JPH01289234A - Manufacture of laminated ceramic chip capacitor - Google Patents
Manufacture of laminated ceramic chip capacitorInfo
- Publication number
- JPH01289234A JPH01289234A JP12023788A JP12023788A JPH01289234A JP H01289234 A JPH01289234 A JP H01289234A JP 12023788 A JP12023788 A JP 12023788A JP 12023788 A JP12023788 A JP 12023788A JP H01289234 A JPH01289234 A JP H01289234A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- adhesive film
- organic adhesive
- fixed
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000003990 capacitor Substances 0.000 title claims description 7
- 239000002313 adhesive film Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000010304 firing Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract 2
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 4
- 230000006866 deterioration Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
木光明は積ＦＦＪｔラミックチップコンデンサに関ηる
。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to FFJt lamic chip capacitors.
（従来の技術）
従来、積層セラミックチップ：１ンデンサを製造するに
は、セラミックシートの積層体を所定１法のチップに切
断し、その後、チップを基板上に並べるかあるいは粉末
中に埋め焼成している。(Prior art) Conventionally, in order to manufacture a laminated ceramic chip: 1 capacitor, a laminate of ceramic sheets is cut into chips using a predetermined method, and then the chips are arranged on a substrate or buried in powder and fired. ing.
（発明が解決しようとする課題）
しかし、この従来の方法では、作業工率が低い欠点があ
る。また、焼成時にチップどうしが接触し易く、セラミ
ックシートの内部電極と誘電体の部分とが反応して特性
が劣化する欠点があった。(Problems to be Solved by the Invention) However, this conventional method has a drawback of low labor efficiency. Additionally, the chips tend to come into contact with each other during firing, causing a reaction between the internal electrodes of the ceramic sheet and the dielectric portion, resulting in deterioration of characteristics.
本発明は、以上の欠点を改良し、製造が容易で特性を向
上しつる積層セラミックチップコンデンサを提供するも
のである。The present invention improves the above-mentioned drawbacks and provides a multilayer ceramic chip capacitor that is easy to manufacture and has improved characteristics.
（課題を解決するための手段）
本発明は、上記の目的を達成するために、積層セラミッ
クチップコンデンサの製造方法において、１）複数個の
内部電極を形成したセラミックシートを複数枚、積層し
圧着して積層する工程と、
ｉｉ）該ｖ４層したセラミックシートを有機粘着フィル
ム上に固定する工程と、
ｉｉｉ）前記セラミックシートにスリットを形成して複
数個のチップに切断する工程と、
ｉｖ ）前記荷重粘着フィルム上に固定したまま該チッ
プをに板上に配置する工程と、
Ｖ）前記チップを焼成づる工程と
を順次行なうことを特徴と１Ｊる積層セラミックブッ１
−Ｊンデンリの１Ｆ８ｉ造方法を提供づるものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for manufacturing a multilayer ceramic chip capacitor, in which: 1) a plurality of ceramic sheets each having a plurality of internal electrodes formed thereon are laminated and crimped; ii) fixing the v4-layered ceramic sheet on an organic adhesive film; iii) forming slits in the ceramic sheet and cutting it into a plurality of chips; iv) A multilayer ceramic book 1 characterized in that the steps of arranging the chip on a plate while fixed on a load-adhesive film, and V) firing the chip are performed in sequence.
- Provides J-Ndenri's 1F8i manufacturing method.
（ｆｌ用）
本発明によれば、レラミンクシートにスリットを股【ブ
て切断し、形成したチップを予じめ右機粘乞フィルムに
固定できる。従って、チップは互いに接触することなく
、所定の間隔を維持したまま焼成できる。(For fl) According to the present invention, slits are cut in the Relamink sheet and the formed chips can be fixed in advance to the right-hand adhesive film. Therefore, the chips can be fired while maintaining a predetermined distance without coming into contact with each other.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
先ず、第１図に示す通り、内部電極１を形成したセラミ
ックシート２を複数枚、積層し圧着して積層体３を形成
でる。First, as shown in FIG. 1, a plurality of ceramic sheets 2 having internal electrodes 1 formed thereon are laminated and pressed together to form a laminate 3.
