JPS5742153A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5742153A
JPS5742153A JP11797880A JP11797880A JPS5742153A JP S5742153 A JPS5742153 A JP S5742153A JP 11797880 A JP11797880 A JP 11797880A JP 11797880 A JP11797880 A JP 11797880A JP S5742153 A JPS5742153 A JP S5742153A
Authority
JP
Japan
Prior art keywords
rays
alpha
substrate
reliability
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11797880A
Other languages
Japanese (ja)
Inventor
Tadashi Kuragami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11797880A priority Critical patent/JPS5742153A/en
Publication of JPS5742153A publication Critical patent/JPS5742153A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

PURPOSE:To increase the reliability of a face down type semiconductor device by providing a radiation shielding plate on an insulating substrate. CONSTITUTION:A highly pure Si thin plate 6 whose thickness is about 30mum is bonded on an alumina substrate 1 so as to cover the surface which faces an active region 5 of a semiconductor element 3 other than solder bump parts 4. The bumps 4 are contacted to electrodes 2 on said substrate 1, and compressed, heated, and bonded. Since the distance of intrusion of standard alpha-rays having energy of 5Mev into Si is about 25mum, the thin plate 6 sufficiently shields the alpha-rays, and prevents the occurrence of software errors. The alpha-rays from alumina around the shielding plate 6 has a very small incident angle with respect to the surface of the element 3, and does not reach the surface, or only very small amount of energy reaches the surface. In this simple constitution, the reliability of the device is greatly enhanced.
JP11797880A 1980-08-27 1980-08-27 Semiconductor device Pending JPS5742153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11797880A JPS5742153A (en) 1980-08-27 1980-08-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11797880A JPS5742153A (en) 1980-08-27 1980-08-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5742153A true JPS5742153A (en) 1982-03-09

Family

ID=14724978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11797880A Pending JPS5742153A (en) 1980-08-27 1980-08-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5742153A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196043A (en) * 1987-02-10 1988-08-15 Toshiba Corp Semiconductor device
JPH01242779A (en) * 1988-03-23 1989-09-27 Matsushita Electric Ind Co Ltd Device for treating thin film
US5219766A (en) * 1990-04-25 1993-06-15 Oki Electric Industry Co., Ltd. Semiconductor device having a radiation resistance and method for manufacturing same
US20200091087A1 (en) * 2018-09-18 2020-03-19 Toshiba Memory Corporation Semiconductor memory and semiconductor memory manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196043A (en) * 1987-02-10 1988-08-15 Toshiba Corp Semiconductor device
JPH01242779A (en) * 1988-03-23 1989-09-27 Matsushita Electric Ind Co Ltd Device for treating thin film
JPH0832956B2 (en) * 1988-03-23 1996-03-29 松下電器産業株式会社 Thin film processing equipment
US5219766A (en) * 1990-04-25 1993-06-15 Oki Electric Industry Co., Ltd. Semiconductor device having a radiation resistance and method for manufacturing same
US20200091087A1 (en) * 2018-09-18 2020-03-19 Toshiba Memory Corporation Semiconductor memory and semiconductor memory manufacturing method

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