CN105171251A - Laser punching process - Google Patents
Laser punching process Download PDFInfo
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- CN105171251A CN105171251A CN201510677750.7A CN201510677750A CN105171251A CN 105171251 A CN105171251 A CN 105171251A CN 201510677750 A CN201510677750 A CN 201510677750A CN 105171251 A CN105171251 A CN 105171251A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser punching process. According to the laser punching process, laser beams emitted by a laser and are focused on workpieces to be processed by a lens; the laser punching is implemented by controlling the relative motion manners of the workpieces to be processed and the laser. The laser punching process comprises the following steps: analyzing the properties of the materials of the workpieces to be processed, selecting appropriate laser parameters, determining relative motion manners of the laser and the workpieces to be processed, punching via laser and checking, wherein the materials of the workpieces to be processed are aluminum alloys, copper, iron or polycrystalline silicon wafers; the laser energy is 5-30J; the defocusing distance is 0.5-2mm; the pulse frequency is 5-30kHz; the pulse width is 22-50nm; the laser scanning speed is 5-30mm/s; the protective gas flow is 4-5L/min; the punching depth is 0.5-5mm. The laser punching process is applicable to a plurality of materials such as aluminum alloys and copper; the high-quality drilling can be implemented by just selecting the appropriate laser parameters; holes with high depth-diameter ratio can be obtained; the high-efficiency processing can be implemented.
Description
Technical field
The present invention relates to laser boring technique.
Background technology
In recent years, along with developing rapidly of science and technology, traditional processing method can not be satisfied the demand.The such as micropore in processing micron magnitude aperture on refractory metal molybdenum plate; Hard tungsten carbide platform gold processes the aperture that diameter is tens microns: the deep hole etc. processing hundreds of micron diameter on hard and crisp red, sapphire is impossible with the machining process of routine.
Laser beam asks the photon a fluid stream with high concentration on the time at sky.Application Optics focusing technology converge in it in the very low range of micron dimension so long, thus can obtain high illumination power density.This be other any light source institute can not and.Under so high optical power density is irradiated, almost can carry out laser boring to any material.Laser boring has does not need that machining tool, process velocity are fast, areal deformation is little, can process the significant superiority such as various materials, so paid attention to widely at engineering field.Along with the development of MEMS (MEMS), the requirement of people to minute aperture process technology is more and more higher.The advantage that laser has tradition processing incomparable with other special process in the microfabrication of material, the heat effect district of laser boring is little, machining accuracy is higher, has versatility widely. and therefore laser fine hole machined is widely used in the capillary processing of the parts such as aeroturbine blade, nozzle in Aerospace Engineering specialty.Cutting and the punching of the crisp and hard materials such as pottery, composite are one of current primary study directions.
In the process of laser boring, by the restriction of many kinds of parameters and hole knockout, comprise laser parameter, material parameter, environment, hole knockout etc. around.The process of processing is very complicated.Therefore in the research of Laser Processing, except needing to carry out except deep theoretical research, also need to carry out a large amount of manufacturability experimental studies, thus grasp the rule of Laser Processing.
Laser boring has the developing history of 35 years, applies widely and among various field of machining, especially adopts the eighties laser pulse of Q-regulating method generation high-peak power narrow spaces to get mesopore.Start the nineties to adopt acousto-optic Q modulation pulse ND:YAG laser instrument to produce the laser boring of high-peak power, narrow spaces, high-repetition-rate, due to good beam quality, so the reproducible continuous progress corresponding to cheesing techniques of workpiece punching, the equipment of punching also constantly improves.In recent years, domestic and international laser-beam drilling machine complete machine level is in a stage developed rapidly, and laser output power improves gradually, and pulse width is more and more narrow, and frequency range is more and more wider, and other parameters are also more and more towards the future development being conducive to punching.The flexibility of the control section of light-conducting system and laser-beam drilling machine improves constantly, and punching scope is constantly expanded.The domestic laser-beam drilling machine having formed commodity has tens kinds, except universities and colleges and scientific research institutions, deals exclusively in the company manufacturing laser equipment and also increases gradually.This shows that the Laser Processing of China is just towards industrialization future development.A difficult problem.Domestic in May nineteen sixty-five laser-beam drilling machine be successfully used to wire drawing die punching produce, obtain distinct economic.1970, domestic Ji Jia great wrist watch plant used ruby laser and neodymium glass laser to punch to wrist-watch jewel bearing.The application of laser boring more ripe is at present in artificial meeting hard rock and the production of natural meeting hard rock wire drawing die and the production of Watch Gem bearing.Changchun Institute of Ray Machine completed the smokeless punching of cork paper high-speed perforating machine diesel injector, the punching of brewery's stainless steel filter disc in 86 years.Jilin University of Science and Technology develops ultrasonic laser pulse punching the end of the eighties, and Beijing 625 pulse laser used punches to blade.
Scientific research personnel's laser of China in 1993 gets the profound and subtle hole that aperture is 0.01-0.6mm on the thick carbide alloy of 8mm; And as also suitable success that rhinestone, pottery, glass, human teeth punch in multiple nonmetallic materials, minimum-value aperture can reach 6 friends, the degree of depth >=l0mm, and also the circularity in hole is also more satisfactory.
Foreign Laser punching is mainly used in the industries such as Aero-Space, automobile making, electronic instrument, chemical industry.Developing rapidly of laser boring, the average output power being mainly reflected in punching YAG laser has brought up to 800w to 1000w by the 400w before 5 years.Punching peak power is up to 30-50kw, and the pulse width of punching is more and more narrow, and repetition rate is more and more higher, and the raising of laser output parameters, improves drilling quality to a great extent, improves trepanning velocity, have also been enlarged the range of application of punching.Corresponding to the continuous progress of cheesing techniques, the equipment of punching also constantly improves.In recent years, Foreign Laser puncher complete machine level is in a stage developed rapidly, and laser output power improves gradually, and pulse width is more and more narrow, and frequency range is more and more wider, and other parameters are also more and more towards the future development being conducive to punching.The flexibility of the control section of light-conducting system and laser-beam drilling machine improves constantly, and punching scope is constantly expanded.
Along with developing by leaps and bounds of science and technology, in field of machining, be with foraminate part material to get more and more, and to the precision in hole and dimensional requirement more and more higher, aperture is more and more less.Meanwhile, the material of workpiece is varied, and existing metal also has nonmetal, also has many difficult to machine materials.Foreign Laser machining tool is very rapid in the development eighties.Such as, the kind of laser process machine is only 1981 4 kinds, and just increases 19 kinds by 1985, and the sales volume of laser process machine in 1980 is only 11.7 times of 1970, and nineteen eighty-two just surges to 20.7 times of 1970 years.1984, the U.S. had 6000 laser process machines.The sales volume of lathe, every average annual growth rate 20%, this is rare in machine tool industry history.
The middle and later periods of the eighties, dark for Laser Processing micro-aperture technique is applied to the industries such as aircraft industry on a large scale with the U.S., Germany for the country of the industry prosperity of representative.Such as, engine shop of the U.S. in 1984 utilizes laser drilling device to carry out tens thousand of Cooling Holes processing to propeller for turboprop machine part; A company of Britain in 1985 with high-power laser beam controllable precise from hole, the stainless steel and titanium plate of 0.05 inch process the aperture 350,000 that aperture is 0.025 inch; Nineteen eighty-two external certain company in the lining cutting of turbocompressor combustion section office, process diameter be 1.17, the aperture more than 9000 that 1.25m is little, and most aperture becomes 25 jiaos to surface of the work, fuel chambers lining cutting is made up of the resistant to elevated temperatures nickel-base alloy block of the rectangle that 2.36mm is thick, and difficulty of processing is large; 1986 Kiev engineering college of Nian Yuan Soviet Union industrial laser centerings on hard alloy blank, aperture is 1.0mm, and the degree of depth is 6mm.
