JPS5988816A - Method of producing laminated ceramic part - Google Patents
Method of producing laminated ceramic partInfo
- Publication number
- JPS5988816A JPS5988816A JP19941982A JP19941982A JPS5988816A JP S5988816 A JPS5988816 A JP S5988816A JP 19941982 A JP19941982 A JP 19941982A JP 19941982 A JP19941982 A JP 19941982A JP S5988816 A JPS5988816 A JP S5988816A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- cutting
- sheet
- cutting blade
- laminated ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は積層セラミック部品の製造方法に関し、特に積
層セラミックコンデンサの積層体からの切離方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a multilayer ceramic component, and particularly to a method for separating a multilayer ceramic capacitor from a laminate.
本出願人は先に主として電極層、セラミック層を交互に
、電極層の外周部分に耳部が形成、されるように積層す
ると共に、加圧一体化することにより積層体を形成し、
この積層体を基体に、それの耳部のみに接着剤を塗布し
て固定した後、積層体を切断刃にて、それを左右動させ
乍ら所定の寸法に切断することにより耳部を除く部分を
基体より分離する積層セラミックコンデンザの製造方法
を提案した。The applicant first formed a laminate by first stacking electrode layers and ceramic layers alternately so that ears were formed on the outer periphery of the electrode layers, and integrating them under pressure.
After fixing this laminate as a base by applying adhesive only to the ears, remove the ears by cutting the laminate to a predetermined size using a cutting blade while moving it from side to side. We proposed a manufacturing method for multilayer ceramic capacitors in which the parts are separated from the base.
この方法によれば、積層体の切断に際し、切断刃を左右
動させても積層体の主要部が耳部によって囲繞されてい
る関係で、切断刃の移動方向への位置ずれを皆無にでき
る上、切断後に積層セラミックコンデンサの基体からの
分離を容易に行うことができるという優れた効果が期待
できるものである。According to this method, even if the cutting blade is moved from side to side when cutting the laminate, the main part of the laminate is surrounded by the ears, so there is no misalignment of the cutting blade in the direction of movement. An excellent effect can be expected in that the laminated ceramic capacitor can be easily separated from the substrate after cutting.
しかし乍ら、積層体の切断時に、切断刃を左右動させる
ことから、積層体を固定している基体はその表面が切断
刃によって損傷され、耐用期間が短く、頻繁に交換しな
ければならないことによつてコスト面への影響も無視で
きないという問題がある。However, since the cutting blade moves left and right when cutting the laminate, the surface of the base that fixes the laminate is damaged by the cutting blade, resulting in a short service life and the need for frequent replacement. There is also the problem that the impact on cost cannot be ignored.
又、近時、作業能率の改善を目的として、切断刃の動き
を左右方向から上下方向に変更する傾向にある。このよ
うな切断方法を上述の提案に適用すると、切断刃の厚み
が例えば１３０ｐＩ＋１程度と厚いこともあって、積層
体の切断後に切断刃を上昇させる際に、積層体が切断刃
に付着して持上げられ易く、量産工程への適用が難しい
という問題もある。Furthermore, in recent years, there has been a trend to change the movement of the cutting blade from the left-right direction to the up-down direction for the purpose of improving work efficiency. If such a cutting method is applied to the above-mentioned proposal, the thickness of the cutting blade is as thick as, for example, 130pI+1, so when the cutting blade is raised after cutting the laminate, the laminate may adhere to the cutting blade. Another problem is that it is easy to lift, making it difficult to apply it to mass production processes.
本発明はこのような点に鑑み、簡単な構成、によって積
層体の切断時における位置ずれ、持上がりなどを皆無に
できる積層セラミック部品の製造方法を提供するもので
あり、具体的には主として電極層、セラミック層を交互
に積層すると共に、加圧−針止することにより積層体を
形成する工程と、この積層体を、粘着力が１００〜１４
０９／２０ｍｍの粘着層を有するシートに貼着する工程
と、積層体を所定の寸法に切断する工程とを含むことを
特徴とするものである。In view of these points, the present invention provides a method for manufacturing a laminated ceramic component that has a simple configuration and can eliminate positional shift and lifting during cutting of the laminated body. A step of forming a laminate by alternately laminating layers and ceramic layers and applying pressure and needle fixing, and forming a laminate with an adhesive strength of 100 to 14
This method is characterized by including the steps of adhering it to a sheet having a 09/20 mm adhesive layer, and cutting the laminate into predetermined dimensions.
