JPS622254U - - Google Patents
Info
- Publication number
- JPS622254U JPS622254U JP9397585U JP9397585U JPS622254U JP S622254 U JPS622254 U JP S622254U JP 9397585 U JP9397585 U JP 9397585U JP 9397585 U JP9397585 U JP 9397585U JP S622254 U JPS622254 U JP S622254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- cooler
- semiconductor device
- matching circuit
- peltier effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000005679 Peltier effect Effects 0.000 claims description 2
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
- Microwave Amplifiers (AREA)
Description
第１図はこの考案の一実施例による高周波半導
体装置を示す断面図、第２図は従来の高周波半導
体装置を示す断面図である。
図中、１は半導体素子、２はパツケージ、５は
ペルチエ効果冷却器、５ａは整合回路である。な
お、図中、同一符号は同一、又は相当部分を示す
。
FIG. 1 is a sectional view showing a high frequency semiconductor device according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional high frequency semiconductor device. In the figure, 1 is a semiconductor element, 2 is a package, 5 is a Peltier effect cooler, and 5a is a matching circuit. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
器を設置し、この冷却器の半導体素子側の表面に
、マイクロストリツプ線路による整合回路を形成
したことを特徴とする半導体装置。 A semiconductor device characterized in that a cooler utilizing the Peltier effect is installed directly below a semiconductor element, and a matching circuit using a microstrip line is formed on the surface of the cooler on the semiconductor element side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9397585U JPS622254U (en) | 1985-06-20 | 1985-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9397585U JPS622254U (en) | 1985-06-20 | 1985-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622254U true JPS622254U (en) | 1987-01-08 |
Family
ID=30652126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9397585U Pending JPS622254U (en) | 1985-06-20 | 1985-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622254U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258855A (en) * | 1988-08-25 | 1990-02-28 | Fujitsu Ltd | Electron cooling device |
| JP2017162905A (en) * | 2016-03-08 | 2017-09-14 | Ｎｅｃスペーステクノロジー株式会社 | Temperature control device, method and control circuit used therefor |
-
1985
- 1985-06-20 JP JP9397585U patent/JPS622254U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258855A (en) * | 1988-08-25 | 1990-02-28 | Fujitsu Ltd | Electron cooling device |
| JP2017162905A (en) * | 2016-03-08 | 2017-09-14 | Ｎｅｃスペーステクノロジー株式会社 | Temperature control device, method and control circuit used therefor |