次に第２図に示す通り、積層体３を有機粘着フィルム４
の表面に固定Ｊる。Next, as shown in FIG. 2, the laminate 3 is attached to an organic adhesive film 4.
fixed on the surface of the
積層体３を有機粘着フィルム４に固定後、第３図に示す
通り、ダイシングマシン５により積層体３のみにスリッ
ト６を形成して、個々のチップ７に切断する。スリット
６の幅は５０〜２００μｍ程度が好ましい。After fixing the laminate 3 to the organic adhesive film 4, as shown in FIG. 3, a dicing machine 5 forms slits 6 only in the laminate 3 and cuts it into individual chips 7. The width of the slit 6 is preferably about 50 to 200 μm.
積層体３を切断後、第４図に示ず通り、チップ７を有機
粘着フィルム４に固定したまま基板８表面に配置し、こ
の状態で焼成づる。基板８は焼成時にチップ７と反応し
ない材質と覆る。After cutting the laminate 3, as shown in FIG. 4, the chip 7 is placed on the surface of the substrate 8 while being fixed to the organic adhesive film 4, and fired in this state. The substrate 8 is covered with a material that does not react with the chip 7 during firing.
上記実施例では、積層体３を、有機粘着フィルム４に固
定したまま切断して、チップ７を形成できる。従って、
チップ７はお互いに接触することなく、所定の間隔を維
持できる。In the above embodiment, the chip 7 can be formed by cutting the laminate 3 while being fixed to the organic adhesive film 4. Therefore,
The chips 7 can maintain a predetermined distance without touching each other.
（発明の効果）
以上の通り、本発明によれば、有機粘着フィルムに固定
したままチップを形成できるため、作業が容易でチップ
どうしの接触による特性の劣化を防」トしつる積層セラ
ミックチップコンデンサの製造方法が得られる。(Effects of the Invention) As described above, according to the present invention, since chips can be formed while being fixed to an organic adhesive film, the work is easy and the deterioration of characteristics due to contact between chips is prevented. A manufacturing method is obtained.
第１図〜第４図は本発明の製造工程の図を示し、第１図
は積層体の正面図、第２図は積層体を有機粘着フィルム
に固定した状態の正面図、第３図は積層体を切断してい
る状態の斜視図、第４図はチップを基板に配置した状態
の正面図を示ザ。
１・・・内部電極、 ２・・・セラミックシート、３・
・・積層体、 ４・・・有機粘着フィルム、６・・・ス
リット、 ７・・・チップ、 ８・・・基板。
特許出願人 日立コンデンサ株式会社
第１図 第２図
第３図
手続補正出（自弁）
昭和／コ年ジ月り日Figures 1 to 4 show diagrams of the manufacturing process of the present invention; Figure 1 is a front view of the laminate, Figure 2 is a front view of the laminate fixed to an organic adhesive film, and Figure 3 is a front view of the laminate fixed to an organic adhesive film. FIG. 4 is a perspective view of the stacked body being cut, and FIG. 4 is a front view of the chip placed on the substrate. 1... Internal electrode, 2... Ceramic sheet, 3...
...Laminated body, 4...Organic adhesive film, 6...Slit, 7...Chip, 8...Substrate. Patent applicant Hitachi Capacitor Co., Ltd. Figure 1 Figure 2 Figure 3 Procedural amendment filed (self-defense) Date of Showa/Co.
