JPS62234685A - Cutting method for working material - Google Patents
Cutting method for working materialInfo
- Publication number
- JPS62234685A JPS62234685A JP61076359A JP7635986A JPS62234685A JP S62234685 A JPS62234685 A JP S62234685A JP 61076359 A JP61076359 A JP 61076359A JP 7635986 A JP7635986 A JP 7635986A JP S62234685 A JPS62234685 A JP S62234685A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- holes
- processing
- processed
- processing line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 27
- 239000008207 working material Substances 0.000 title abstract 2
- 239000000463 material Substances 0.000 claims abstract description 37
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はプリント基板等の加工材料を非接触で切断す
る切断方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting method for cutting processed materials such as printed circuit boards without contact.
第５図、第６図及び第７図は各々従来の加工材料の切断
方法を示す斜視図であり、第５図は機械的方法により制
勝として■溝加工が施された加工材料の一部全拡大して
示したものでアリ、第６図は■溝加工が施された加工材
料全体を、また第７図は■溝加工後に割断して分離した
加工材料を示すものである。図において、（１）はプリ
ント基板等の加工材料、（２）は機械加工により加工さ
れた■溝。Figures 5, 6, and 7 are perspective views showing conventional cutting methods for processed materials, and Figure 5 shows a part of the processed material that has been machined with grooves by a mechanical method. The enlarged views are shown in Fig. 6. ① shows the entire processed material that has been subjected to groove processing, and Fig. 7 shows ③ the processed material that has been cut and separated after groove processing. In the figure, (1) is a processed material such as a printed circuit board, and (2) is a groove processed by machining.
（４）はＶ溝（２）に沿って割断された割断面、（６）
は分離後のプリント基板である。(4) is a cut surface cut along the V groove (2), (6)
is the printed circuit board after separation.
従来、プリント基板を小さく分離する場合にはプリント
基板（１）の表面の分離割断すべき部分、即ち加工線に
沿って１機械的に■溝（２）全加工後、力を加えてＶ溝
（２）に治って割って必要な寸法にプリント基板を切断
していた。Conventionally, when separating printed circuit boards into small pieces, mechanically cut the parts of the surface of the printed circuit board (1) to be separated and cut, that is, along the processing line, into the V-groove (2) by applying force. (2) After it had healed, I broke it and cut the printed circuit board to the required dimensions.
従来の加工方法は以上のように、■溝をカンタなどを用
いて機械的に加工していた。しかしながら例えばプリン
ト基板の材質はガラス繊維強化エポキシ樹脂積層板が多
く、ガラス繊維のため、カンタの刃など工具の消耗がは
げしく、かつ切り（ず、粉塵が発生するため作業性が悪
いという問題点があった。In the conventional processing method, as described above, (1) the groove was mechanically processed using a canter or the like. However, for example, many printed circuit boards are made of glass fiber-reinforced epoxy resin laminates, and because of the glass fibers, tools such as canter blades are subject to rapid wear and tear, and the workability is poor due to the generation of dust. there were.
また、このような従来の方法では複雑な形状の外形加工
はできないという問題があり、複雑な形状の加工にはプ
レスによる打ち抜き加工が行なわれているが部品の実装
後など後工程では加工できないといった問題点があった
。In addition, there is a problem that conventional methods cannot process the external shape of complex shapes, and although punching with a press is used to process complex shapes, it cannot be processed in subsequent processes such as after mounting the parts. There was a problem.
この発明は上記のような問題点を解消するためになされ
たもので、非接触で加工することにより工具の消耗の問
題がな（、切り（ずなどが発生せず、かつ部品の実装後
など後工程で加工できる加工材料の切断方法を提供する
こと全目的とする。This invention was made to solve the above-mentioned problems. By performing non-contact machining, there is no problem of tool wear (no chips, etc.), and there is no problem with parts being mounted. The overall purpose is to provide a method for cutting processed materials that can be processed in subsequent processes.
この発明に係る加工材料の切断方法は、パルス状の高密
度エネルギービームを用い、加工線に沿って穴の中心が
移動していくように複数個の穴を加工線上に形成する工
程、及びこの工程を繰り返し、前工程で形成された穴か
らずれた加工線上の位置に複数個の水金形成して加工材
料を切断する工程を施すものである。The method for cutting a processed material according to the present invention includes the steps of forming a plurality of holes on a processing line using a pulsed high-density energy beam so that the center of the hole moves along the processing line; The process is repeated to form a plurality of water metals at positions on the machining line that are shifted from the holes formed in the previous process, and to cut the work material.
