JPS5325356A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5325356A
JPS5325356A JP9970876A JP9970876A JPS5325356A JP S5325356 A JPS5325356 A JP S5325356A JP 9970876 A JP9970876 A JP 9970876A JP 9970876 A JP9970876 A JP 9970876A JP S5325356 A JPS5325356 A JP S5325356A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
pellet
variation
monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9970876A
Other languages
Japanese (ja)
Other versions
JPS605057B2 (en
Inventor
Michio Tanimoto
Shunichiro Fujioka
Shunei Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51099708A priority Critical patent/JPS605057B2/en
Publication of JPS5325356A publication Critical patent/JPS5325356A/en
Publication of JPS605057B2 publication Critical patent/JPS605057B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: Accurate bonding position is obtained, positive wire bonding is performed and monitoring of wire bonding state is made easy by measuring the position of a pellet correctly irrespective of any variation in the thickness of the pellet and substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP51099708A 1976-08-23 1976-08-23 wire bonding equipment Expired JPS605057B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51099708A JPS605057B2 (en) 1976-08-23 1976-08-23 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51099708A JPS605057B2 (en) 1976-08-23 1976-08-23 wire bonding equipment

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP52114597A Division JPS6025026B2 (en) 1977-09-26 1977-09-26 wire bonding equipment
JP59147504A Division JPS6063945A (en) 1984-07-18 1984-07-18 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS5325356A true JPS5325356A (en) 1978-03-09
JPS605057B2 JPS605057B2 (en) 1985-02-08

Family

ID=14254557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51099708A Expired JPS605057B2 (en) 1976-08-23 1976-08-23 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS605057B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60150638A (en) * 1984-01-18 1985-08-08 Marine Instr Co Ltd Wirebonding device
US7886956B2 (en) 2008-01-24 2011-02-15 Shinkawa Ltd. Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH059806Y2 (en) * 1985-05-31 1993-03-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60150638A (en) * 1984-01-18 1985-08-08 Marine Instr Co Ltd Wirebonding device
US7886956B2 (en) 2008-01-24 2011-02-15 Shinkawa Ltd. Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

Also Published As

Publication number Publication date
JPS605057B2 (en) 1985-02-08

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