JPS6442135A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6442135A
JPS6442135A JP19857987A JP19857987A JPS6442135A JP S6442135 A JPS6442135 A JP S6442135A JP 19857987 A JP19857987 A JP 19857987A JP 19857987 A JP19857987 A JP 19857987A JP S6442135 A JPS6442135 A JP S6442135A
Authority
JP
Japan
Prior art keywords
heat
substrate
electrode plate
thickness
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19857987A
Other languages
Japanese (ja)
Inventor
Kunitaka Kamishima
Masamichi Yakake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP19857987A priority Critical patent/JPS6442135A/en
Publication of JPS6442135A publication Critical patent/JPS6442135A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance a heat-dissipating effect, to prevent the occurrence of insulation defect and to shorten an assembly duration by a method wherein a recessed part is formed on the side where an electrode plate is bonded to an insulating substrate and the thickness of the substrate between the electrode plate and a heat-dissipating plate is set to be small as compared with other thicknesses of the substrate. CONSTITUTION:A recessed part where a metallized part 12 is formed on its bottom face is formed on the side where an electrode plate is bonded; a substrate thickness t1 of an insulating substrate 11 between the electrode plate 3a and a heat-dissipating plate 2 is set to be small as compared with a substrate thickness t2 in other parts. The substrate thickness t2 of the insulating substrate 11 is set to be larger than the thickness of the substrate 11; by this setup, a creeping distance between the electrode plate 3a and the heat-dissipating plate 2 can be set to be a large size. Accordingly, it is possible to shorten a heat- conduction route between a semiconductor element 5 and the heat-dissipating plate 2. By this setup, it is possible to enhance a heat-dissipating effect, to prevent the occurrence of an insulation defect due to a breakdown of the insulating substrate and to shorten an assembly duration.
JP19857987A 1987-08-07 1987-08-07 Semiconductor device Pending JPS6442135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19857987A JPS6442135A (en) 1987-08-07 1987-08-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19857987A JPS6442135A (en) 1987-08-07 1987-08-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6442135A true JPS6442135A (en) 1989-02-14

Family

ID=16393524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19857987A Pending JPS6442135A (en) 1987-08-07 1987-08-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6442135A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5305691A (en) * 1992-02-10 1994-04-26 Komori Corporation Plate lockup device position detecting apparatus for printing press
US5576578A (en) * 1991-11-15 1996-11-19 Siemens Aktiengesellschaft High voltage insulating disk
JP2002062125A (en) * 2000-06-08 2002-02-28 Komori Corp Detector for movement amount of moving body
US6601504B2 (en) 2000-06-23 2003-08-05 Komori Corporation Cylinder apparatus for rotary printing press
EP2327548A1 (en) 2009-11-30 2011-06-01 Komori Corporation Register apparatus of printing press and register method for printing press
JP2014146723A (en) * 2013-01-30 2014-08-14 Hitachi Power Semiconductor Device Ltd Power semiconductor device
WO2018211751A1 (en) * 2017-05-18 2018-11-22 三菱電機株式会社 Semiconductor module and power conversion device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576578A (en) * 1991-11-15 1996-11-19 Siemens Aktiengesellschaft High voltage insulating disk
US5305691A (en) * 1992-02-10 1994-04-26 Komori Corporation Plate lockup device position detecting apparatus for printing press
JP2002062125A (en) * 2000-06-08 2002-02-28 Komori Corp Detector for movement amount of moving body
US6601504B2 (en) 2000-06-23 2003-08-05 Komori Corporation Cylinder apparatus for rotary printing press
EP2327548A1 (en) 2009-11-30 2011-06-01 Komori Corporation Register apparatus of printing press and register method for printing press
JP2014146723A (en) * 2013-01-30 2014-08-14 Hitachi Power Semiconductor Device Ltd Power semiconductor device
WO2018211751A1 (en) * 2017-05-18 2018-11-22 三菱電機株式会社 Semiconductor module and power conversion device

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