この発明における加工材料の切断方法はパルス状の高密
度エネルギービームにより、−パルスで一穴づつ穴を明
け、パルス周波数、及び加工材料とビームとの相対的移
動速度を調節してミシン目状の穴加工を行い、これを複
数回繰り返し行うことにより前工程で形成された穴から
ずれた加工線上の位置に水金形成し加工材料を切断する
。The cutting method of the material to be processed in this invention uses a pulsed high-density energy beam to make holes one by one in pulses, and by adjusting the pulse frequency and the relative movement speed between the material to be processed and the beam, perforations are made. Hole machining is performed, and by repeating this process multiple times, water metal is formed at a position on the machining line that is offset from the hole formed in the previous step, and the workpiece material is cut.
加工林料への高密度エネルギービームの照射は非連続的
であるので加工部及び加工部周辺の温度上昇が抑制でき
、はとんど変質しない、高品質の切断を行う。Since the irradiation of the high-density energy beam to the processed forest material is discontinuous, the temperature rise in and around the processed area can be suppressed, resulting in high-quality cutting with almost no deterioration.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図（ａ）（ｂ）及び（Ｃ）は各々この発明の一実施
例による加工材料の切断方法を工程順に示す加工材料の
部分斜視図であり、第１図（ａ）はレーザビームを１回
服射したもの、第１図（ｂ）は２回、及び第１図（Ｃ）
は３回照射したものである。第２図はこの発明の一実施
例による加工材料の切断方法により切断された加工材料
を示す斜視図、並びに第３図はこの発明の一実施例に係
るレーザ加工装置を示す斜視図である。FIGS. 1(a), 1(b), and 1(C) are partial perspective views of a processed material showing step-by-step a method of cutting a processed material according to an embodiment of the present invention, and FIG. 1(a) is a partial perspective view of a processed material in which a laser beam Figure 1 (b) was administered once, Figure 1 (b) was administered twice, and Figure 1 (C)
was irradiated three times. FIG. 2 is a perspective view showing a workpiece cut by a workpiece cutting method according to an embodiment of the present invention, and FIG. 3 is a perspective view showing a laser processing apparatus according to an embodiment of the present invention.
図においＣ，００１はパルスＣＯ２レーザ発振Ｎ、 ａ
Ｄはパルス状のレーザビーム、α２はレーザビームａＤ
を反射し折り曲げるペンドミラー、０■はレーザビーム
０１）ヲプリント基板（１）の表面に集光する集光レン
ズ、０４１は集光されたレーザビームと同軸状にアシス
トガスヲ噴射するノズル、 Ｑ５１はノズル側へのアシ
ストガスの入口である。捷た（１６１はプリント基板を
移動させる加工テーブル、ａＤは加工テーブル駆動モー
タである。In the figure, C,001 is pulsed CO2 laser oscillation N,a
D is a pulsed laser beam, α2 is a laser beam aD
0■ is a condensing lens that focuses the laser beam 01) on the surface of the printed circuit board (1), 041 is a nozzle that injects assist gas coaxially with the focused laser beam, and Q51 is a nozzle. This is the assist gas inlet to the side. (161 is a processing table for moving the printed circuit board, and aD is a processing table drive motor.
レーザ発振器Ｑｌより取り出したレーザビームａＤは、
ペンドミラー０２で折り曲げられ、集光レンズ０３）に
よってプリント基板（１）の加工線上に集光する。The laser beam aD taken out from the laser oscillator Ql is
The light is bent by a pend mirror 02 and focused onto the processing line of the printed circuit board (1) by a condenser lens 03).
プリント基板（１）’！ｒ加工テーブル（１６１：ｃよ
り移動させることによって、所望のパターンの加工がで
きる。Printed circuit board (1)'! By moving from the r processing table (161:c), the desired pattern can be processed.
この場合レーザビーム［＋１＋が連続出力のビームであ
ると、プリント基板（１）は加熱しすぎて切断面は黒く
なり品質のよいものが得られない。In this case, if the laser beam [+1+ is a continuous output beam, the printed circuit board (1) will be heated too much and the cut surface will become black, making it impossible to obtain a high quality product.
なお一般的なレーザ切断に関しては溶接学会誌第４３巻
（＋９７４）第８号、Ｐ８２〜８９に示されている。Note that general laser cutting is described in Journal of the Welding Society, Vol. 43 (+974), No. 8, pages 82-89.
