JPS6142852U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS6142852U
JPS6142852U JP1984127280U JP12728084U JPS6142852U JP S6142852 U JPS6142852 U JP S6142852U JP 1984127280 U JP1984127280 U JP 1984127280U JP 12728084 U JP12728084 U JP 12728084U JP S6142852 U JPS6142852 U JP S6142852U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
heat sink
encapsulated semiconductor
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984127280U
Other languages
English (en)
Inventor
寿昭 宮沢
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984127280U priority Critical patent/JPS6142852U/ja
Publication of JPS6142852U publication Critical patent/JPS6142852U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例の平面図、同図ｂは図ａの
Ａ−Ａ断面図、第２図は第１図に示す放熱板と搭載半導
体ペレットを示す斜視図、第３図ａは従来の樹脂封止半
導体装置の平面図、同図ｂは図ａのＡ−Ａ断面図である
。 １・・・半導体ペレット、２，６・・・放熱板、２ａ，
６ａ・・・放熱板引出しリード、２ｂ，６ｂ・・・放熱
板露出部、３・・・外部リード、４・・・接続細線、５
・・・封止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板に半導体ペレットを搭載し、前記放熱板の少くと
    も一端側が封止樹脂体から露出させて樹脂封止してなる
    半導体装置において、前記放熱板は、ペレット搭載部と
    前記露出部との中間で逆Ｕ字形に曲げられていることを
    特徴とする半導体装置。
JP1984127280U 1984-08-22 1984-08-22 樹脂封止半導体装置 Pending JPS6142852U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984127280U JPS6142852U (ja) 1984-08-22 1984-08-22 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984127280U JPS6142852U (ja) 1984-08-22 1984-08-22 樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
JPS6142852U true JPS6142852U (ja) 1986-03-19

Family

ID=30685928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984127280U Pending JPS6142852U (ja) 1984-08-22 1984-08-22 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6142852U (ja)

Similar Documents

Publication Publication Date Title
JPS6142852U (ja) 樹脂封止半導体装置
JPS5895641U (ja) 樹脂封止半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS60121650U (ja) チツプキヤリア
JPS58191645U (ja) 半導体装置のパツケ−ジ
JPS6035546U (ja) 樹脂封止半導体装置
JPS5954942U (ja) 樹脂封止型半導体装置
JPS5887355U (ja) 半導体装置
JPS5856446U (ja) 樹脂封止半導体装置
JPS6068654U (ja) 半導体装置
JPS5914348U (ja) 樹脂封止型半導体装置
JPS6073249U (ja) 樹脂封止半導体装置
JPS5945935U (ja) 樹脂封止半導体装置
JPS59109149U (ja) 半導体用パツケ−ジ
JPS5996843U (ja) 半導体装置
JPS5887339U (ja) 半導体装置
JPS6016553U (ja) 樹脂封止型半導体装置
JPS5837147U (ja) 半導体装置
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS6076045U (ja) 樹脂封止半導体装置
JPS6081652U (ja) 樹脂封止型半導体装置
JPH01140843U (ja)
JPS5869952U (ja) 樹脂封止半導体装置