JPS6233580B2 - - Google Patents

Info

Publication number
JPS6233580B2
JPS6233580B2 JP18723580A JP18723580A JPS6233580B2 JP S6233580 B2 JPS6233580 B2 JP S6233580B2 JP 18723580 A JP18723580 A JP 18723580A JP 18723580 A JP18723580 A JP 18723580A JP S6233580 B2 JPS6233580 B2 JP S6233580B2
Authority
JP
Japan
Prior art keywords
pattern
mask
substrate
pitch
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18723580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57112753A (en
Inventor
Niwaji Majima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18723580A priority Critical patent/JPS57112753A/ja
Priority to EP81306134A priority patent/EP0055620B1/en
Priority to DE8181306134T priority patent/DE3173277D1/de
Priority to US06/333,814 priority patent/US4408875A/en
Publication of JPS57112753A publication Critical patent/JPS57112753A/ja
Publication of JPS6233580B2 publication Critical patent/JPS6233580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP18723580A 1980-12-29 1980-12-29 Exposure method Granted JPS57112753A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18723580A JPS57112753A (en) 1980-12-29 1980-12-29 Exposure method
EP81306134A EP0055620B1 (en) 1980-12-29 1981-12-24 Method of projecting circuit patterns
DE8181306134T DE3173277D1 (en) 1980-12-29 1981-12-24 Method of projecting circuit patterns
US06/333,814 US4408875A (en) 1980-12-29 1981-12-31 Method of projecting circuit patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18723580A JPS57112753A (en) 1980-12-29 1980-12-29 Exposure method

Publications (2)

Publication Number Publication Date
JPS57112753A JPS57112753A (en) 1982-07-13
JPS6233580B2 true JPS6233580B2 (ko) 1987-07-21

Family

ID=16202415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18723580A Granted JPS57112753A (en) 1980-12-29 1980-12-29 Exposure method

Country Status (1)

Country Link
JP (1) JPS57112753A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168250A (en) * 1981-04-10 1982-10-16 Fujitsu Ltd Exposing method
JPS62147728A (ja) * 1985-12-23 1987-07-01 Fujitsu Ltd 露光方法
JPS6355550A (ja) * 1986-08-26 1988-03-10 Mamiya Koki Kk プリント基板の分割投影露光方法
JPH03116714A (ja) * 1989-09-28 1991-05-17 Nec Ic Microcomput Syst Ltd 半導体集積回路素子の製造方法

Also Published As

Publication number Publication date
JPS57112753A (en) 1982-07-13

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