JPS6481346A - Sealing structure of chip component of microwave integrated circuit - Google Patents

Abstract

PURPOSE:To easily readjust a circuit after a chip component to be necessarily sealed is hermetically sealed by adhering a cap and the like made of hermetically sealing insulator covering the component on a dielectric substrate, to enhance the performance and reliability of the circuit and to reduce the cost by sealing only the section of the component to be necessarily sealed so that the other circuit section remains in a nonsealing structure, and hermetically sealing the substrate with the cap by adhering the cap to the substrate. CONSTITUTION:A chip component 1 to be necessarily sealed and other component 11 are placed on a dielectric substrate 2 on which a passive circuit 3 is pattern-formed, connected to the circuit 3, and secured to one face of A metal housing 5. A cap 4 covers the component 1, and is hermetically adhered to the substrate 2. In this case, since the edge of the cap 4 and the adhering material are brought into contact with the insulated circuits 3 therebetween, it is necessary to so consider as not to reduce circuit characteristics with insulation particularly for high frequencies. Since only the section of the component to be necessarily sealed is sealed, the other circuit section remains in a nonsealing structure, it does not affect the influence to the constitution of a microwave integrated circuit. Accordingly, it can be easily readjusted even after sealing, and it can be reduced in size and cost, and enhanced in performance and reliability.