JPS57154878A - Semiconductor sensor - Google Patents
Semiconductor sensorInfo
- Publication number
- JPS57154878A JPS57154878A JP3936981A JP3936981A JPS57154878A JP S57154878 A JPS57154878 A JP S57154878A JP 3936981 A JP3936981 A JP 3936981A JP 3936981 A JP3936981 A JP 3936981A JP S57154878 A JPS57154878 A JP S57154878A
- Authority
- JP
- Japan
- Prior art keywords
- diameter
- specified
- circular groove
- exceed
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
PURPOSE:To augment the reliability when an overload is impressed by a method wherein a ratio B/A comprising the diameter B of the central thick wall of a pressure sensing element and the outside diameter A of a circular groove is specified to exceed 0.5 and the hole diameter C of a high-insulating material is specified to be B<C<A. CONSTITUTION:The diaphragm type pressure sensing element 1, the high-insulating material 2 with the thermal expansion coefficient similar to that of said element 1 and the metal supporter 3 are provided. The piezo resistor element 5 is mounted respectively on the inside and outside periphery of the thin wall layer corresponding to the circular groove. Then the ratio B/A comprising the diameter B of the central thick wall of said element 1 and the outside diameter A of the circular groove is specified to exceed 0.5 and said element 5 is full-bridge mounted to secure good convertible sensitivity against the low pressure exceeding 1kgf/cm<2>. On the other hand, the stress is concentrated in the joint of a diaphragm and glass section to prevent the joint from exfoliating by means of specifying the diameter Ag of the pierced hole of the glass section to be B<Ag'<A.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3936981A JPS57154878A (en) | 1981-03-20 | 1981-03-20 | Semiconductor sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3936981A JPS57154878A (en) | 1981-03-20 | 1981-03-20 | Semiconductor sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57154878A true JPS57154878A (en) | 1982-09-24 |
JPS6336155B2 JPS6336155B2 (en) | 1988-07-19 |
Family
ID=12551133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3936981A Granted JPS57154878A (en) | 1981-03-20 | 1981-03-20 | Semiconductor sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57154878A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320457U (en) * | 1986-07-23 | 1988-02-10 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0389830A (en) * | 1989-09-01 | 1991-04-15 | Matsushita Electric Ind Co Ltd | Brush holding structure |
-
1981
- 1981-03-20 JP JP3936981A patent/JPS57154878A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320457U (en) * | 1986-07-23 | 1988-02-10 | ||
JPH056672Y2 (en) * | 1986-07-23 | 1993-02-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS6336155B2 (en) | 1988-07-19 |
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