そこでレーザビーム１１１−第４図に示すようにパルス
化し、パルスの周波舷とプリント基板の移動速度やレー
ザ出力を適当に選ぶことによって第１図（８）に示すよ
うなミシン目状の穴加工、即ち加工線に沿って穴の中心
が移動していくような複数個の穴（３）が加工線上に形
成される。Therefore, the laser beam 111 is pulsed as shown in Figure 4, and by appropriately selecting the pulse frequency range, the moving speed of the printed circuit board, and the laser output, a perforation-like hole is machined as shown in Figure 1 (8). That is, a plurality of holes (3) are formed on the processing line such that the center of the hole moves along the processing line.
第４図はこの発明の一実施例に係るレーザビームのパル
ス波形を示す特性図であり、Ｉｌｆ：Ｉ力は加工材料の
厚さによって変わるが、この場合＋＋ｍｍの厚さのプリ
ント基板に対して５００Ｗのレーザ出力のものが用いら
れている。FIG. 4 is a characteristic diagram showing the pulse waveform of a laser beam according to an embodiment of the present invention, and the Ilf:I force changes depending on the thickness of the processed material, but in this case, for a printed circuit board with a thickness of ++ mm. A laser with a laser output of 500 W is used.
これにより、−パルスで一つの穴（３）が明き９表面側
（レーザビーム照射面側）の穴の径全ｄ（ｍｍφ）パル
ス周波数＜ ｆ （Ｈｚ ） 、プリント基板の移動速
度をＶ（罷／ ｓｅりとすると
ｖ＝ｄ＊ｆ
の時に、プリント基板表面で穴と穴が接するようになる
。As a result, one hole (3) is opened by the − pulse, the total diameter of the hole on the surface side (laser beam irradiation surface side) is d (mmφ), the pulse frequency is < f (Hz), and the moving speed of the printed circuit board is reduced to V ( In the case of scratches/se, when v=d*f, the holes come into contact with each other on the surface of the printed circuit board.
ｖ）ｄ＠ｆ の時には、穴と穴とに間隔があき、たとえば。v) d@f When , there is a gap between the holes, for example.
ｖ ＝ ２・ｄ−ｆのときには、第１図＋８）に示すよ
うに穴と穴との間に穴の径と同程度の間隔があく。When v = 2.d-f, as shown in Fig. 1+8), there is a gap between the holes that is approximately the same as the diameter of the holes.
さらに同一加工線上を繰り返し加工することにより、第
１図（ｂ）及び（Ｃ）に示すように前工程で形成された
穴からずれた加工線上の位置に複数個の穴を形成し、３
回から５回繰り返すことにより切断ができる。Furthermore, by repeatedly machining the same machining line, a plurality of holes are formed at positions on the machining line that are shifted from the holes formed in the previous process, as shown in FIGS. 1(b) and (C).
Cutting can be done by repeating this 5 times.
ｖ）ｄ−ｆとして、穴と穴とが重ならないようにすれば
、−パルスごとに独立して加工が行なわれ、前に加工さ
れた穴によって熱などの影響をうけることはない。また
、２回、３回と繰り返して加工する場合には、すでに冷
却され前回までに加えた熱の影響をうけることはない。v) As df, if the holes do not overlap, - machining is performed independently for each pulse, and the previously machined holes will not be affected by heat or the like. Furthermore, when processing is repeated two or three times, the material has already been cooled and is not affected by the heat applied previously.
ｖ）ｄ、−ｆであればどのような条件でもよいが。v) Any conditions may be used as long as d and -f.
実用的には １≦ ≦３ ｄ ＠ ｆ の範囲が適当であり □た １ Ｉｌ ｆ の場合で２回 □た ２ ｄ、ｆ の場合で３〜５回で切断できる。Practically speaking 1≦ ≦3 d ＠ f The range of □Ta 1 Il f twice in the case of □Ta 2 d, f In this case, it can be cut in 3 to 5 times.
τ賃少３の場合は加工回数がふえ９時間がかかるのであ
まり実用的でない。また四コく１だと前述のように加工
材料の加熱による炭化がはげしく品質が悪（なると共に
、絶縁疲労等の問題も生じる。When τ is 3, the number of processing increases and it takes 9 hours, so it is not very practical. Furthermore, if the material is 4 x 1, as mentioned above, the processed material will undergo severe carbonization due to heating, resulting in poor quality (and problems such as insulation fatigue).
以上のように複数回にわけて切断することにより。By cutting multiple times as described above.
