JPS5512750A - Resist application device - Google Patents

Resist application device

Info

Publication number
JPS5512750A
JPS5512750A JP8560278A JP8560278A JPS5512750A JP S5512750 A JPS5512750 A JP S5512750A JP 8560278 A JP8560278 A JP 8560278A JP 8560278 A JP8560278 A JP 8560278A JP S5512750 A JPS5512750 A JP S5512750A
Authority
JP
Japan
Prior art keywords
resist
circumferential area
wafer surface
nozzle
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8560278A
Other languages
Japanese (ja)
Inventor
Masato Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8560278A priority Critical patent/JPS5512750A/en
Publication of JPS5512750A publication Critical patent/JPS5512750A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

Landscapes

  • Spray Control Apparatus (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To eliminate rising of resist on a wafer surface circumferential area by a resist-solving type solvent to be jetted out from a nozzle arranged above the semiconductor wafer surface circumferential area.
CONSTITUTION: A nozzle 10 for jetting of an organic solvent 11 for solving resist, such as sczol, is arranged above surface circumferential area of a semiconductor wafer 4. When resist liquid supplied onto the wafer surface is centrifugally applied by high speed rotation of the semiconductor wafer 4, by allowing the organic slovent 11 to be jetted from the jetting nozzle 10 toward circumferential area of the wafer surface at the same time. It is possible to obtain on the circumferential area a uniform resist coating film which is free from rising of resist.
COPYRIGHT: (C)1980,JPO&Japio
JP8560278A 1978-07-12 1978-07-12 Resist application device Pending JPS5512750A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8560278A JPS5512750A (en) 1978-07-12 1978-07-12 Resist application device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8560278A JPS5512750A (en) 1978-07-12 1978-07-12 Resist application device

Publications (1)

Publication Number Publication Date
JPS5512750A true JPS5512750A (en) 1980-01-29

Family

ID=13863366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8560278A Pending JPS5512750A (en) 1978-07-12 1978-07-12 Resist application device

Country Status (1)

Country Link
JP (1) JPS5512750A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57156067A (en) * 1981-03-23 1982-09-27 Hitachi Ltd Resist coater
JPS57162336A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Coating method of resist on wafer
US5028955A (en) * 1989-02-16 1991-07-02 Tokyo Electron Limited Exposure apparatus
US5238878A (en) * 1992-02-18 1993-08-24 Nec Corporation Film forming method by spin coating in production of semiconductor device
JPH07302745A (en) * 1994-05-10 1995-11-14 Hitachi Ltd Coating method and device
JP2020004877A (en) * 2018-06-28 2020-01-09 キヤノン株式会社 Flattening device, flattening method, article manufacturing method, and method of creating droplet arrangement pattern data

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57156067A (en) * 1981-03-23 1982-09-27 Hitachi Ltd Resist coater
JPS57162336A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Coating method of resist on wafer
US5028955A (en) * 1989-02-16 1991-07-02 Tokyo Electron Limited Exposure apparatus
US5238878A (en) * 1992-02-18 1993-08-24 Nec Corporation Film forming method by spin coating in production of semiconductor device
JPH07302745A (en) * 1994-05-10 1995-11-14 Hitachi Ltd Coating method and device
JP2020004877A (en) * 2018-06-28 2020-01-09 キヤノン株式会社 Flattening device, flattening method, article manufacturing method, and method of creating droplet arrangement pattern data

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