JPS57162336A - Coating method of resist on wafer - Google Patents
Coating method of resist on waferInfo
- Publication number
- JPS57162336A JPS57162336A JP4705881A JP4705881A JPS57162336A JP S57162336 A JPS57162336 A JP S57162336A JP 4705881 A JP4705881 A JP 4705881A JP 4705881 A JP4705881 A JP 4705881A JP S57162336 A JPS57162336 A JP S57162336A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- wafer
- outer periphery
- rotating
- circular shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To improve the manufacturing yield of a semiconductor device by coating a resist on a wafer of approximately circular shape and then removing the resist of the outer periphery while rotating the wafer, thereby preventing the notch of the resist at the outer periphery. CONSTITUTION:A resist 2 is coated while rotating a wafer 1 of approximately circular shape, and the resist 2'' is then removed at the outer periphery while rotating the wafer 1. For example, a positive resist 2 is rotatably coated on the wafer 1 placed on a rotary base 3, an energy beam such as ultraviolet ray is emitted through an optical fiber 5 to the resist 2'' of the outer periphery while rotating the wafer, thereby allowing the resist 2'' of the outer periphery to be sensed with the light. Thereafter, when the resist 2 of the center is exposed in the prescribed pattern and is developed, the resist 2'' of the periphery is simultaneously removed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4705881A JPS57162336A (en) | 1981-03-30 | 1981-03-30 | Coating method of resist on wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4705881A JPS57162336A (en) | 1981-03-30 | 1981-03-30 | Coating method of resist on wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57162336A true JPS57162336A (en) | 1982-10-06 |
Family
ID=12764550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4705881A Pending JPS57162336A (en) | 1981-03-30 | 1981-03-30 | Coating method of resist on wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57162336A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59138335A (en) * | 1983-01-28 | 1984-08-08 | Toshiba Corp | Exposing device for resist on end portion of wafer |
JPS59118436U (en) * | 1983-01-31 | 1984-08-10 | 松下電工株式会社 | Structure of washstand storage area |
JPS61278148A (en) * | 1985-06-01 | 1986-12-09 | Nippon Gakki Seizo Kk | Forming method for glass coating |
JPS62133746A (en) * | 1985-12-06 | 1987-06-16 | Hitachi Ltd | Arrangement of semiconductor element |
JPS6486520A (en) * | 1987-11-04 | 1989-03-31 | Ricoh Kk | Exposure method |
JPH0370119A (en) * | 1989-08-09 | 1991-03-26 | Fujitsu Ltd | Manufacture of semiconductor device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111573A (en) * | 1974-07-19 | 1976-01-29 | Nippon Electric Co | Handotaisoshino seizohoho |
JPS5337706A (en) * | 1976-09-18 | 1978-04-07 | Nisshin Oil Mills Ltd:The | Production of fatty acids |
JPS5512750A (en) * | 1978-07-12 | 1980-01-29 | Mitsubishi Electric Corp | Resist application device |
JPS57126134A (en) * | 1981-01-28 | 1982-08-05 | Nec Corp | Processing system for wafer |
-
1981
- 1981-03-30 JP JP4705881A patent/JPS57162336A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111573A (en) * | 1974-07-19 | 1976-01-29 | Nippon Electric Co | Handotaisoshino seizohoho |
JPS5337706A (en) * | 1976-09-18 | 1978-04-07 | Nisshin Oil Mills Ltd:The | Production of fatty acids |
JPS5512750A (en) * | 1978-07-12 | 1980-01-29 | Mitsubishi Electric Corp | Resist application device |
JPS57126134A (en) * | 1981-01-28 | 1982-08-05 | Nec Corp | Processing system for wafer |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59138335A (en) * | 1983-01-28 | 1984-08-08 | Toshiba Corp | Exposing device for resist on end portion of wafer |
JPS59118436U (en) * | 1983-01-31 | 1984-08-10 | 松下電工株式会社 | Structure of washstand storage area |
JPH0354595Y2 (en) * | 1983-01-31 | 1991-12-03 | ||
JPS61278148A (en) * | 1985-06-01 | 1986-12-09 | Nippon Gakki Seizo Kk | Forming method for glass coating |
JPS62133746A (en) * | 1985-12-06 | 1987-06-16 | Hitachi Ltd | Arrangement of semiconductor element |
JPS6486520A (en) * | 1987-11-04 | 1989-03-31 | Ricoh Kk | Exposure method |
JPH0370119A (en) * | 1989-08-09 | 1991-03-26 | Fujitsu Ltd | Manufacture of semiconductor device |
JP2586144B2 (en) * | 1989-08-09 | 1997-02-26 | 富士通株式会社 | Method for manufacturing semiconductor device |
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