JPS6142852U - 樹脂封止半導体装置 - Google Patents
樹脂封止半導体装置Info
- Publication number
- JPS6142852U JPS6142852U JP1984127280U JP12728084U JPS6142852U JP S6142852 U JPS6142852 U JP S6142852U JP 1984127280 U JP1984127280 U JP 1984127280U JP 12728084 U JP12728084 U JP 12728084U JP S6142852 U JPS6142852 U JP S6142852U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- heat sink
- encapsulated semiconductor
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図aは本考案の一実施例の平面図、同図bは図aの
A−A断面図、第2図は第1図に示す放熱板と搭載半導
体ペレットを示す斜視図、第3図aは従来の樹脂封止半
導体装置の平面図、同図bは図aのA−A断面図である
。 1・・・半導体ペレット、2,6・・・放熱板、2a,
6a・・・放熱板引出しリード、2b,6b・・・放熱
板露出部、3・・・外部リード、4・・・接続細線、5
・・・封止樹脂。
A−A断面図、第2図は第1図に示す放熱板と搭載半導
体ペレットを示す斜視図、第3図aは従来の樹脂封止半
導体装置の平面図、同図bは図aのA−A断面図である
。 1・・・半導体ペレット、2,6・・・放熱板、2a,
6a・・・放熱板引出しリード、2b,6b・・・放熱
板露出部、3・・・外部リード、4・・・接続細線、5
・・・封止樹脂。
Claims (1)
- 放熱板に半導体ペレットを搭載し、前記放熱板の少くと
も一端側が封止樹脂体から露出させて樹脂封止してなる
半導体装置において、前記放熱板は、ペレット搭載部と
前記露出部との中間で逆U字形に曲げられていることを
特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984127280U JPS6142852U (ja) | 1984-08-22 | 1984-08-22 | 樹脂封止半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984127280U JPS6142852U (ja) | 1984-08-22 | 1984-08-22 | 樹脂封止半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6142852U true JPS6142852U (ja) | 1986-03-19 |
Family
ID=30685928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984127280U Pending JPS6142852U (ja) | 1984-08-22 | 1984-08-22 | 樹脂封止半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6142852U (ja) |
-
1984
- 1984-08-22 JP JP1984127280U patent/JPS6142852U/ja active Pending
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