この発明によれば、積層体がシートに、それの粘着層を
利用して貼着されているので、切断刃による切…）時の
位置ずれ、持上がりを皆無にできる。According to this invention, since the laminate is adhered to the sheet using its adhesive layer, there is no displacement or lifting when cutting with a cutting blade.
特に、切断刃の動きは上下方向に′Ｆ！′定さねている
ので、−回の］二下動で複数を同時に切断でき、作業能
率を大巾に改善できる。In particular, the movement of the cutting blade is vertical. Since the blade is not fixed, it is possible to cut multiple pieces at the same time with two downward movements, greatly improving work efficiency.
しかも、切断刃が上下方向に動くことから、積層体の切
断時にシートが切断されないのみならす、基体にも損傷
を年えないために、基体の頻繁な交換によるコスト面へ
の影響を皆無にできる。Moreover, since the cutting blade moves in the vertical direction, the sheet is not cut when cutting the laminate, and there is no damage to the base, which eliminates the cost impact of frequent replacement of the base. .
次に本発明の積層セラミックコンデンサへの適用例につ
いて第１図〜第５図を参照して説明する。Next, an example of application of the present invention to a multilayer ceramic capacitor will be described with reference to FIGS. 1 to 5.
１ず、第１図に示すように、基体１の上面に。1. As shown in FIG. 1, on the top surface of the base 1.
」二下面に粘着層２ａ 、２ｂを有する例えば厚さが１
３０μｍの塩化ビニールのシート２を貼着する。” For example, the thickness is 1 with adhesive layers 2a and 2b on the lower surface.
A 30 μm vinyl chloride sheet 2 is pasted.
尚、粘着層２ａの粘着力は１００〜１４（１１９／２０
ｗｎの範囲に設定されている。次に、第２図に示すよう
に、シート２の粘着層２ａに積層体３を貼着する。The adhesive force of the adhesive layer 2a is 100 to 14 (119/20
It is set in the range of wn. Next, as shown in FIG. 2, the laminate 3 is attached to the adhesive layer 2a of the sheet 2.
尚、積層体３はシート２に、それを基体ｌに貼着するに
先立って貼着することもできるし、又、粘着層２ｂを省
略し、真空吸着機構を利用して固定することもできる。Note that the laminate 3 can be attached to the sheet 2 before it is attached to the substrate l, or the adhesive layer 2b can be omitted and the laminate 3 can be fixed using a vacuum suction mechanism. .
この積層体３は例えば次のように形成される。即ち、ま
ず、セラミック粉末。This laminate 3 is formed, for example, as follows. That is, first, ceramic powder.
バインダー、可塑剤１分散剤、溶剤を含む混合部材から
ドクターブレード法によって所定の厚みを有するセラミ
ックシート（層）４を形成し、乾燥後所定の大きざに打
抜く。この打抜きシート４上に、パラジウム粉末、バイ
ンダー、溶剤を含む混合部材を所定のパターンに印刷す
ることによって電極層５を形成１し、熱風などにて乾燥
する。以下この電極層の形成１されたシート４を、電極
層が互い違い状となるように複数枚積層する。そして、
これらの１−下面に、グリーンシートよりなる保護層６
，７を積層し、ホットプレスすることによって保護層、
セラミック層、電極層を一体化して積層体３が形成され
る。尚、積層体３け保護層６゜セラミックシート４．保
護層７の順に順次Ｍｂして形成することもできる。次に
、第３図に示すよ ５−
うに、基体１の上方に］二下動自在なるように配置され
た例えば厚みが１３０μｍ程度の切断刃８を下降させる
と、積層体３は第４図に示すように切断される。そして
、所定の切断線に治って縦、欄に切断操作することによ
って積層体３は第５図に示すように切断される。然る後
、シート２を基体］から剥離すると共に、チップをシー
ト２から剥離り焼成することによって積層セラミックコ
ンデンサが製造される。A ceramic sheet (layer) 4 having a predetermined thickness is formed by a doctor blade method from a mixed member containing a binder, a plasticizer, a dispersant, and a solvent, and after drying, it is punched into a predetermined size. On this punched sheet 4, an electrode layer 5 is formed by printing a mixed material containing palladium powder, a binder, and a solvent in a predetermined pattern, and then dried with hot air or the like. Thereafter, a plurality of sheets 4 on which the electrode layers have been formed are stacked so that the electrode layers are alternated. and,
Protective layer 6 made of green sheet on the lower surface of these 1-
, 7 is laminated and hot pressed to form a protective layer,
A laminate 3 is formed by integrating the ceramic layer and the electrode layer. In addition, the laminate includes 3 protective layers, 6° ceramic sheets, and 4. It is also possible to form the protective layer 7 by sequentially forming Mb. Next, as shown in FIG. 3, when the cutting blade 8 having a thickness of about 130 μm, for example, which is disposed so as to be movable above the base 1, is lowered, the laminated body 3 is cut into the shape shown in FIG. Cut as shown. Then, the laminate 3 is cut along a predetermined cutting line and cut vertically and in columns as shown in FIG. Thereafter, the sheet 2 is peeled off from the base, and the chip is peeled off from the sheet 2 and fired, thereby producing a multilayer ceramic capacitor.
