JPS5559724A - Spinner device - Google Patents

Spinner device

Info

Publication number
JPS5559724A
JPS5559724A JP13163578A JP13163578A JPS5559724A JP S5559724 A JPS5559724 A JP S5559724A JP 13163578 A JP13163578 A JP 13163578A JP 13163578 A JP13163578 A JP 13163578A JP S5559724 A JPS5559724 A JP S5559724A
Authority
JP
Japan
Prior art keywords
wafer
treatment liquid
nozzle
liquid
tangent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13163578A
Other languages
Japanese (ja)
Inventor
Toshio Nonaka
Tamotsu Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13163578A priority Critical patent/JPS5559724A/en
Publication of JPS5559724A publication Critical patent/JPS5559724A/en
Pending legal-status Critical Current

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Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To prevent treatment liquid from depositing or remaining on the outer periphery of the bottom face of a work, gas injection on the nozzle face is directed at a given angle to the tangent of a wafer and against the direction of the wafer rotation.
CONSTITUTION: A wafer 2 is mounted on a rotory table 1 and fixed by vacuum sucking, then rotated in high speed. A treatment liquid is injected from the supply nozzle 3 onto the wafer 2 for coating. To prevent splashed liquid from depositing on the wafer 2, a flat guide plate 4 is placed underneath the wafer 2 to cover the bottom of the wafer 2 in contactless manner. On top of the plate 4, nozzles 5 are placed at a given angle to the tangent of the wafer and against the direction of the wafer rotation. This greatly increases collosion between nozzle-jetted-gas and the treatment liquid and effectively blows off the liquid coming down to the bottom side of the wafer.
COPYRIGHT: (C)1980,JPO&Japio
JP13163578A 1978-10-27 1978-10-27 Spinner device Pending JPS5559724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13163578A JPS5559724A (en) 1978-10-27 1978-10-27 Spinner device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13163578A JPS5559724A (en) 1978-10-27 1978-10-27 Spinner device

Publications (1)

Publication Number Publication Date
JPS5559724A true JPS5559724A (en) 1980-05-06

Family

ID=15062651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13163578A Pending JPS5559724A (en) 1978-10-27 1978-10-27 Spinner device

Country Status (1)

Country Link
JP (1) JPS5559724A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020894A2 (en) * 1999-01-15 2000-07-19 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Device for etching a disk-like object

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020894A2 (en) * 1999-01-15 2000-07-19 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Device for etching a disk-like object
EP1020894A3 (en) * 1999-01-15 2004-10-27 Sez Ag Device for etching a disk-like object

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