１回で切断する場合と比べて、大幅に品質が向上し、は
とんど変質しない切断ができる。またノズルＱ４１から
レーザビームと同軸状にアシストガスを噴射することに
よって、プリント基板表面への炭化物の付着を防止し、
集光レンズ任鶏の汚染を防止することができるだけでな
（、ガスによる冷却効果により、より一層高品質化を図
ることができる。Compared to cutting in one go, the quality is significantly improved and the cutting can be done with almost no deterioration. In addition, by injecting assist gas coaxially with the laser beam from nozzle Q41, it is possible to prevent carbide from adhering to the printed circuit board surface.
Not only can condensation of the condensing lens be prevented (but also the cooling effect of the gas makes it possible to achieve even higher quality).
アシストガスとしては圧縮空気が適当であるが。Compressed air is suitable as the assist gas.
窒素ガス、酸素ガス、アルゴンガスなど他のガスであっ
てもよい。またアシストガスは必ずしもレーザビームと
同軸状に噴射する必要はな（、サイドから吹き付け、′
、ようにしてもよい。Other gases such as nitrogen gas, oxygen gas, and argon gas may also be used. Also, the assist gas does not necessarily need to be injected coaxially with the laser beam (injecting it from the side,
, it may be done as follows.
さらに、加工材料はプリント基板の他、繊維強化樹脂板
などの複合材料であってもよい。Furthermore, the processing material may be a composite material such as a fiber-reinforced resin board in addition to a printed circuit board.
また、上記実施例においては、プリント基板を移動させ
る場合について説明しγこが、レーザビームを移動する
ようにしても同様の効果が得られる。Further, in the above embodiment, the case where the printed circuit board is moved is explained, but the same effect can be obtained even if the laser beam is moved.
ま１こ、レーザビームのかわりに電子ビームを用いても
同様の加工が可能である。However, similar processing can be performed using an electron beam instead of a laser beam.
以上のように、この発明によればパルス状の高密度エネ
ルギービームを用い、加工組に沿って穴の中心が移動し
ていくように複数個の穴を上記加工線上に形成する工程
、及び上記工程金繰り返し。As described above, according to the present invention, there is a step of forming a plurality of holes on the processing line using a pulsed high-density energy beam so that the centers of the holes move along the processing set, and Repeated process costs.
前工程で形成され１こ穴からずれた上記加工線上の位置
に複数個の大全形成して加工材料を切断する工程を施し
て加工材料を功科するようにしたので。This is because a plurality of holes are formed at positions on the processing line that are shifted from the single hole formed in the previous process, and a process of cutting the processing material is performed to improve the processing material.
非接触で作業性よ＜、シかも高品質な切断ができるとい
う効果がある。また部品実装後などの後工程でも切断加
工ができるので生産効率が向上するという効果がある。It has the effect of being able to perform contactless work and high-quality cutting. Furthermore, since cutting can be performed in post-processes such as after component mounting, production efficiency is improved.
第１図（ａ）（ｂ）及び（Ｃ１は各々この発明の一実施
例による加工林料の切断方法を工程順に示す加工材料の
斜視図、第２図はこの発明の一実施例による加工材料の
切断方法により切断された加工材料を示す斜視図、第３
図はこの発明の一実施例に係るレーザ加工装置を示す斜
視図、第４図はこの発明の一実施例に係るレーザビーム
のパルス波形を示す特性図、並びに第５図、第６図及び
第１図は各々従来の加工材料の切断方法を示す斜視図で
ある。
（１）は加工材料、（３）は穴、（５）は切断面、 Ｑ
ｌはレーザ発振器、α１ｊはレーザビーム、ａ４）はノ
ズルなお１図中、同一符号は同−又は相当部分を示す。Figures 1 (a), (b) and (C1) are perspective views of a processed material showing a method for cutting processed forest materials in order of steps according to an embodiment of the present invention, and Figure 2 is a perspective view of a processed material according to an embodiment of the present invention. A third perspective view showing the processed material cut by the cutting method.
FIG. 4 is a perspective view showing a laser processing apparatus according to an embodiment of the present invention, FIG. 4 is a characteristic diagram showing a pulse waveform of a laser beam according to an embodiment of the invention, and FIGS. FIG. 1 is a perspective view showing a conventional method of cutting a processed material. (1) is the processed material, (3) is the hole, (5) is the cut surface, Q
1 is a laser oscillator, α1j is a laser beam, and a4) is a nozzle. In FIG. 1, the same reference numerals indicate the same or corresponding parts.
