f after, bonding strap ta is pasted on to the action of a circulation of wafer W.
From apparatus main body, the movable table of pasting work table 17 25 is pulled out, ring frame f is loaded and be held in ring frame maintaining part 26, wafer W is loaded and be held in wafer maintaining part 27.By movable table 25 return mechanism main bodys.Now, wafer maintaining part 27 is declined slightly, and be set to the apparent height of wafer W than the surface height (step S1) of ring frame f.Now, wafer W loads to carry on the back supine mode.In addition, the surface of wafer W is pasted with boundary belt P.
Make apparatus main body work, carry supply unit 1 and emit and supply with adhesive tape T(step S2).Adhesive tape T by cutting roller 7 and the process between backing roll 8 with pre-cutting mechanism 2 in, on carrier band ct adhesive tape T by driven and rotation cutting roller 7 continuously hemisect be bonding strap ta(step S3).
The complete adhesive tape T of hemisect is carried to adhesive tape recoverer 4 via dance roller 3.Adhesive tape recoverer 4 is by with feed rolls 13, the adhesive tape T ' not wanting cutting out after bonding strap ta being peeled off.Afterwards, adhesive tape T ' is batched in spool 14 and reclaims (step S4).
The adhesive tape T that only leaves bonding strap ta on carrier band ct is sent to band paste section 5.
As shown in figure 10, when the front end of bonding strap ta surpass the top of cutting edge parts 18 and arrive be positioned at top position of readiness Sticking roller 20 under time, as shown in figure 11, Sticking roller 20 declines, and by from cutting edge parts 18 forwards the fore-end of outstanding double-sided adhesive tape sheet ta press on the leading section surface of the ring frame f that the workbench 17 that is stuck keeps.Afterwards, as shown in figure 12, first pastes unit 15 and from carrier band ct, is stripped from one side and synchronously towards rearward position of readiness, moves with the forwards mobile translational speed forwards of bonding strap ta and the coiling speed of carrier band ct on one side.That is the bonding strap ta, being stripped from from carrier band ct is pasted on the surface (step S5) of ring frame f by Sticking roller 20.
Now, by dance roller 3, adjust band quantity delivereds, so that not to the adhesive tape T of the first stickup unit 15 gluts.
After having pasted bonding strap ta to ring frame f, the second stickup unit 16 paste position is forwards moved.After the second stickup unit 16 arrives assigned positions, as shown in figure 13, make Sticking roller 24 decline and move progressively towards the other end from one end of ring frame f.Now, as shown in figure 14, Sticking roller 24 on one side strain is pasted on bonding strap ta the back side (step S6) that approaches also relative wafer W with this bonding strap ta on one side.
Movable table 25 is pulled out from apparatus main body, as shown in figure 15, take out the wafer paster make by bonding strap ta (Japanese: ウ エ Ha マ ウ Application ト) MF reclaim (step S7).Above, complete the action that bonding strap ta is pasted on a circulation of ring frame f and wafer W, repeated same action afterwards until reach regulation sheet number (step S8).
Adopt above-described embodiment device, by the relative part hemisect in the front and back of the throughput direction at adhesive tape T of adhesive tape T, be linearity, therefore can on carrier band ct, across prescribed distance, form continuously the distance bonding strap ta shorter than the distance of Width of length direction.Therefore, compare and can obtain more bonding strap ta from stock roll TR with the bonding strap that is just cut into circle.In other words, can reduce the replacement frequency of stock roll TR, improve operating efficiency.And the distance of the adhesive tape T excising is shorter, thereby also can reduce the amount of discarding adhesive tape T between the bonding strap ta of front and back.
And the bonding strap ta that is positioned at the front and back position of throughput direction is formed by hemisect across prescribed distance, each other can be not bonding again thereby be positioned at the adhesive layer of the bonding strap ta of front and back position.Therefore, when from carrier band ct release adhesive strap ta, can avoid the bonding strap ta at adhesion rear and produce unnecessary peel stress, thereby produce fold.
In addition, the present invention can also implement by following mode.
(1) bonding strap ta is not limited to above-mentioned execution mode to the stickup at the back side of wafer W, for example, can be also following structure: only wafer W is contained in chamber, by depressurization, bonding strap ta is pasted on to the back side of wafer W.
As shown in Figure 16 and Figure 17, pasting work table 17 comprises that wafer keeps the wafer maintaining part 30 of use and the ring frame maintaining part 31 that ring frame keeps use, and, between wafer maintaining part 30 and ring frame maintaining part 31, thering is lower cover 34, lower cover 34 can be integrated and form chamber 32 with upper cover 33.