Claims (1)
いて、 ｉ）複数個の内部電極を形成したセラミックシートを複
数枚、積層し圧着して積層する工程と、 ｉｉ）該積層したセラミックシートを有機粘着フィルム
上に固定する工程と、 ｉｉｉ）前記ヒラミックシートにスリットを形成して複
数個のチップに切断する工程と、 ｉｖ）前記有機粘着フィルム上に固定したまま該チップ
を基板上に配置する工程と、 ｖ）前記チップを焼成する工程と を順次行なうことを特徴とする積層セラミックチップコ
ンデンサの製造方法。(1) A method for manufacturing a multilayer ceramic chip capacitor, which includes: i) laminating and pressing a plurality of ceramic sheets each having a plurality of internal electrodes thereon; and ii) placing the laminated ceramic sheets on an organic adhesive film. iii) forming slits in the heramic sheet and cutting it into a plurality of chips; iv) arranging the chips on a substrate while being fixed on the organic adhesive film; v) A method for manufacturing a multilayer ceramic chip capacitor, characterized in that the steps of firing the chips are sequentially performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12023788A JPH01289234A (en) | 1988-05-17 | 1988-05-17 | Manufacture of laminated ceramic chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12023788A JPH01289234A (en) | 1988-05-17 | 1988-05-17 | Manufacture of laminated ceramic chip capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01289234A true JPH01289234A (en) | 1989-11-21 |
| JPH0472371B2 JPH0472371B2 (en) | 1992-11-18 |
Family
ID=14781238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12023788A Granted JPH01289234A (en) | 1988-05-17 | 1988-05-17 | Manufacture of laminated ceramic chip capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01289234A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5583738A (en) * | 1993-03-29 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Capacitor array |
| EP2267810A1 (en) * | 2008-04-18 | 2010-12-29 | Murata Manufacturing Co. Ltd. | Laminated piezoelectric ceramic element fabrication method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4981859A (en) * | 1972-12-13 | 1974-08-07 | ||
| JPS5988816A (en) * | 1982-11-12 | 1984-05-22 | 日本電気ホームエレクトロニクス株式会社 | Method of producing laminated ceramic part |
| JPS6050910A (en) * | 1983-08-30 | 1985-03-22 | 日本電気株式会社 | Method of producing laminated condenser |
| JPS61144810A (en) * | 1984-12-18 | 1986-07-02 | 関西日本電気株式会社 | Manufacture of laminated ceramic part |
| JPS61219124A (en) * | 1985-03-25 | 1986-09-29 | 関西日本電気株式会社 | Manufacture of ceramic part |
-
1988
- 1988-05-17 JP JP12023788A patent/JPH01289234A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4981859A (en) * | 1972-12-13 | 1974-08-07 | ||
| JPS5988816A (en) * | 1982-11-12 | 1984-05-22 | 日本電気ホームエレクトロニクス株式会社 | Method of producing laminated ceramic part |
| JPS6050910A (en) * | 1983-08-30 | 1985-03-22 | 日本電気株式会社 | Method of producing laminated condenser |
| JPS61144810A (en) * | 1984-12-18 | 1986-07-02 | 関西日本電気株式会社 | Manufacture of laminated ceramic part |
| JPS61219124A (en) * | 1985-03-25 | 1986-09-29 | 関西日本電気株式会社 | Manufacture of ceramic part |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5583738A (en) * | 1993-03-29 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Capacitor array |
| EP2267810A1 (en) * | 2008-04-18 | 2010-12-29 | Murata Manufacturing Co. Ltd. | Laminated piezoelectric ceramic element fabrication method |
| EP2267810A4 (en) * | 2008-04-18 | 2014-03-05 | Murata Manufacturing Co | Laminated piezoelectric ceramic element fabrication method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472371B2 (en) | 1992-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11340106A (en) | Laminated ceramic electronic parts and their sorting method | |
| JPH01289234A (en) | Manufacture of laminated ceramic chip capacitor | |
| JPS62171107A (en) | Manufacture of porcelain capacitor | |
| JPH0317207B2 (en) | ||
| JPH0265218A (en) | Manufacture of laminated ceramic capacitor | |
| JP2974153B2 (en) | Manufacturing method of multilayer ceramic capacitor | |
| KR20020065589A (en) | Method for production of a regular multi-layer construction, in particular for electrical double layer capacitors and the corresponding device | |
| JPH047575B2 (en) | ||
| JPH04165606A (en) | Chip bead inductor and manufacture thereof | |
| JPS61237413A (en) | Manufacture of laminate ceramic capacitor | |
| JPH0528888B2 (en) | ||
| JPH05275238A (en) | Chip inductor and its manufacture | |
| JPS6152969B2 (en) | ||
| JPH02229403A (en) | Manufacture of resistance array | |
| JPH0618148B2 (en) | Method for manufacturing porcelain capacitor | |
| JP2996049B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JPH11340088A (en) | Manufacture of capacitor array | |
| JPS5929412A (en) | Method of producing laminated condenser | |
| JPH0317206B2 (en) | ||
| JPH0426308B2 (en) | ||
| JPH04206808A (en) | Manufacture of ceramic laminate | |
| JPS61216368A (en) | Electric distortion effect element | |
| JPS647867B2 (en) | ||
| JPH0344096A (en) | Printing and laminating method for multilayer substrate | |
| JPS58131727A (en) | Method of producing laminated porcelain capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |