JPS55166923A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS55166923A
JPS55166923A JP7538579A JP7538579A JPS55166923A JP S55166923 A JPS55166923 A JP S55166923A JP 7538579 A JP7538579 A JP 7538579A JP 7538579 A JP7538579 A JP 7538579A JP S55166923 A JPS55166923 A JP S55166923A
Authority
JP
Japan
Prior art keywords
resist
wafer
enclosure
ejected
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7538579A
Other languages
Japanese (ja)
Inventor
Tsuneo Atsumi
Chiharu Kato
Kiichi Usuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7538579A priority Critical patent/JPS55166923A/en
Publication of JPS55166923A publication Critical patent/JPS55166923A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To enable application of a resist film of uniform thickness including edged regions on a wafer by a method wherein photo resist is ejected into vacuum atmosphere and it is applied on a wafer by means of spinner coating. CONSTITUTION:An enclosure 20 is evacuated by suction from a suction tap 21, and resist which is stored in a resist reservoir 24 is ejected from a nozzle 22 which is provided on the upper side of the enclosure, through a cock 23 and into the enclosure 20. And a wafer 11 is placed on a spinner head 25 which is installed to face with the nozzle 22 in the enclosure 20, and photoresist is applied on the surface of the wafer 11 being rotated with a rotating shaft 26. By this method volatile component in resist is evaporated at the moment of ejection and does not get to the wafer 11 directly, and resist can be applied to form uniform thickness including an uneven region such as an edged region.
JP7538579A 1979-06-15 1979-06-15 Manufacture of semiconductor device Pending JPS55166923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7538579A JPS55166923A (en) 1979-06-15 1979-06-15 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7538579A JPS55166923A (en) 1979-06-15 1979-06-15 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS55166923A true JPS55166923A (en) 1980-12-26

Family

ID=13574668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7538579A Pending JPS55166923A (en) 1979-06-15 1979-06-15 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS55166923A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987006725A2 (en) * 1986-04-22 1987-11-05 Thomson-Csf Method and apparatus for spreading resin by centrifugation
EP1840940A1 (en) * 2006-03-28 2007-10-03 Erich Dipl.-Ing. Thallner Apparatus and process for coating micro or nanostructured substrates
WO2007112833A1 (en) * 2006-03-28 2007-10-11 Erich Thallner Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987006725A2 (en) * 1986-04-22 1987-11-05 Thomson-Csf Method and apparatus for spreading resin by centrifugation
WO1987006725A3 (en) * 1986-04-22 1987-12-17 Thomson Csf Method and apparatus for spreading resin by centrifugation
EP1840940A1 (en) * 2006-03-28 2007-10-03 Erich Dipl.-Ing. Thallner Apparatus and process for coating micro or nanostructured substrates
WO2007112833A1 (en) * 2006-03-28 2007-10-11 Erich Thallner Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate
JP2007260895A (en) * 2006-03-28 2007-10-11 Erich Thallner Apparatus and method of coating micro-structured and/or nano-structured structural substrate
JP2009531840A (en) * 2006-03-28 2009-09-03 エリッヒ・タールナー Devices and methods for coating microstructured and / or nanostructured structural substrates, and coated structural substrates
US8586132B2 (en) 2006-03-28 2013-11-19 Erich Thallner Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate

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