JPS552766A - Production of platinum powder or platinum powder contained paste and platinum powder - Google Patents
Production of platinum powder or platinum powder contained paste and platinum powderInfo
- Publication number
- JPS552766A JPS552766A JP7550078A JP7550078A JPS552766A JP S552766 A JPS552766 A JP S552766A JP 7550078 A JP7550078 A JP 7550078A JP 7550078 A JP7550078 A JP 7550078A JP S552766 A JPS552766 A JP S552766A
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- powder
- platinum powder
- paste
- dispersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title abstract 12
- 239000000843 powder Substances 0.000 abstract 3
- 239000011230 binding agent Substances 0.000 abstract 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 229910052697 platinum Inorganic materials 0.000 abstract 2
- 150000003058 platinum compounds Chemical class 0.000 abstract 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 abstract 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 abstract 1
- 239000005695 Ammonium acetate Substances 0.000 abstract 1
- 239000001856 Ethyl cellulose Substances 0.000 abstract 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 abstract 1
- 229940043376 ammonium acetate Drugs 0.000 abstract 1
- 235000019257 ammonium acetate Nutrition 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 229920001249 ethyl cellulose Polymers 0.000 abstract 1
- 235000019325 ethyl cellulose Nutrition 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 150000002736 metal compounds Chemical class 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Abstract
PURPOSE: To obtain platinum paste promising in the field of electronic industry by combining the platinum powder of the specific particle size and bulk density comprising reducing and depositing platinum compound under the specific conditions with inorganic binders and metal powder and letting the same be dispersed in an inert liquid vehicle.
CONSTITUTION: Platinum compound such as chloroplatinic acid or other is reduced by using a reducing agent such as hydrazine hydrochloride or other and a buffer such as ammonium acetate under the conditions of pH 3 or over and reaction temperatures 10 to 100°C, to allow platinum powder to deposit. This platinum powder is separated from the solution and the residual salts are washed away, after which it is dried, by which nearly spherical platinum powder of particle sizes 0.1 to 7μ, bulk densities 3 to 10g/cm2 is obtained. This platinum powder is combined with suitable amounts of inorganic binder powder such as glass frit or other and powder of metals or metal compounds such as Bi2O3 or other and these are dispersed in the vehicle composed of ethyl cellulose and butyl carbitol acetate, etc. The mixture is prepared into paste. If this paste is coated on a substrate and is baked, the superior platinum film is formed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53075500A JPS5855204B2 (en) | 1978-06-23 | 1978-06-23 | Method for producing platinum powder for printing paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53075500A JPS5855204B2 (en) | 1978-06-23 | 1978-06-23 | Method for producing platinum powder for printing paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS552766A true JPS552766A (en) | 1980-01-10 |
| JPS5855204B2 JPS5855204B2 (en) | 1983-12-08 |
Family
ID=13578035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53075500A Expired JPS5855204B2 (en) | 1978-06-23 | 1978-06-23 | Method for producing platinum powder for printing paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5855204B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997030811A1 (en) * | 1996-02-21 | 1997-08-28 | Robert Bosch Gmbh | Process for the reductive precipitation of noble metal submicron powder |
| CN102717090A (en) * | 2011-03-31 | 2012-10-10 | 北京有色金属研究总院 | Method for preparing ultrafine platinum powder by adopting liquid-phase reduction |
| JP2014181164A (en) * | 2013-03-21 | 2014-09-29 | Kyoto Elex Kk | Metal paste composition for ceramic material |
| US20150004359A1 (en) * | 2013-06-27 | 2015-01-01 | Heraeus Precious Metals North America Conshohocken LLP | Platinum containing conductive paste |
| CN104550999A (en) * | 2014-12-19 | 2015-04-29 | 昆明珀玺金属材料有限公司 | Method for preparing dispersive submicron honeycomb-shaped spherical platinum powder |
| JP2015117387A (en) * | 2013-12-16 | 2015-06-25 | 住友金属鉱山株式会社 | Method for producing high-purity platinum powder |
| JP2015209569A (en) * | 2014-04-25 | 2015-11-24 | アサヒプリテック株式会社 | Production method of platinum powder |
| CN114038607A (en) * | 2021-09-29 | 2022-02-11 | 航天特种材料及工艺技术研究所 | Platinum slurry for ceramic substrate FSS structure and preparation method thereof |
-
1978
- 1978-06-23 JP JP53075500A patent/JPS5855204B2/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997030811A1 (en) * | 1996-02-21 | 1997-08-28 | Robert Bosch Gmbh | Process for the reductive precipitation of noble metal submicron powder |
| CN102717090A (en) * | 2011-03-31 | 2012-10-10 | 北京有色金属研究总院 | Method for preparing ultrafine platinum powder by adopting liquid-phase reduction |
| JP2014181164A (en) * | 2013-03-21 | 2014-09-29 | Kyoto Elex Kk | Metal paste composition for ceramic material |
| US20150004359A1 (en) * | 2013-06-27 | 2015-01-01 | Heraeus Precious Metals North America Conshohocken LLP | Platinum containing conductive paste |
| US9892816B2 (en) * | 2013-06-27 | 2018-02-13 | Heraeus Precious Metals North America Conshohocken Llc | Platinum containing conductive paste |
| JP2015117387A (en) * | 2013-12-16 | 2015-06-25 | 住友金属鉱山株式会社 | Method for producing high-purity platinum powder |
| JP2015209569A (en) * | 2014-04-25 | 2015-11-24 | アサヒプリテック株式会社 | Production method of platinum powder |
| CN104550999A (en) * | 2014-12-19 | 2015-04-29 | 昆明珀玺金属材料有限公司 | Method for preparing dispersive submicron honeycomb-shaped spherical platinum powder |
| CN114038607A (en) * | 2021-09-29 | 2022-02-11 | 航天特种材料及工艺技术研究所 | Platinum slurry for ceramic substrate FSS structure and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5855204B2 (en) | 1983-12-08 |
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