JPS6054354U - 発光ダイオ−ド装置 - Google Patents

発光ダイオ−ド装置

Info

Publication number
JPS6054354U
JPS6054354U JP14608783U JP14608783U JPS6054354U JP S6054354 U JPS6054354 U JP S6054354U JP 14608783 U JP14608783 U JP 14608783U JP 14608783 U JP14608783 U JP 14608783U JP S6054354 U JPS6054354 U JP S6054354U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode device
wall
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14608783U
Other languages
English (en)
Inventor
瀉山　幸一郎
Original Assignee
鹿児島日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鹿児島日本電気株式会社 filed Critical 鹿児島日本電気株式会社
Priority to JP14608783U priority Critical patent/JPS6054354U/ja
Publication of JPS6054354U publication Critical patent/JPS6054354U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の発光ダイオード装置の断面図。 第２図は本考案の発光ダイオード装置の断面図。 なお図において１はモールド樹脂、２はカソード側リー
ド端子、３はアノード側リード端子、４はペレット、５
は従来の円錐形反射壁、６は階段状の反射壁、７はボン
ディングワイヤーである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂部とアノード、及びカソードから成る発光ダイオー
    ド装置のカソード側リード線の頂部に円錐状の開口した
    反射壁を有する発光ダイオード装置において、反射内壁
    が階段状であることを特徴とする発光ダイオード装置。
JP14608783U 1983-09-21 1983-09-21 発光ダイオ−ド装置 Pending JPS6054354U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14608783U JPS6054354U (ja) 1983-09-21 1983-09-21 発光ダイオ−ド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14608783U JPS6054354U (ja) 1983-09-21 1983-09-21 発光ダイオ−ド装置

Publications (1)

Publication Number Publication Date
JPS6054354U true JPS6054354U (ja) 1985-04-16

Family

ID=30325285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14608783U Pending JPS6054354U (ja) 1983-09-21 1983-09-21 発光ダイオ−ド装置

Country Status (1)

Country Link
JP (1) JPS6054354U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216953A (ja) * 2005-01-31 2006-08-17 Samsung Electronics Co Ltd 発光ダイオード素子
KR101139891B1 (ko) * 2005-01-31 2012-04-27 렌슬러 폴리테크닉 인스티튜트 확산 반사면을 구비한 발광 다이오드 소자
JP2016519208A (ja) * 2013-03-15 2016-06-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216953A (ja) * 2005-01-31 2006-08-17 Samsung Electronics Co Ltd 発光ダイオード素子
KR101139891B1 (ko) * 2005-01-31 2012-04-27 렌슬러 폴리테크닉 인스티튜트 확산 반사면을 구비한 발광 다이오드 소자
JP2016519208A (ja) * 2013-03-15 2016-06-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｅｐｉプロセスのための均一性調整レンズを有するサセプタ支持シャフト

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