JPS5827934U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5827934U JPS5827934U JP1981120544U JP12054481U JPS5827934U JP S5827934 U JPS5827934 U JP S5827934U JP 1981120544 U JP1981120544 U JP 1981120544U JP 12054481 U JP12054481 U JP 12054481U JP S5827934 U JPS5827934 U JP S5827934U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor element
- integrated circuit
- semiconductor
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図a、 bは従来の集積回路装置を示す平面およ
び断面図、第2図a、 bは本考案の一実施例による
平面および断面図である。第3図a、 bは本考案の
他の実施例による平面および断面図である。 図中、1・・・・・・集積回路素子搭載部、2・・・・
・・導体ペース或は非職導体ペースト、3・・・・・・
集積回路素子、4・・・・・・外部導出リード、5・・
・・・・モールド樹脂、6・・・・・・回路配線、7・
・・・・・ボンディング電極′、8・・・・・・本考案
による凹部、9・・・・・・ワイヤ、10・・・・・・
集積回路素子の外辺、11・・・・・・モールド樹脂エ
リアを示す。
び断面図、第2図a、 bは本考案の一実施例による
平面および断面図である。第3図a、 bは本考案の
他の実施例による平面および断面図である。 図中、1・・・・・・集積回路素子搭載部、2・・・・
・・導体ペース或は非職導体ペースト、3・・・・・・
集積回路素子、4・・・・・・外部導出リード、5・・
・・・・モールド樹脂、6・・・・・・回路配線、7・
・・・・・ボンディング電極′、8・・・・・・本考案
による凹部、9・・・・・・ワイヤ、10・・・・・・
集積回路素子の外辺、11・・・・・・モールド樹脂エ
リアを示す。
Claims (1)
- 半導体素子搭載部に、半導体素子の面積より小さい凹部
を設けることを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981120544U JPS5827934U (ja) | 1981-08-13 | 1981-08-13 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981120544U JPS5827934U (ja) | 1981-08-13 | 1981-08-13 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5827934U true JPS5827934U (ja) | 1983-02-23 |
Family
ID=29914544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981120544U Pending JPS5827934U (ja) | 1981-08-13 | 1981-08-13 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5827934U (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366941A (ja) * | 1986-09-08 | 1988-03-25 | Mitsubishi Electric Corp | 半導体装置 |
JPS63147434U (ja) * | 1987-03-16 | 1988-09-28 | ||
JPS63147430U (ja) * | 1987-03-17 | 1988-09-28 | ||
JPS6457566A (en) * | 1987-08-26 | 1989-03-03 | Matsushita Electric Ind Co Ltd | Thermobattery |
JPH0343355A (ja) * | 1990-06-12 | 1991-02-25 | Mitsubishi Plastics Ind Ltd | 取手付プラスチックブローボトル |
JPH0343354A (ja) * | 1990-06-12 | 1991-02-25 | Mitsubishi Plastics Ind Ltd | 取手付プラスチックボトル |
JPH0343353A (ja) * | 1990-06-12 | 1991-02-25 | Mitsubishi Plastics Ind Ltd | プラスチックボトル |
JP4738983B2 (ja) * | 2005-11-08 | 2011-08-03 | ローム株式会社 | 半導体装置 |
-
1981
- 1981-08-13 JP JP1981120544U patent/JPS5827934U/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366941A (ja) * | 1986-09-08 | 1988-03-25 | Mitsubishi Electric Corp | 半導体装置 |
JPS63147434U (ja) * | 1987-03-16 | 1988-09-28 | ||
JPS63147430U (ja) * | 1987-03-17 | 1988-09-28 | ||
JPS6457566A (en) * | 1987-08-26 | 1989-03-03 | Matsushita Electric Ind Co Ltd | Thermobattery |
JPH0343355A (ja) * | 1990-06-12 | 1991-02-25 | Mitsubishi Plastics Ind Ltd | 取手付プラスチックブローボトル |
JPH0343354A (ja) * | 1990-06-12 | 1991-02-25 | Mitsubishi Plastics Ind Ltd | 取手付プラスチックボトル |
JPH0343353A (ja) * | 1990-06-12 | 1991-02-25 | Mitsubishi Plastics Ind Ltd | プラスチックボトル |
JP4738983B2 (ja) * | 2005-11-08 | 2011-08-03 | ローム株式会社 | 半導体装置 |
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