CN102189345A - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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- CN102189345A CN102189345A CN2011100355823A CN201110035582A CN102189345A CN 102189345 A CN102189345 A CN 102189345A CN 2011100355823 A CN2011100355823 A CN 2011100355823A CN 201110035582 A CN201110035582 A CN 201110035582A CN 102189345 A CN102189345 A CN 102189345A
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Abstract
The invention discloses a laser processing device and a laser processing method, for processing in the process of cutting fragile material having high residual stress without crack and the like. A device for processing by irradiating laser to an object to be processed comprises a laser irradiation mechanism. The pulse oscillation laser of the laser irradiation mechanism irradiates the object to be processed in a certain repetitive frequency while scanning. The repetitive frequency is H. The beam diameter of the laser is a. The scanning time of the laser on the same processing line is n. When the displacement distance L by irradiating pulse laser for one time is n/2*a, the laser irradiation mechanism sets the laser scanning speed S as L/(1/H); the irradiation start position of the laser whose scanning time is 1 is L1; the irradiation start position Ln of the laser whose scanning time is n is L1+(L/n)*(n-1); therefore, the laser irradiation mechanism irradiates laser by shifting the irradiation start position in the event of scanning each time.
Description
Technical field
The present invention relates to the laser processing device and the laser processing of a kind of cutting processing that for example is suitable for fragile material etc.
Background technology
Usually, in cutting processing, use mechanics methods such as grinding to carry out shaping based on whetstone as fragile materials such as Low fire ceramic sheets.But Low fire ceramic sheet etc. are owing to produce high residue stress by sintering in inside, so particularly its substrate thickness is got over attenuation, residual stress will uprise more, are difficult to be processed into crack when not producing the processing beginning etc.
And also known have a following method: in order to obtain desirable processing trait, to irradiating lasers such as Low fire ceramic sheets, and scan repeatedly, thereby implement processing such as cutting grade.For example, recorded the cut-off method of following fragile material in patent documentation 1: the heat point source by laser etc. heats the band plate that is made of the fragile material be full of cracks in the past, and mobile hot spot stretches to cut off band plate be full of cracks.And, in patent documentation 2, record following method: a kind of method of using pulse laser for programme-control cutting comprises 1 layer substrate at least, scanning impulse laser and method that substrate is cut.
Patent documentation 1: Japan Patent discloses flat 11-240730 communique
Patent documentation 2: the public table of Japan Patent 2005-523583 communique
In the above-mentioned technology in the past, leave following problem.
That is, in the method for utilizing in the past, promptly irradiating laser scans and when delineating the method that wire casing cuts off repeatedly, also there are the following problems, that is, because of processing midway heat affecting or the deployment conditions of impurity, produce the crack and cause cutting apart to the inexpectancy direction when ruling.
Summary of the invention
The present invention finishes in view of above-mentioned problem, even its purpose is to provide a kind of laser processing device and laser processing that also can not produce be full of cracks etc. and can process in the cutting processing of the fragile material with high residue stress.
The present invention has adopted following structure in order to solve described problem.Promptly, laser processing device of the present invention, process to processing object thing irradiating laser, it is characterized in that, possesses laser radiation mechanism, described laser radiation mechanism pulsed oscillation laser also scans when exposing to described processing object thing with certain repetition rate, described repetition rate is being made as H, the beam diameter of laser is made as a, the scanning times of laser on same processing line is made as n, when the displacement L of every irradiation 1 subpulse laser is made as n/2 * a, when described laser radiation mechanism is made as L/ (1/H) with the sweep speed S of laser, with scanning times is that the irradiation starting position of the 1st time laser is made as L1, and scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby in each scanning hour offset irradiation starting position and carry out described irradiation.
Laser processing of the present invention, process to processing object thing irradiating laser, it is characterized in that, has the laser irradiation process, described laser irradiation process pulsed oscillation laser also scans when described processing object thing shines with certain repetition rate, in described laser irradiation process, described repetition rate is made as H, the beam diameter of laser is made as a, the scanning times of laser on same processing line is made as n, every irradiation 1 subpulse laser displacement L when being made as n/2 * a, when the sweep speed S of laser is made as L/ (1/H), with scanning times is that the irradiation starting position of the 1st time laser is made as L1, and scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby in each scanning hour offset irradiation starting position and carry out described irradiation.
