JPS57170554A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57170554A JPS57170554A JP56055550A JP5555081A JPS57170554A JP S57170554 A JPS57170554 A JP S57170554A JP 56055550 A JP56055550 A JP 56055550A JP 5555081 A JP5555081 A JP 5555081A JP S57170554 A JPS57170554 A JP S57170554A
- Authority
- JP
- Japan
- Prior art keywords
- film
- wire
- plasma cvd
- hole
- si3n4
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56055550A JPS57170554A (en) | 1981-04-15 | 1981-04-15 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56055550A JPS57170554A (en) | 1981-04-15 | 1981-04-15 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57170554A true JPS57170554A (en) | 1982-10-20 |
Family
ID=13001806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56055550A Pending JPS57170554A (en) | 1981-04-15 | 1981-04-15 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57170554A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5124269A (en) * | 1988-03-05 | 1992-06-23 | Kanegafuchi Kagaku Kogyo Kabushiki | Method of producing a semiconductor device using a wire mask having a specified diameter |
US6410981B2 (en) | 1997-10-24 | 2002-06-25 | Nec Corporation | Vented semiconductor device package having separate substrate, strengthening ring and cap structures |
US7202421B2 (en) | 2003-01-30 | 2007-04-10 | Seiko Epson Corporation | Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5459080A (en) * | 1977-10-19 | 1979-05-12 | Nec Corp | Semiconductor device |
-
1981
- 1981-04-15 JP JP56055550A patent/JPS57170554A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5459080A (en) * | 1977-10-19 | 1979-05-12 | Nec Corp | Semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5124269A (en) * | 1988-03-05 | 1992-06-23 | Kanegafuchi Kagaku Kogyo Kabushiki | Method of producing a semiconductor device using a wire mask having a specified diameter |
US6410981B2 (en) | 1997-10-24 | 2002-06-25 | Nec Corporation | Vented semiconductor device package having separate substrate, strengthening ring and cap structures |
US7202421B2 (en) | 2003-01-30 | 2007-04-10 | Seiko Epson Corporation | Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6410648A (en) | Method of multilayer metallization for integrated circuit | |
KR920009716B1 (ko) | 범프구조를 갖춘 반도체장치 | |
GB1527108A (en) | Methods of forming conductors on substrates involving electroplating | |
JPS57170554A (en) | Semiconductor device | |
JPS55111127A (en) | Method for forming solder bump | |
JPS5773952A (en) | Chip for face down bonding and production thereof | |
JPH0513933A (ja) | プリント配線板の導体パターン及びその形成方法 | |
JPS5529181A (en) | Production of semiconductor device | |
JPS54128669A (en) | Flip chip element | |
JPS5730353A (en) | Semiconductor device | |
JPH04116831A (ja) | 半導体装置の製造方法 | |
JPS54117680A (en) | Semiconductor device | |
JPS57183053A (en) | Semiconductor device | |
JPS5790963A (en) | Manufacture of semiconductor device | |
JP2720442B2 (ja) | 磁気抵抗素子の製造方法 | |
JPS57201052A (en) | Bump electrode | |
JPS6412554A (en) | Manufacture of semiconductor device | |
JPS63161646A (ja) | 半導体装置の製造方法 | |
JPS57114255A (en) | Semiconductor integrated circuit and manufacture thereof | |
JPS5632748A (en) | Ic with bump and manufacture thereof | |
JPS5612751A (en) | Production of semiconductor device | |
Bacquias | Galvanic and Chemical Techniques in the Electronic Industry | |
JPS5674945A (en) | Electrode forming method of semiconductor element | |
KR950007031A (ko) | 반도체 소자의 금속배선 형성방법 | |
JPS57188694A (en) | Formation of metallic film on transparent conductive film |