JPS56139193A - Treatment of waste copper plating solution - Google Patents
Treatment of waste copper plating solutionInfo
- Publication number
- JPS56139193A JPS56139193A JP18283380A JP18283380A JPS56139193A JP S56139193 A JPS56139193 A JP S56139193A JP 18283380 A JP18283380 A JP 18283380A JP 18283380 A JP18283380 A JP 18283380A JP S56139193 A JPS56139193 A JP S56139193A
- Authority
- JP
- Japan
- Prior art keywords
- eluate
- copper
- waste
- solution
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To dispose a waste copper plating solution without discharging any of the waste solution outside the system for the prevention of environmental contamination, by generating an eluate from the waste plating solution containing copper with an ion exchange resin, adjusting the acidity of the eluate, adding copper hydroxide to the eluate, and electrolyzing the treated eluate as an electrolyte with a copper cathode.
CONSTITUTION: A waste copper plating solution is treated with an ion exchange resin to obtain an ion-exchanged eluate. The eluate is concentrated by a chemical method or the like to obtain an aqueous solution containing copper sulfate and sodium sulfate. Sulfuric acid is added to the concentrated eluate to adjust its acidity. To the treated eluate is added the copper hydroxide, which is generated in the succeeding step, to increase the copper sulfate concentration of a solution to be electrolyzed, because an electrolysis efficiency is higher as the increase of the copper sulfate concentration. The eluate is electrolyzed with a copper cathode. By the electrolysis, copper is deposited onto the cathode. The solution after electrolyzed becomes a solution mainly composed of unelectrolyzed copper sulfate and sulfuric acid.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18283380A JPS56139193A (en) | 1980-12-25 | 1980-12-25 | Treatment of waste copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18283380A JPS56139193A (en) | 1980-12-25 | 1980-12-25 | Treatment of waste copper plating solution |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4734577A Division JPS53132470A (en) | 1977-04-26 | 1977-04-26 | Treatment of waste plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56139193A true JPS56139193A (en) | 1981-10-30 |
Family
ID=16125258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18283380A Pending JPS56139193A (en) | 1980-12-25 | 1980-12-25 | Treatment of waste copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56139193A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100798450B1 (en) | 2006-07-28 | 2008-01-28 | 태랑엔지니어링(주) | Regeneration process for producing high-concentrate cuso4 solution from cu-waste water |
| WO2008039192A1 (en) * | 2006-09-26 | 2008-04-03 | Everclear Solutions, Inc. | Devices and methods of copper recovery |
| CN102277600A (en) * | 2011-08-18 | 2011-12-14 | 朱国军 | Surface treatment method for electroplated copper door |
| CN104418408A (en) * | 2013-08-30 | 2015-03-18 | 上海轻工业研究所有限公司 | Copper-electroplating wastewater treatment method and copper-electroplating wastewater treatment equipment |
-
1980
- 1980-12-25 JP JP18283380A patent/JPS56139193A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100798450B1 (en) | 2006-07-28 | 2008-01-28 | 태랑엔지니어링(주) | Regeneration process for producing high-concentrate cuso4 solution from cu-waste water |
| WO2008039192A1 (en) * | 2006-09-26 | 2008-04-03 | Everclear Solutions, Inc. | Devices and methods of copper recovery |
| WO2008039478A3 (en) * | 2006-09-26 | 2008-10-16 | Applied Intellectual Capital | Devices and methods of copper recovery |
| CN102277600A (en) * | 2011-08-18 | 2011-12-14 | 朱国军 | Surface treatment method for electroplated copper door |
| CN104418408A (en) * | 2013-08-30 | 2015-03-18 | 上海轻工业研究所有限公司 | Copper-electroplating wastewater treatment method and copper-electroplating wastewater treatment equipment |
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