And the cylinder top of lower cover 34 has fillet, and be applied with the demoulding processing such as fluorine processing.
The chamber 32 consisting of upper and lower a pair of cover 33,34 has the little diameter of width of specific adhesion strap ta.Namely, by two covers 33,34, clamp the part of exposing between the periphery at wafer W of bonding strap ta and the internal diameter of ring frame f.
Next, according to flow chart shown in Figure 18, the action that utilizes this embodiment device that bonding strap ta is pasted on to a circulation of wafer W is described.
In addition, because until bonding strap ta is pasted on to the processing from step S11 to step S15 of ring frame f is identical with above-mentioned execution mode and description thereof is omitted, to different treatment step S16 to step S18, be about to the action that bonding strap ta is pasted on wafer W and describe.
Utilize action same as the previously described embodiments, after having completed, by the first stickup unit 15, bonding strap ta being pasted on to ring frame f, as shown in figure 19, upper cover 33 declines.Follow this decline, by the part that between upper cover 33 and the lower cover 34 clamping peripheries at wafer W of bonding strap ta and the internal diameter of ring frame f, bonding plane exposes, thereby form chamber 32(step S16).When now, bonding strap ta plays a role as encapsulant, upper cover 33 sides and lower cover 34 sides are separated and form two spaces.
The wafer W that is positioned at lower cover 34 is to have the mode at interval of regulation closely relative with bonding strap ta.
In the stream that upper cover 33 and lower cover 34 are connected with vacuum plant via electromagnetically operated valve, the switching of adjusting this electromagnetically operated valve by the imperial portion of not shown system is to reducing pressure in two covers 33,34.Namely, adjust the aperture of electromagnetically operated valve, make with identical speed, to reduce pressure in two covers 33,34.
To in two covers 33,34, be decompressed to after the air pressure of regulation, shut electromagnetic valve, and stop the work of vacuum plant.
The imperial portion of system makes it leak the air pressure that the air pressure in upper cover 33 is increased to lentamente to regulation while adjusting the aperture of electromagnetically operated valve.Now, it is lower than the air pressure in upper cover 33 that air pressure in lower cover 34 becomes, under the effect of this pressure differential, as shown in figure 20, bonding strap taZi Qi center starts to be pulled in lower cover 34, and the center that certainly approaches the wafer W of configuration is slowly pasted on wafer W(step S17 towards periphery).
In upper cover 33, reach after the air pressure of prior setting, the imperial portion of system adjusts the aperture of electromagnetically operated valve and makes the air pressure in lower cover 34 identical with the air pressure in upper cover 33.Correspondingly make wafer maintaining part 30 increase and make the surface of ring frame f and the upper surface of wafer W be positioned at equal height with this air pressure adjustment.Afterwards, as shown in figure 21, control part makes upper cover 33 rise and make upper cover 33 interior to atmosphere opening, and makes electromagnetically operated valve standard-sized sheet and make lower cover 34 sides also to atmosphere opening (step S18).
In the moment making upper cover 33 increase, complete and to the back side of wafer W, paste bonding strap ta.
After position of readiness above upper cover 33 turns back to, make wafer paster MF.Pull out pasting work table 17, output wafer paster MF(step S19).Above, complete the action that bonding strap ta is pasted on to a circulation of ring frame f and wafer W, afterwards, repeated same action until reach regulation sheet number (step S20).
(2) in above-described embodiment, as shown in figure 22, also can comprise have first of Sticking roller 24 paste unit 15 and vacuum chamber cell-type stickup unit the two, select arbitrarily to use.
(3) in above-mentioned variation device, also can be configured to and in chamber, configure heater, while heat the back side that bonding strap ta is pasted on wafer W.
(4), in above-mentioned variation device, also can be configured to chamber 32 and also ring frame f can be taken in together.
(5) in the various embodiments described above device, after hemisect is processed, in the way of delivering to paste section 5, peel off adhesive tape T ' not, but also can batch and reclaim together with carrier band ct at band 5 places, paste section.
(6) the bonding strap ta of the adhesive tape T of the various embodiments described above is the shape with the end limit e1 of a pair of linearity relative with the front and back position of length direction quadrature, but is not limited to this shape.For example, as shown in Figure 23 and Figure 24, be formed with the end limit e1A of a pair of rectilinear form parallel with the side end edge of carrier band.Also can be for the end limit e2A by circular-arc to be by the end limit e1 of the linearity in the direction all around of carrier band ct, the bonding strap alignment arrangements of the shape that each one end of e1A links up is on carrier band ct.