The nineties, Foreign Laser processing machine production technology is with becoming perfect, and laser boring is towards the future development diversified, high-speed, aperture is more small.Various countries start to adopt acousto-optic Q modulation Pulse Nd: YAG laser produce high-peak power, narrow spaces, high-frequency laser boring, due to good beam quality, workpiece punching reproducible, widely application with various field of machining among.Be concerned with company, Ge Lumen company, BOC Co. of the U.S., the Industry Co., Ltd etc. of Japan of Hughes Electronics of the U.S. all releases the laser-beam drilling machine product of 5-30J.A company of Denmark works out high-speed perforating technology, the stainless steel material that 3mm is thick punches with the speed of 65 holes/second, and high-quality hole is got with the speed of 100 holes/second on the thick stainless steel of 1mm, the hole of the same quantity in the past needing just can get for 5 days can be processed in 1 hour with the speed of super like this punching.The silicon nitride plate that Japan grinds at thick l is got the hole of aperture 0.2mm, the ceramic membrane of 0.05ram processes the hole in aperture 0.02; And on the difficult to machine materials such as titanium, platinum, tungsten, molybdenum, also carried out a company of effective Laser Processing Denmark work out high-speed perforating technology, the stainless steel material that 3mm is thick punches with the speed of 65 holes/second, and high-quality hole is got with the speed of 100 holes/second on the stainless steel of 1mn./thick, the hole of the same quantity in the past needing just can get for 5 days can be processed in 1 hour with the speed of super like this punching.The hole of aperture 0.2mm is got on the silicon nitride plate of thick 1mm by Japan, the ceramic membrane of 0.05m processes the hole of aperture 0.02mm, and also carried out effective Laser Processing on unmanageable materials such as titanium, platinum, tungsten, molybdenum.
Industrially developed country all using laser processing technology as enhancing productivity and one of the means of competitiveness, wishing can at the early 21st century entering the light technology heyday, be in rank first in light technical field, therefore drop into a large amount of man power and materials and launch keen competition.Germany's great amount of investment, in the production line of commercialization laser machine, has 650 business research and application laser processing technology at present, will increase to 3000 by 2000.It is predicted, the output value of Japanese laser process machine was 178 times of 1980 by 2000.At present, Japan oneself enter universal epoch of laser processing technology.In the U.S., what laser processing technology application was maximum is Aeronautics and Astronautics, electronics, automobile and other industries, and the company more than 3000 being directly or indirectly engaged in aerospace industry all have employed laser NT technology.
Laser beam is high concentration on room and time, utilizes lens focus, spot diameter can be narrowed down to micron thus every square centimeter can obtain very high laser power density.So high power density almost can carry out laser boring to any material, and with other method as compared with the punching such as machine drilling, spark machined means, has following significant advantage:
1, laser boring speed is fast, and efficiency is high, good in economic efficiency.High-effect laser instrument is coordinated with high-precision lathe and control system, carries out programme-control by microprocessor, high efficiency punching can be realized.On different workpieces, laser boring is compared with electric spark-erosion perforation and machine drilling, and efficiency improves 10 ~ 1000 times.In addition, laser drilling process does not contact with workpiece, eliminates the trouble of the operation such as Drill Crack, wearing and tearing, replacing cutter that general machining method causes.
2. laser boring can obtain large aspect ratio.Generally, the aspect ratio value that machine drilling and electric spark-erosion perforation obtain is no more than 10.Nei Guang hurdle, chamber is set up in use, increases the method for Q-switch or adjustment light-conducting system parameter, when changing punching beam quality, is easy to the aperture obtaining high-quality, large aspect ratio.Such as: on carbon steel, by adjusting light-conducting system parameter, can process degree of depth 16.2nm, the aperture of aperture 0.25nm, its aspect ratio can reach 65:1.
3. laser boring can be carried out in the various types of materials such as hard, crisp, soft.High energy laser beam punching does not limit by mechanical performances such as the hardness of material, rigidity, intensity and fragility, it was both suitable for metal material, also can be used for general unmanageable nonmetallic materials, as ruby, sapphire, pottery, diamond and natural diamond etc.Due to difficult-to-machine material mostly there is high strength, lower thermal conductivity, the feature such as processing is easily hardened, chemical affinity is strong, therefore in machining, resistance is large, temperature is high, life tools are short.And punch on these difficult-to-machine materials with laser, above problem will be resolved.
4. laser boring is without tool loss.Laser boring is contactless processing, easily broken drill bit when avoiding power auger micropore, the problem that percent defective is high.
5. laser boring is suitable for many, the highdensity group's hole machined of quantity.Because laser-beam drilling machine can coordinate with automatic control system and microcomputer, realize light, mechanical, electrical integration, make laser drilling process repeat thousands of times like clockwork.Small-bore can be processed continuously, efficiently by programme-control, quantity is large, density is high group's orifice plate.
Summary of the invention
The object of the invention is to propose a kind of laser boring technique.