この実施例によれば、積層体３がシート２に貼着されて
いる粘着層２ａはその粘着力が１００〜１４０９ ／
２０ ｗＩ＋１の範囲に設定されているので、切断刃８
にて積層体３を切断する際の位置ずれ、持上がりを皆無
にできる。According to this embodiment, the adhesive layer 2a on which the laminate 3 is attached to the sheet 2 has an adhesive strength of 100 to 1409/
Since it is set in the range of 20 wI+1, the cutting blade 8
Positional shift and lifting when cutting the laminate 3 can be completely eliminated.
Ｌかし乍らシ粘着力が］００り／ ２０ ｍ＋ｎ未満で
は切断時の位置ずれ、持上がりの防止効果乏Ｌ＜、又。However, if the adhesive strength is less than 00/20 m+n, the effect of preventing displacement and lifting during cutting is poor.
１４０９ ／ ２０ ｒｒａｎを越えると、粘着力が強
くなりすぎて切断後のチップの剥離が困難になるために
、その範囲を逸脱することは好ましくない。If it exceeds 1409/20 rran, the adhesive force becomes too strong and it becomes difficult to peel off the chip after cutting, so it is not preferable to deviate from this range.
又、切断刃８は上下方向に動作する関係で、積 ６−
層体３の切断時にシート２が切断されることはない。こ
のために、基体１の上面が切断刃８によって損傷される
ことはなく、それの交換を要しない。Further, since the cutting blade 8 moves in the vertical direction, the sheet 2 is not cut when the stacked body 3 is cut. For this reason, the upper surface of the base body 1 is not damaged by the cutting blade 8 and does not require replacement.
尚、本発明において、保護層、七ラミック層の厚み、セ
ラミック層の積層数は適宜に変更できるし、シートの材
質も塩化ビニールにのみ制約されない。In the present invention, the thickness of the protective layer, the heptamic layer, and the number of laminated ceramic layers can be changed as appropriate, and the material of the sheet is not limited to vinyl chloride.
図は本発明方法の説明図であって、第１図は基体にシー
トを貼着した状態を示す側断面図、第２図はシート上に
積層体を貼着した状態を示す側断面図、第３図は積層体
の切断直前の状態を示す側断面図、第４図は切断状態を
示す要部拡大図、第５図は切ＩＲＩ後の状態を示す平面
図である。
９−
第１図
第２図
第３図The figures are explanatory diagrams of the method of the present invention, in which Fig. 1 is a side sectional view showing a state in which a sheet is adhered to a substrate, and Fig. 2 is a side sectional view showing a state in which a laminate is adhered to a sheet. FIG. 3 is a side sectional view showing the state of the laminate just before cutting, FIG. 4 is an enlarged view of the main part showing the cutting state, and FIG. 5 is a plan view showing the state after cutting IRI. 9- Figure 1 Figure 2 Figure 3
Claims (1)
、加圧一体化することにより積層体を形成する工程と、
この積層体を、粘着力がｌ Ｏ，０〜１４０り／ ２０
ｗｓの粘着層を有するシートに貼着する工程と、積層
体を所定の寸法に切断する工程とを含むことを特徴とす
る積層セラミック部品の製造方法。A step of forming a laminate mainly by alternately laminating electrode layers and ceramic layers and integrating them under pressure;
This laminate has an adhesive strength of 1 O, 0 to 140/20
A method for manufacturing a laminated ceramic component, the method comprising the steps of: adhering it to a sheet having a WS adhesive layer; and cutting the laminate into predetermined dimensions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19941982A JPS5988816A (en) | 1982-11-12 | 1982-11-12 | Method of producing laminated ceramic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19941982A JPS5988816A (en) | 1982-11-12 | 1982-11-12 | Method of producing laminated ceramic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5988816A true JPS5988816A (en) | 1984-05-22 |
| JPS6347327B2 JPS6347327B2 (en) | 1988-09-21 |
Family