Claims (5)
線に沿つて穴の中心が移動していくように複数個の穴を
上記加工線上に形成する工程、及び上記工程を繰り返し
、前工程で形成された穴からずれた上記加工線上の位置
に複数個の穴を形成して加工材料を切断する工程を施す
加工材料の切断方法。(1) Using a pulsed high-density energy beam, form multiple holes on the processing line so that the center of the hole moves along the processing line, and repeating the above steps, A method for cutting a material to be processed, which includes the step of cutting the material by forming a plurality of holes at positions on the processing line that are offset from the holes that have been formed.
穴の径をｄ、パルス周波数をｆとした時、上記ｖ、ｄ、
ｆは次の関係を満たす特許請求の範囲第１項記載の加工
材料の切断方法。 １≦ｖ／ｄ・ｆ≦３(2) The relative moving speed of the high-density energy beam is v,
When the hole diameter is d and the pulse frequency is f, the above v, d,
The method for cutting a processed material according to claim 1, wherein f satisfies the following relationship. 1≦v/d・f≦3
許請求の範囲の第１項又は第２項記載の加工材料の切断
方法。(3) The method for cutting a processed material according to claim 1 or 2, wherein the high-density energy beam is a laser beam.
スを吹きつける特許請求の範囲第３項記載の加工材料の
切断方法。(4) The method for cutting a processed material according to claim 3, wherein an assist gas is blown onto the processed portion at the same time as the laser beam is irradiated.
請求の範囲第１項又は第２項記載の加工材料の切断方法
。(5) The method for cutting a processed material according to claim 1 or 2, wherein the high-density energy beam is an electron beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61076359A JPS62234685A (en) | 1986-04-02 | 1986-04-02 | Cutting method for working material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61076359A JPS62234685A (en) | 1986-04-02 | 1986-04-02 | Cutting method for working material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62234685A true JPS62234685A (en) | 1987-10-14 |
Family
ID=13603161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61076359A Pending JPS62234685A (en) | 1986-04-02 | 1986-04-02 | Cutting method for working material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62234685A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348839A (en) * | 1986-08-19 | 1988-03-01 | Nikon Corp | Laser machining apparatus |
| JP2004528991A (en) * | 2001-06-08 | 2004-09-24 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | Partial processing by laser |
| WO2010073640A1 (en) * | 2008-12-26 | 2010-07-01 | Ｔｏｗａ株式会社 | Cleaving device and cleaving method for manufacturing electronic components |
| JP2011177781A (en) * | 2010-03-04 | 2011-09-15 | Mitsubishi Materials Corp | Laser beam machining apparatus and laser beam machining method |
| JP2012192420A (en) * | 2011-03-15 | 2012-10-11 | Saishin Laser Gijutsu Kenkyu Center:Kk | Laser processing method and laser processing apparatus |
| TWI566291B (en) * | 2014-09-04 | 2017-01-11 | Towa Corp | A cutting device, an adsorption mechanism and a device having an adsorption mechanism |
| CN110340520A (en) * | 2019-06-27 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of pulse dislocation laser processing, device and system |
-
1986
- 1986-04-02 JP JP61076359A patent/JPS62234685A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348839A (en) * | 1986-08-19 | 1988-03-01 | Nikon Corp | Laser machining apparatus |
| JP2004528991A (en) * | 2001-06-08 | 2004-09-24 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | Partial processing by laser |
| WO2010073640A1 (en) * | 2008-12-26 | 2010-07-01 | Ｔｏｗａ株式会社 | Cleaving device and cleaving method for manufacturing electronic components |
| JP2010149165A (en) * | 2008-12-26 | 2010-07-08 | Towa Corp | Cutting apparatus for manufacturing electronic component and cutting method |
| CN102256739A (en) * | 2008-12-26 | 2011-11-23 | 东和株式会社 | Cleaving device and cleaving method for manufacturing electronic components |
| JP2011177781A (en) * | 2010-03-04 | 2011-09-15 | Mitsubishi Materials Corp | Laser beam machining apparatus and laser beam machining method |
| CN102189345A (en) * | 2010-03-04 | 2011-09-21 | 三菱综合材料株式会社 | Laser processing device and laser processing method |
| JP2012192420A (en) * | 2011-03-15 | 2012-10-11 | Saishin Laser Gijutsu Kenkyu Center:Kk | Laser processing method and laser processing apparatus |
| TWI566291B (en) * | 2014-09-04 | 2017-01-11 | Towa Corp | A cutting device, an adsorption mechanism and a device having an adsorption mechanism |
| CN110340520A (en) * | 2019-06-27 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of pulse dislocation laser processing, device and system |
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