In these laser processing devices and laser processing, when the sweep speed S of laser is made as L/ (1/H), with scanning times is that the irradiation starting position of the 1st time laser is made as L1, scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby in each scanning hour offset irradiation starting position and shine, can not produce be full of cracks so can suppress the stress of processing object thing sharply to change and waiting and process.
Promptly, the starting position of skew irradiation on one side, on identical processing line, scan successively on one side and repeat to process, so that the form with pulse filled exposes to the point of the laser of processing object thing is above-mentioned displacement L at interval, so when scanning 1 time, processing stand vacate at interval and away from, therefore vacate at interval and become continuous state scanning midway the processing object thing, be difficult to cracked.And, as in the past, when overlapping mode scans continuously with the processing stand based on laser, make continuous groove extension and carry out cutting processing, thus rapid STRESS VARIATION produced, in contrast, among the present invention, processing stand can suppress rapid STRESS VARIATION not in succession when scanning 1 time.
And laser processing device of the present invention is characterised in that possessing has: sectional fixture, thus fixing described processing object thing is installed; And cooling body, make the cooling fluid circulation in the inside of this sectional fixture.
And laser processing of the present invention is characterised in that, carries out described irradiation when the inside of described sectional fixture makes the cooling fluid circulation.
Promptly, in these laser processing devices and laser processing, making cooling fluid circulation in the inside of sectional fixture, thus can absorb heat to the processing heat that causes because of laser by the cooling fluid that is circulated and by sectional fixture, thus can prevent accumulation of heat to processing object things such as fragile materials.
And laser processing of the present invention is characterised in that, at the machined surface binding resin film of described processing object thing, and from the described resin film to described machined surface irradiating laser.
Promptly, in this laser processing, because machined surface binding resin film at the processing object thing, and from the resin film to the machined surface irradiating laser, so the excentral dump energy by surperficial resin film absorption laser can prevent the accumulation of heat to processing object things such as fragile materials.And, can keep processing object thing in the processing by the resin film mechanics, and can suppress to chap or the generation in crack etc.
And, laser processing of the present invention is characterised in that, at the opposing face binding metal film of the machined surface of described processing object thing, and this metallic film is adhered on the sectional fixture, described processing object thing is fixed on this sectional fixture and carries out described irradiation.
Promptly, in this laser processing, because opposing face binding metal film at the machined surface of processing object thing, and this metallic film is adhered on the sectional fixture, the processing object thing is fixed on this sectional fixture and shines, so in the time of the processing object thing in can keeping processing by the metallic film mechanics, the heat that adds man-hour is passed through the high metallic film heat release of heat conductivity to sectional fixture, thereby can prevent the accumulation of heat to processing object things such as fragile materials.Especially be provided with the sectional fixture of above-mentioned cooling body by employing, can access high exothermal effect.
According to the present invention, obtain following effect.
Promptly, according to laser processing device involved in the present invention and laser processing, when the sweep speed S of laser is made as L/ (1/H), with scanning times is that the irradiation starting position of the 1st time laser is made as L1, scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby scan hour offset irradiation starting position at every turn and shine, can not produce be full of cracks so can suppress the stress of processing object thing sharply to change and waiting and process.
Therefore, in the cutting processing of the fragile material with high residue stress etc., can not produce be full of cracks or crack etc. yet, can carry out stable processing.
Description of drawings
Fig. 1 is in an embodiment of laser processing device involved in the present invention and laser processing, the simple overall structure figure of expression laser processing device.
Fig. 2 is a sectional view of representing processing object thing and sectional fixture in the present embodiment.
Fig. 3 is a key diagram of representing the scan method of laser in the present embodiment.
Symbol description
The 1-laser processing device, 2-laser radiation mechanism, 4-sectional fixture, 5-cooling body, 5a-cooling fluid, 7-resin film, 8-metallic film, B-laser, W-processing object thing.
The specific embodiment
Below, an embodiment of laser processing device involved in the present invention and laser processing is described referring to figs. 1 through Fig. 3.In addition, in each accompanying drawing of Shi Yonging,, suitably change engineer's scale in the following description for each parts being made as the size that to discern or discern easily.
