JPS5742153A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5742153A JPS5742153A JP11797880A JP11797880A JPS5742153A JP S5742153 A JPS5742153 A JP S5742153A JP 11797880 A JP11797880 A JP 11797880A JP 11797880 A JP11797880 A JP 11797880A JP S5742153 A JPS5742153 A JP S5742153A
- Authority
- JP
- Japan
- Prior art keywords
- rays
- alpha
- substrate
- reliability
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
- H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11797880A JPS5742153A (en) | 1980-08-27 | 1980-08-27 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11797880A JPS5742153A (en) | 1980-08-27 | 1980-08-27 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5742153A true JPS5742153A (en) | 1982-03-09 |
Family
ID=14724978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11797880A Pending JPS5742153A (en) | 1980-08-27 | 1980-08-27 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5742153A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63196043A (ja) * | 1987-02-10 | 1988-08-15 | Toshiba Corp | 半導体装置 |
JPH01242779A (ja) * | 1988-03-23 | 1989-09-27 | Matsushita Electric Ind Co Ltd | 薄膜処理装置 |
US5219766A (en) * | 1990-04-25 | 1993-06-15 | Oki Electric Industry Co., Ltd. | Semiconductor device having a radiation resistance and method for manufacturing same |
US20200091087A1 (en) * | 2018-09-18 | 2020-03-19 | Toshiba Memory Corporation | Semiconductor memory and semiconductor memory manufacturing method |
-
1980
- 1980-08-27 JP JP11797880A patent/JPS5742153A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63196043A (ja) * | 1987-02-10 | 1988-08-15 | Toshiba Corp | 半導体装置 |
JPH01242779A (ja) * | 1988-03-23 | 1989-09-27 | Matsushita Electric Ind Co Ltd | 薄膜処理装置 |
JPH0832956B2 (ja) * | 1988-03-23 | 1996-03-29 | 松下電器産業株式会社 | 薄膜処理装置 |
US5219766A (en) * | 1990-04-25 | 1993-06-15 | Oki Electric Industry Co., Ltd. | Semiconductor device having a radiation resistance and method for manufacturing same |
US20200091087A1 (en) * | 2018-09-18 | 2020-03-19 | Toshiba Memory Corporation | Semiconductor memory and semiconductor memory manufacturing method |
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