JPS5735354A - Sealing method for semiconductor housing container - Google Patents

Sealing method for semiconductor housing container

Info

Publication number
JPS5735354A
JPS5735354A JP11123980A JP11123980A JPS5735354A JP S5735354 A JPS5735354 A JP S5735354A JP 11123980 A JP11123980 A JP 11123980A JP 11123980 A JP11123980 A JP 11123980A JP S5735354 A JPS5735354 A JP S5735354A
Authority
JP
Japan
Prior art keywords
sealing
leads
constitution
cap
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11123980A
Other languages
Japanese (ja)
Inventor
Hiroichi Matayoshi
Hiroshi Mugitani
Jun Fukaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11123980A priority Critical patent/JPS5735354A/en
Publication of JPS5735354A publication Critical patent/JPS5735354A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enhance reliability of a high frequency, high power transistor, by providing an insulating material whose thickness is the same as leads between the external leads provided on a substrate, on which semiconductor elements are mounted, and providing the sealing by a cap. CONSTITUTION:A metalized layer 3 of Mo-Mn is formed and the external leads 2 comprising Kovar and the like are provided on substrate 1 of BeO and the like. The emiconductor elements such as the high frequency, high power transistor are mounted on the metalized layer 3. In the gap between said leads 2, the insulating materials 10 whose thickness is the same as that of the lead 2 are provided, and the sealing part is flattened. Then, sealing is performed by the cap with bonding resin. In this constitution, pin holes are not generated even though internal pressure becomes high, and the perfect sealing can be accomplished. Therefore the reliability of the transistor can be enhanced.
JP11123980A 1980-08-13 1980-08-13 Sealing method for semiconductor housing container Pending JPS5735354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11123980A JPS5735354A (en) 1980-08-13 1980-08-13 Sealing method for semiconductor housing container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11123980A JPS5735354A (en) 1980-08-13 1980-08-13 Sealing method for semiconductor housing container

Publications (1)

Publication Number Publication Date
JPS5735354A true JPS5735354A (en) 1982-02-25

Family

ID=14556096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11123980A Pending JPS5735354A (en) 1980-08-13 1980-08-13 Sealing method for semiconductor housing container

Country Status (1)

Country Link
JP (1) JPS5735354A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020146U (en) * 1983-07-20 1985-02-12 日本電気株式会社 Hybrid integrated circuit device
JPH0358593U (en) * 1989-10-11 1991-06-07

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020146U (en) * 1983-07-20 1985-02-12 日本電気株式会社 Hybrid integrated circuit device
JPS6334277Y2 (en) * 1983-07-20 1988-09-12
JPH0358593U (en) * 1989-10-11 1991-06-07

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