JPS60133653U - 発光ダイオ−ド - Google Patents
発光ダイオ−ドInfo
- Publication number
- JPS60133653U JPS60133653U JP2160384U JP2160384U JPS60133653U JP S60133653 U JPS60133653 U JP S60133653U JP 2160384 U JP2160384 U JP 2160384U JP 2160384 U JP2160384 U JP 2160384U JP S60133653 U JPS60133653 U JP S60133653U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- lead
- light emitting
- element mounting
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の発光ダイオ−!の断面=、竿2図は従来
の改良された発光=゛イオード断面図、第3図は本考案
の一実施例による発光ダイオードの断面図である。
の改良された発光=゛イオード断面図、第3図は本考案
の一実施例による発光ダイオードの断面図である。
Claims (1)
- 素子搭載部を有するリードと幸子からのボンディング線
の接続部を有するリードとを備えた発光ダイオードにお
いて前記ボンディング線接続部を有するリードが素子搭
載部を有するリードより長−° くボンディング線接
続部が素子搭載部より上方に位置しかつ発光ダイオード
の指向性を低下せしめない様、リードのボンディング線
接続部を傾斜さ−せたことを特徴とする発光ダイボード
。 ゛
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2160384U JPS60133653U (ja) | 1984-02-17 | 1984-02-17 | 発光ダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2160384U JPS60133653U (ja) | 1984-02-17 | 1984-02-17 | 発光ダイオ−ド |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60133653U true JPS60133653U (ja) | 1985-09-06 |
Family
ID=30513142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2160384U Pending JPS60133653U (ja) | 1984-02-17 | 1984-02-17 | 発光ダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60133653U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010740A (ja) * | 2006-06-30 | 2008-01-17 | Stanley Electric Co Ltd | 光半導体装置 |
-
1984
- 1984-02-17 JP JP2160384U patent/JPS60133653U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010740A (ja) * | 2006-06-30 | 2008-01-17 | Stanley Electric Co Ltd | 光半導体装置 |
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