In addition, in the situation that in above-described embodiment device, hemisect is this bonding strap, on thin slice 10, be formed with the cutting edge 9 identical shaped with the bonding strap of this adhesive tape T.
Adopt this adhesive tape T, when matchingly the raw band of wide cut being cut along its length and manufacturing the roll coil of strip of a plurality of adhesive tapes with the width of adhesive tape T, in the situation that manufacture the roller of a plurality of adhesive tape T, compare with the adhesive tape T that is formed with circular-arc end limit on Width, can manufacture the more roll coil of strip.And, can the discarded amount on the Width of stock roll be adjusted into less.
The present invention can not depart from its thought or constitutionally is implemented in other concrete mode, therefore, and for the not above explanation of record of scope of the present invention is shown, and should be with reference to additional claims.
Claims (5)
1. an adhesive tape, this adhesive tape joining is in ring frame and semiconductor crystal wafer and couple together between by ring frame and semiconductor crystal wafer, wherein,
This adhesive tape comprises following structure:
By the bonding strap of multi-disc on the circular-arc end limit that there is the end limit of relative linearity and link up with this limit, two ends of linearity, so that the near and relative mode alignment arrangements of the end edge joint of their linearities is each other on the carrier band of strip.
2. an adhesive tape joining method, wherein,
This adhesive tape joining method be by adhesive tape joining claimed in claim 1 in the adhesive tape joining method of ring frame, said method comprises following process:
Emit process, the raw band that is fitted with the adhesive tape of strip on the carrier band of strip is emitted from the raw material roll coil of strip;
Cutting process, utilization has circular shape in the both sides of the Width of above-mentioned raw materials band and at the front and back position of length direction, has the cutting part of the ring-type of rectilinear form, on carrier band, above-mentioned adhesive tape hemisection is slit into adhesive tape sheet;
Taping process, make above-mentioned carrier band turn back and advance at cutting edge parts place, thereby when the self-contained band of above-mentioned bonding strap is peeled off, Yi Bian holding table and Sticking roller and peeling rate are synchronously relatively moved, Yi Bian bonding strap is pasted on to the ring frame on holding table.
3. adhesive tape joining method according to claim 2, wherein,
Above-mentioned cutting part is to have be connected with the rectilinear form cutting roller of cutting edge of the ring-type that forms of circular shape.
4. an adhesive tape joining apparatus, wherein,
This adhesive tape joining apparatus be by adhesive tape joining claimed in claim 1 in the adhesive tape joining apparatus of ring frame, said apparatus comprises following structure:
Band supply unit, it is for sending the raw band that is fitted with the adhesive tape of strip on the carrier band of strip from stock roll;
Be with the guide of advancing, it makes to advance along the band transport path of regulation from above-mentioned raw band of emitting with supply unit, and is guided to cutting edge parts;
Band pre-cutting mechanism, it utilizes the cutting part that has circular shape and have the ring-type of rectilinear form at the front and back position of length direction in the both sides that are disposed at the Width of the above-mentioned adhesive tape with transport path, on carrier band, adhesive tape hemisection is slit into adhesive tape sheet;
Cutting edge parts, it turns back and release adhesive strap above-mentioned carrier band;
Holding table, it is for keeping above-mentioned ring frame;
Band labelling machine, it makes synchronously to relatively move with band gait of march between above-mentioned holding table and Sticking roller on one side, with this Sticking roller, press the bonding strap that utilizes above-mentioned cutting edge parts and be stripped from from carrier band on one side, and be pasted on the ring frame on holding table;
Carrier band recoverer, it is for reclaiming the carrier band that has been stripped from above-mentioned bonding strap.
