JPS5775431A - Formation of pattern - Google Patents
Formation of patternInfo
- Publication number
- JPS5775431A JPS5775431A JP15118480A JP15118480A JPS5775431A JP S5775431 A JPS5775431 A JP S5775431A JP 15118480 A JP15118480 A JP 15118480A JP 15118480 A JP15118480 A JP 15118480A JP S5775431 A JPS5775431 A JP S5775431A
- Authority
- JP
- Japan
- Prior art keywords
- taper
- resist
- etching
- pattern
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000005530 etching Methods 0.000 abstract 3
- 101000617707 Homo sapiens Pregnancy-specific beta-1-glycoprotein 11 Proteins 0.000 abstract 2
- 101000617728 Homo sapiens Pregnancy-specific beta-1-glycoprotein 9 Proteins 0.000 abstract 2
- 102100021983 Pregnancy-specific beta-1-glycoprotein 9 Human genes 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 238000001020 plasma etching Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To form taper in a layer to be treated, and to prevent disconnection of a semiconductor device by a method wherein a photo resist pattern is heat treated to form taper at the circumferential edge thereof, and reactive ion etching is performed. CONSTITUTION:The resist mask 12 is provided on PSG11 on an SI substrate 10, and heat treatment is performed to form taper at the side of pattern. The inclining angle of taper can be changed according to the kind of resist and heat treatment, and when various kind of resist having different sensitivity is applied, taper of various angle can be obtained. Mixed gas of CHF3 and O2 is used, the flow rate of O2 gas is selected, the etching ratios of PSG and the resist having equal film thickness are equalized, and when etching is performed, an opening having taper of the same shape with taper of the resist pattern 12 can be formed in PSG11, and the same time the resist mask 12 is incinerated to be removed. When thickness, etching rate of the resist mask and the layer to be treated are varied respectively, various taper shape can be formed, and disconnection at the step part can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15118480A JPS5775431A (en) | 1980-10-28 | 1980-10-28 | Formation of pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15118480A JPS5775431A (en) | 1980-10-28 | 1980-10-28 | Formation of pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5775431A true JPS5775431A (en) | 1982-05-12 |
Family
ID=15513113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15118480A Pending JPS5775431A (en) | 1980-10-28 | 1980-10-28 | Formation of pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5775431A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS582029A (en) * | 1981-06-26 | 1983-01-07 | Seiko Epson Corp | Etching method for insulating film on semiconductor substrate |
JPS5984529A (en) * | 1982-11-08 | 1984-05-16 | Nippon Denso Co Ltd | Forming method of pattern |
JPS6053073A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Solid-state image pickup element with microlens and manufacture thereof |
JPS6060757A (en) * | 1983-09-14 | 1985-04-08 | Hitachi Ltd | Image pickup element with microlens and manufacture thereof |
JPS6060756A (en) * | 1983-09-14 | 1985-04-08 | Hitachi Ltd | Solid-state image pickup element with microlens and manufacture thereof |
JPS611027A (en) * | 1984-05-18 | 1986-01-07 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS611028A (en) * | 1984-05-18 | 1986-01-07 | Fujitsu Ltd | Manufacture of semiconductor device |
US4824747A (en) * | 1985-10-21 | 1989-04-25 | General Electric Company | Method of forming a variable width channel |
US4837775A (en) * | 1985-10-21 | 1989-06-06 | General Electric Company | Electro-optic device having a laterally varying region |
JPH04266027A (en) * | 1990-10-29 | 1992-09-22 | Gold Star Co Ltd | Method for oblique etching |
JP2003029297A (en) * | 2001-07-13 | 2003-01-29 | Nec Kagoshima Ltd | Active matrix substrate and method of manufacturing the same |
-
1980
- 1980-10-28 JP JP15118480A patent/JPS5775431A/en active Pending
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS582029A (en) * | 1981-06-26 | 1983-01-07 | Seiko Epson Corp | Etching method for insulating film on semiconductor substrate |
JPS5984529A (en) * | 1982-11-08 | 1984-05-16 | Nippon Denso Co Ltd | Forming method of pattern |
JPH045260B2 (en) * | 1982-11-08 | 1992-01-30 | ||
JPH0512864B2 (en) * | 1983-09-02 | 1993-02-19 | Hitachi Ltd | |
JPS6053073A (en) * | 1983-09-02 | 1985-03-26 | Hitachi Ltd | Solid-state image pickup element with microlens and manufacture thereof |
JPS6060757A (en) * | 1983-09-14 | 1985-04-08 | Hitachi Ltd | Image pickup element with microlens and manufacture thereof |
JPS6060756A (en) * | 1983-09-14 | 1985-04-08 | Hitachi Ltd | Solid-state image pickup element with microlens and manufacture thereof |
JPH0570944B2 (en) * | 1983-09-14 | 1993-10-06 | Hitachi Ltd | |
JPS611027A (en) * | 1984-05-18 | 1986-01-07 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS611028A (en) * | 1984-05-18 | 1986-01-07 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH037146B2 (en) * | 1984-05-18 | 1991-01-31 | Fujitsu Ltd | |
JPH037145B2 (en) * | 1984-05-18 | 1991-01-31 | Fujitsu Ltd | |
US4837775A (en) * | 1985-10-21 | 1989-06-06 | General Electric Company | Electro-optic device having a laterally varying region |
US4824747A (en) * | 1985-10-21 | 1989-04-25 | General Electric Company | Method of forming a variable width channel |
JPH04266027A (en) * | 1990-10-29 | 1992-09-22 | Gold Star Co Ltd | Method for oblique etching |
JP2003029297A (en) * | 2001-07-13 | 2003-01-29 | Nec Kagoshima Ltd | Active matrix substrate and method of manufacturing the same |
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