As shown in Figure 1 to Figure 3, the device of the laser processing device 1 of present embodiment for processing to processing object thing W irradiating laser B, possessing has: laser radiation mechanism 2, and pulsed oscillation laser B also scans when processing object thing W shines with certain repetition rate; Travel mechanism 3 can keep processing object thing W and moves; Sectional fixture 4, thus be arranged in this travel mechanism 3 and install fixedly processing object thing W; Cooling body 5 makes cooling fluid 5a circulation in the inside of this sectional fixture 4; And the control part 6 of controlling these.
Above-mentioned processing object thing W for example has the fragile material of high residue stress for the substrate of ceramic sintered bodies etc.
In addition, as shown in Figure 2, add machined surface (surface) the binding resin film 7 of man-hour at processing object thing W, and from the resin film 7 to machined surface irradiating laser B.And, at opposing face (back side) the binding metal film 8 of the machined surface of processing object thing W, and make this metallic film 8 adhere to sectional fixture 4, and at the fixing processing object thing W and shining of this sectional fixture 4.
Can adopt the ultraviolet (uv) transmission film of plastic sheetings such as polytetrafluoroethylene film, polyethylene terephthalate thin film, polyethylene film, polypropylene film, poly-methyl pentene film, polyvinyl chloride, polyolefin etc. etc. as above-mentioned resin film 7.
And, can adopt aluminium, copper, stainless steel metal tapes such as (SUS) as above-mentioned metallic film 8.This metallic film 8 is bonded in processing object thing W by the sticker that with acrylic rubber, polyurethane resin, silicone resin etc. is principal component.
In addition, as these resin films 7 and metallic film 8, preferably adopt thermal coefficient of expansion identical with processing object thing W or with its near and be difficult for to produce the low-thermal-expansion rate film of the thermal expansion difference that adds man-hour.For example, be 8.8 * 10 with thermal coefficient of expansion
-6Aluminium oxide (the Al of/K
2O
3) or thermal coefficient of expansion be 10.8 * 10
-6The lanthanum gallate of/K adds man-hour as processing object thing W, and adopting thermal coefficient of expansion is 6～10 * 10
-6The low-thermal-expansion rate special resin of/K (for example low-thermal-expansion polyimides) is as resin film 7.And be 13.6 * 10 as metallic film 8 preferred thermal coefficient of expansions this moment
-6The SUS304 of/K.
Above-mentioned travel mechanism 3 is made of following: the X-axis objective table 3x of portion, can move to the directions X that is parallel to horizontal plane; The Y-axis objective table 3y of portion is arranged on this X-axis objective table 3x of portion, and can move to Y direction vertical with respect to directions X and that be parallel to horizontal plane; And the Z axle objective table 3z of portion, be arranged on this Y-axis objective table 3y of portion, be fixed with sectional fixture 4 and when can keep processing object thing W, can be to moving perpendicular to the horizontal plane direction.
Above-mentioned laser radiation mechanism 2 possesses and has: LASER Light Source 9 when vibrating laser B by the triggering signal of Q-switch, also has the optical system that optically focused becomes point-like; Galvano scanner 10, the laser B that scanning is shone; And ccd video camera 11, take for the Working position of confirming maintained processing object thing W.
Above-mentioned LASER Light Source 9 can use the light source of the laser B of arbitrary wavelength that can shine 190～550nm, for example in the present embodiment, uses and can vibrate the light source of wavelength as the laser B outgoing of 355nm.
Above-mentioned galvano scanner 10 be disposed at travel mechanism 3 directly over.And above-mentioned ccd video camera 11 is adjacent to galvano scanner 10 and is provided with.
Above-mentioned cooling body 5 has for example makes cooling water as the structure that cooling fluid 5a circulates in the circulation flow path 5b of the inside that is arranged at sectional fixture 4, is connected with the supply source (omitting diagram) of cooling fluid 5a on the circulation flow path 5b.
And sectional fixture 4 is formed with a plurality of adsorption hole 4a at the installed surface of processing object thing W, and these adsorption holes 4a is connected in vacuum source (omitting diagram) by the 4b of chamber portion that is formed at anchor clamps inside.That is, can be by adsorption hole 4a vacuum suction mounting in the processing object thing W of installed surface to keep.So, sectional fixture 4 becomes the water-cooled suction jig with water-cooled function and vacuum suction function.
Above-mentioned laser radiation mechanism 2 is set at as follows: repetition rate is made as H, the beam diameter of laser B is made as a, the scanning times of laser B on same processing line is made as n, when the displacement L of 1 laser B of every irradiation is made as n/2 * a, when the sweep speed S of laser B is made as L/ (1/H), with scanning times is that the irradiation starting position of the 1st time laser B is made as L1, scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby shines in each scanning hour offset irradiation starting position.
In addition, at this moment, the time of whenever sending pulsatile once laser becomes 1/H.And scanning times n is for any number and can not produce the number of be full of cracks etc., and be set in can the scope of gated sweep speed S in.
And laser radiation mechanism 2 is set at the processing threshold value that is higher than processing object thing W a little with laser output.
If be described in detail, as shown in Figure 3, when scanning times is made as 3 times (n=3), when the 1st scanning, begin scanning from irradiation starting position L1, vacate repetition rate H and sweep speed S on processing line the irradiating laser B of displacement L to set.For example, beam diameter a is made as 20 μ m, when repetition rate H was made as 10kHz, sweep speed S was configured to 300mm/sec.In the 1st scanning, process owing on processing line, vacating at interval, so processing object thing W connects together between processing stand.
Then,, the irradiation starting position of laser B is set at L1+ (L/2) the 2nd when scanning, from the 1st irradiation starting position skew, with the 1st the identical enterprising line scanning of processing line of scanning.In addition, the 3rd when scanning in the end, the irradiation starting position of laser B is set at L1+ (L/3) * 2, from the 1st time and the 2nd irradiation starting position skew, with the 1st the identical enterprising line scanning of processing line of scanning.By these 3 times scanning, processing object thing W is cut on processing line fully.
So, in the present embodiment, when being made as L/ (1/H) owing to sweep speed S with laser B, with scanning times is that the irradiation starting position of the 1st time laser B is made as L1, scanning times is that the irradiation starting position Ln of the n time laser B is made as L1+ (L/n) * (n-1), thereby in each scanning hour offset irradiation starting position and shine, sharply change, can not produce be full of cracks and waiting and process so can suppress the stress of processing object thing W.
Promptly, scan and overlapping processing successively on identical processing line while being offset the irradiation starting position, so that the form with pulse filled exposes to the point of the laser B of processing object thing W is above-mentioned displacement L at interval, so when scanning 1 time, processing stand vacate at interval and away from, therefore processing object thing W vacates the interval and becomes continuous state scanning midway, is difficult to cracked.And, as in the past, when overlapping mode scans continuously with the processing stand based on laser, the groove that links to each other extends and carries out cutting processing, thus produce rapid STRESS VARIATION, in contrast, in the present embodiment, processing stand can be not continuous when scanning 1 time, can suppress rapid STRESS VARIATION.
And,,, can prevent accumulation of heat to processing object thing W such as fragile materials so can absorb heat by the cooling fluid 5a that is circulated and by 4 pairs of processing of sectional fixture heat owing to make cooling fluid 5a circulation in the inside of sectional fixture 4.
In addition, because machined surface binding resin film 7 at processing object thing W, and to machined surface irradiating laser B,, can prevent accumulation of heat from the resin film 7 to processing object thing W such as fragile materials so absorb the excentral dump energy of laser B by the resin film 7 on surface.
And, can keep processing object thing W in the processing by resin film 7 mechanics, and can suppress to chap or the generation in crack etc.Especially, as in the past, on processing line, do not vacate when making it continuously with prolonged exposure laser B at interval, the processing line periphery of resin film 7 is by heat fusing, groove width broadens and near cause adding the Ministry of worker maintenance effect descends, but in the present embodiment, shines owing to vacate the interval, so can also reduce heat affecting, and can control groove width and make it narrow to resin film 7.
And, because opposing face binding metal film 8 at the machined surface of processing object thing W, and make this metallic film 8 adhere to sectional fixture 4, at the fixing processing object thing W and shining of this sectional fixture 4, so in the time of the processing object thing W in can keeping processing by metallic film 8 mechanics, the heat that adds man-hour is passed through high metallic film 8 heat releases of heat conductivity to sectional fixture 4, can prevent the accumulation of heat to processing object thing W such as fragile materials.
[embodiment 1]
Then, according to laser processing device involved in the present invention and laser processing the actual embodiment that adds man-hour is specifically described.
In the present embodiment, utilizing the laser processing device of present embodiment, is that the laser of 355nm is processed ceramic sintered bodies (thickness 250 μ m) as the processing object thing by wavelength.At this moment, polyimide resin film (thickness 0.1mm) is bonded in the surface of ceramic sintered bodies as resin film, aluminium film (thickness 0.05mm) is bonded in the back side as metallic film with the silicone-based binding agent with the acrylic acid series binding agent.The processing object thing of this state is adsorbed on the sectional fixture.
The output of laser is set at 1.3W, and repetition rate H is set at 125kHz, measures light beam spot, and beam diameter is 20 μ m as a result, so sweep speed S is set at 3750mm/sec, processes with 3 scanning times with galvano scanner.
Its result can obtain fissureless good cut surface.
Industrial applicibility
Laser processing device of the present invention and laser processing are particularly useful for having in the cutting processing of fragile material of high residue stress.
Claims (6)
1. a laser processing device is processed to processing object thing irradiating laser, it is characterized in that,
Possess laser radiation mechanism, described laser radiation mechanism pulsed oscillation laser also scans when exposing to described processing object thing with certain repetition rate,
Described repetition rate is being made as H, and the beam diameter of laser is made as a, and the scanning times of laser on same processing line is made as n, when the displacement L of every irradiation 1 subpulse laser is made as n/2 * a,
When described laser radiation mechanism is made as L/ (1/H) with the sweep speed S of laser,
With scanning times is that the irradiation starting position of the 1st time laser is made as L1, and scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby in each scanning hour offset irradiation starting position and carry out described irradiation.
2. laser processing device as claimed in claim 1 is characterized in that, possessing has:
Sectional fixture, thus fixing described processing object thing is installed; And
Cooling body makes the cooling fluid circulation in the inside of this sectional fixture.
3. a laser processing is processed to processing object thing irradiating laser, it is characterized in that,
Have the laser irradiation process, described laser irradiation process pulsed oscillation laser also scans when described processing object thing shines with certain repetition rate,
In described laser irradiation process, described repetition rate is made as H, the beam diameter of laser is made as a, and the scanning times of laser on same processing line is made as n, when the displacement L of every irradiation 1 subpulse laser is made as n/2 * a,
When the sweep speed S of laser is made as L/ (1/H),
With scanning times is that the irradiation starting position of the 1st time laser is made as L1, and scanning times is that the irradiation starting position Ln of the n time laser is made as L1+ (L/n) * (n-1), thereby in each scanning hour offset irradiation starting position and carry out described irradiation.
4. laser processing as claimed in claim 3 is characterized in that:
At the machined surface binding resin film of described processing object thing, and from the described resin film to described machined surface irradiating laser.
5. as claim 3 or 4 described laser processings, it is characterized in that:
Opposing face binding metal film at the machined surface of described processing object thing makes this metallic film adhere to sectional fixture, thereby described processing object thing is fixed on this sectional fixture and carries out described irradiation.
6. laser processing as claimed in claim 5 is characterized in that:
When the inside of described sectional fixture makes the cooling fluid circulation, carry out described irradiation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-047394 | 2010-03-04 | ||
| JP2010047394A JP5510806B2 (en) | 2010-03-04 | 2010-03-04 | Laser processing method |
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| CN102189345A true CN102189345A (en) | 2011-09-21 |
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| CN2011100355823A Pending CN102189345A (en) | 2010-03-04 | 2011-01-28 | Laser processing device and laser processing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106769324A (en) * | 2017-01-13 | 2017-05-31 | 正新橡胶（中国）有限公司 | A kind of detection method of tire supporting material nonwoven fabric from filaments |
| CN106903424A (en) * | 2017-02-20 | 2017-06-30 | 温州大学 | A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave |
| CN110340520A (en) * | 2019-06-27 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of pulse dislocation laser processing, device and system |
| CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| SG11201908018PA (en) * | 2017-09-13 | 2019-09-27 | Genuine Solutions Pte Ltd | Cutting method for polymer resin mold compound based substrates and system thereof |
| CN110052722A (en) * | 2019-04-12 | 2019-07-26 | 武汉先河激光技术有限公司 | A kind of laser pulse control method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106903424A (en) * | 2017-02-20 | 2017-06-30 | 温州大学 | A kind of post-processing approach that optical element mechanical property is improved based on laser blast wave |
| CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
| CN110340520A (en) * | 2019-06-27 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of pulse dislocation laser processing, device and system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5510806B2 (en) | 2014-06-04 |
| JP2011177781A (en) | 2011-09-15 |
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Application publication date: 20110921 |