5. adhesive tape joining apparatus according to claim 4, wherein,
Above-mentioned cutting part is to have be connected with the rectilinear form cutting roller of cutting edge of the ring-type that forms of circular shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012153423A JP2014017357A (en) | 2012-07-09 | 2012-07-09 | Adhesive tape, pasting method of adhesive tape and pasting device of adhesive tape |
| JP2012-153423 | 2012-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103545168A true CN103545168A (en) | 2014-01-29 |
Family
ID=49968528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310284650.9A Pending CN103545168A (en) | 2012-07-09 | 2013-07-08 | Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014017357A (en) |
| KR (1) | KR20140007284A (en) |
| CN (1) | CN103545168A (en) |
| TW (1) | TWI614826B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI738049B (en) * | 2019-09-04 | 2021-09-01 | 志聖工業股份有限公司 | Film cutting device, film cutting method, wafer laminating method and wafer laminator |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6823921B2 (en) * | 2015-09-28 | 2021-02-03 | リンテック株式会社 | Sheet manufacturing equipment and manufacturing method, and sheet pasting equipment and sticking method |
| JP2019186268A (en) | 2018-04-03 | 2019-10-24 | 日東電工株式会社 | Adhesive tape peeling method and adhesive tape peeling device |
| JP2019186269A (en) | 2018-04-03 | 2019-10-24 | 日東電工株式会社 | Adhesive tape peeling method and adhesive tape peeling device |
| JP6790025B2 (en) | 2018-05-31 | 2020-11-25 | 古河電気工業株式会社 | Manufacturing method of electronic device processing tape and electronic device processing tape |
| JP2020107741A (en) | 2018-12-27 | 2020-07-09 | 日東電工株式会社 | Pasting method of sheet-like adhesive material and pasting device of sheet-like adhesive material |
| JP2020107740A (en) | 2018-12-27 | 2020-07-09 | 日東電工株式会社 | Cutting method for sheet-like adhesive material and cutting device for sheet-like adhesive material |
| JP2020107739A (en) | 2018-12-27 | 2020-07-09 | 日東電工株式会社 | Sheet-like adhesive material attaching method and sheet-like adhesive material attaching device |
| JP2020107738A (en) | 2018-12-27 | 2020-07-09 | 日東電工株式会社 | Sheet-like adhesive material attaching method and sheet-like adhesive material attaching device |
| JP6919911B2 (en) * | 2019-08-30 | 2021-08-18 | 株式会社サンテック | Pasting sheet supply device |
| JP2023003941A (en) | 2021-06-25 | 2023-01-17 | 古河電気工業株式会社 | Tape for processing electronic device and manufacturing method of tape for processing electronic device |
| JP2023003940A (en) | 2021-06-25 | 2023-01-17 | 古河電気工業株式会社 | Tape for processing electronic device and manufacturing method of tape for processing electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4306928A (en) * | 1979-01-04 | 1981-12-22 | Tokujiro Okui | Process for making adhesive tape |
| JPH04311443A (en) * | 1991-03-29 | 1992-11-04 | Kawasaki Steel Corp | Tape with adhesive sheet piece and peeling-off of adhesive sheet piece |
| CN1332471A (en) * | 2000-07-07 | 2002-01-23 | 三洋电机株式会社 | Method for manufacture of semiconductor device |
| JP2006073920A (en) * | 2004-09-06 | 2006-03-16 | Lintec Corp | Tape pasting equipment, mounting equipment, and mounting method |
| CN1771177A (en) * | 2003-04-09 | 2006-05-10 | 琳得科株式会社 | Method and device for sticking tape |
| JP4568374B1 (en) * | 2010-03-15 | 2010-10-27 | 大宮工業株式会社 | Pasting device and pasting method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4922140B2 (en) * | 2007-12-03 | 2012-04-25 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5534986B2 (en) * | 2010-07-09 | 2014-07-02 | 古河電気工業株式会社 | Wafer processing tape |
-
2012
- 2012-07-09 JP JP2012153423A patent/JP2014017357A/en active Pending
-
2013
- 2013-07-04 TW TW102123918A patent/TWI614826B/en not_active IP Right Cessation
- 2013-07-08 KR KR1020130079425A patent/KR20140007284A/en not_active Application Discontinuation
- 2013-07-08 CN CN201310284650.9A patent/CN103545168A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4306928A (en) * | 1979-01-04 | 1981-12-22 | Tokujiro Okui | Process for making adhesive tape |
| JPH04311443A (en) * | 1991-03-29 | 1992-11-04 | Kawasaki Steel Corp | Tape with adhesive sheet piece and peeling-off of adhesive sheet piece |
| CN1332471A (en) * | 2000-07-07 | 2002-01-23 | 三洋电机株式会社 | Method for manufacture of semiconductor device |
| CN1771177A (en) * | 2003-04-09 | 2006-05-10 | 琳得科株式会社 | Method and device for sticking tape |
| JP2006073920A (en) * | 2004-09-06 | 2006-03-16 | Lintec Corp | Tape pasting equipment, mounting equipment, and mounting method |
| JP4568374B1 (en) * | 2010-03-15 | 2010-10-27 | 大宮工業株式会社 | Pasting device and pasting method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI738049B (en) * | 2019-09-04 | 2021-09-01 | 志聖工業股份有限公司 | Film cutting device, film cutting method, wafer laminating method and wafer laminator |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201405694A (en) | 2014-02-01 |
| JP2014017357A (en) | 2014-01-30 |
| TWI614826B (en) | 2018-02-11 |
| KR20140007284A (en) | 2014-01-17 |
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