ID=16407485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19941982A Granted JPS5988816A (en) | 1982-11-12 | 1982-11-12 | Method of producing laminated ceramic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5988816A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61120414A (en) * | 1984-11-15 | 1986-06-07 | 関西日本電気株式会社 | Manufacture of laminated ceramic capacitor |
| JPS6330205A (en) * | 1986-07-25 | 1988-02-08 | 日東電工株式会社 | Manufacture of ceramic-board cut piece |
| JPS6330204A (en) * | 1986-07-25 | 1988-02-08 | 日東電工株式会社 | Manufacture of ceramic-board cut piece |
| JPS6333487A (en) * | 1987-04-17 | 1988-02-13 | Nitto Electric Ind Co Ltd | Expansion type adhesive sheet |
| JPS63102216A (en) * | 1986-10-17 | 1988-05-07 | 株式会社村田製作所 | Method of processing prepreg sheet for laminated capacitor |
| JPH01289234A (en) * | 1988-05-17 | 1989-11-21 | Hitachi Condenser Co Ltd | Manufacture of laminated ceramic chip capacitor |
| JPH0265218A (en) * | 1988-08-31 | 1990-03-05 | Hitachi Condenser Co Ltd | Manufacture of laminated ceramic capacitor |
| US4920640A (en) * | 1988-01-27 | 1990-05-01 | W. R. Grace & Co.-Conn. | Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates |
| JPH03227205A (en) * | 1990-01-31 | 1991-10-08 | Taiyo Yuden Co Ltd | Cutting method for ceramic green sheet and its device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4321673B2 (en) * | 2002-06-21 | 2009-08-26 | フジコピアン株式会社 | Temporary adhesive sheet for raw sheets for ceramic electronic components |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527676A (en) * | 1978-08-18 | 1980-02-27 | Nichicon Capacitor Ltd | Method of manufacturing metallized capacitor |
-
1982
- 1982-11-12 JP JP19941982A patent/JPS5988816A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527676A (en) * | 1978-08-18 | 1980-02-27 | Nichicon Capacitor Ltd | Method of manufacturing metallized capacitor |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61120414A (en) * | 1984-11-15 | 1986-06-07 | 関西日本電気株式会社 | Manufacture of laminated ceramic capacitor |
| JPH0426531B2 (en) * | 1984-11-15 | 1992-05-07 | Kansai Nippon Electric | |
| JPS6330205A (en) * | 1986-07-25 | 1988-02-08 | 日東電工株式会社 | Manufacture of ceramic-board cut piece |
| JPS6330204A (en) * | 1986-07-25 | 1988-02-08 | 日東電工株式会社 | Manufacture of ceramic-board cut piece |
| JPS63102216A (en) * | 1986-10-17 | 1988-05-07 | 株式会社村田製作所 | Method of processing prepreg sheet for laminated capacitor |
| JPS6333487A (en) * | 1987-04-17 | 1988-02-13 | Nitto Electric Ind Co Ltd | Expansion type adhesive sheet |
| US4920640A (en) * | 1988-01-27 | 1990-05-01 | W. R. Grace & Co.-Conn. | Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates |
| JPH01289234A (en) * | 1988-05-17 | 1989-11-21 | Hitachi Condenser Co Ltd | Manufacture of laminated ceramic chip capacitor |
| JPH0472371B2 (en) * | 1988-05-17 | 1992-11-18 | Hitachi Aic Inc | |
| JPH0265218A (en) * | 1988-08-31 | 1990-03-05 | Hitachi Condenser Co Ltd | Manufacture of laminated ceramic capacitor |
| JPH0472372B2 (en) * | 1988-08-31 | 1992-11-18 | Hitachi Aic Inc | |
| JPH03227205A (en) * | 1990-01-31 | 1991-10-08 | Taiyo Yuden Co Ltd | Cutting method for ceramic green sheet and its device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6347327B2 (en) | 1988-09-21 |
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