For reaching this object, the present invention by the following technical solutions:
A kind of laser boring technique, the light beam that laser instrument sends is after two pieces of total reflective mirrors, by lens focus on workpiece to be processed, by controlling the relative motion form of workpiece to be processed and laser instrument, realize laser boring, comprising: the material character analyzing workpiece to be processed---is selected suitable laser parameter and---determined relative motion form---laser boring---inspection of laser instrument and workpiece to be processed.The material of workpiece to be processed is aluminium alloy, copper, iron or polysilicon chip.Energy of lasers 5J---30J, defocusing amount is-0.5mm----2mm, and pulse frequency is 5kHz---30kHz; pulsewidth is 22nm---50nm; laser scanning speed is 5mm/s---30mm/s, and shield gas flow rate is 4L/min---5L/min, and the punching degree of depth is 0.5mm---5mm.
Detailed description of the invention
Embodiment 1
A kind of laser boring technique, the light beam that laser instrument sends is after two pieces of total reflective mirrors, by lens focus on workpiece to be processed, by controlling the relative motion form of workpiece to be processed and laser instrument, realize laser boring, comprising: the material character analyzing workpiece to be processed---is selected suitable laser parameter and---determined relative motion form---laser boring---inspection of laser instrument and workpiece to be processed.Selected laser instrument is Nd:YAG laser instrument; the material of workpiece to be processed is aluminium alloy; energy of lasers is 10J, and defocusing amount is-2mm, and pulse frequency is 15kHz; pulsewidth is 22nm; laser scanning speed is 5mm/s, and protective gas is oxygen, and flow is 4L/min---5L/min; the punching degree of depth is 3mm, evenly gets row's aperture in surface of aluminum plate every 3mm.
Embodiment 2
A kind of laser boring technique, the light beam that laser instrument sends is after two pieces of total reflective mirrors, by lens focus on workpiece to be processed, by controlling the relative motion form of workpiece to be processed and laser instrument, realize laser boring, comprising: the material character analyzing workpiece to be processed---is selected suitable laser parameter and---determined relative motion form---laser boring---inspection of laser instrument and workpiece to be processed.Selected laser instrument is pumped at end face of semiconductor acousto-optic adjusting laser; the material of workpiece to be processed is polysilicon chip; energy of lasers is 15J, and defocusing amount is-0.5mm, and pulse frequency is 20kHz; pulsewidth is 22nm; laser scanning speed is 15mm/s, and protective gas is argon gas, and flow is 4L/min---5L/min; the punching degree of depth is 1.5mm, gets on polysilicon chip surface the hole that diameter is 5mm.
Claims (3)
1. a laser boring technique, it is characterized in that light beam that laser instrument sends is after two pieces of total reflective mirrors, by lens focus on workpiece to be processed, by controlling the relative motion form of workpiece to be processed and laser instrument, realize laser boring, comprising: the material character analyzing workpiece to be processed---is selected suitable laser parameter and---determined relative motion form---laser boring---inspection of laser instrument and workpiece to be processed.
2. method according to claim 1, is characterized in that, the material of described workpiece to be processed is aluminium alloy, copper, iron or polysilicon chip.
3. method according to claim 1; it is characterized in that; described energy of lasers is 5J---30J; defocusing amount is-0.5mm----2mm; pulse frequency is 5kHz---30kHz, and pulsewidth is 22nm---50nm, and laser scanning speed is 5mm/s---30mm/s; shield gas flow rate is 4L/min---5L/min, and the punching degree of depth is 0.5mm---5mm.
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| CN201510677750.7A CN105171251A (en) | 2015-10-19 | 2015-10-19 | Laser punching process |
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| CN201510677750.7A CN105171251A (en) | 2015-10-19 | 2015-10-19 | Laser punching process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112935592A (en) * | 2021-01-21 | 2021-06-11 | 华清创智光电科技(清远)有限公司 | Method for laser processing through hole for preventing molten metal from splashing |
| CN113414507A (en) * | 2021-07-12 | 2021-09-21 | 深圳来福士雾化医学有限公司 | Micropore processing method for polyimide film atomization sheet |
-
2015
- 2015-10-19 CN CN201510677750.7A patent/CN105171251A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112935592A (en) * | 2021-01-21 | 2021-06-11 | 华清创智光电科技(清远)有限公司 | Method for laser processing through hole for preventing molten metal from splashing |
| CN113414507A (en) * | 2021-07-12 | 2021-09-21 | 深圳来福士雾化医学有限公司 | Micropore processing method for polyimide film atomization sheet |
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