JPS5250167A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5250167A
JPS5250167A JP50125967A JP12596775A JPS5250167A JP S5250167 A JPS5250167 A JP S5250167A JP 50125967 A JP50125967 A JP 50125967A JP 12596775 A JP12596775 A JP 12596775A JP S5250167 A JPS5250167 A JP S5250167A
Authority
JP
Japan
Prior art keywords
gold
projection
semiconductor device
bonding
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50125967A
Other languages
Japanese (ja)
Inventor
Hiroyuki Miyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP50125967A priority Critical patent/JPS5250167A/en
Publication of JPS5250167A publication Critical patent/JPS5250167A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: In bonding a projection to a gold or gold-plated external lead, arrangement is so made that while bonding characteristics by the eutectic of gold and tin are obtained the projection may be made by the same process as for the projection whose outmost layer is composed of gold.
COPYRIGHT: (C)1977,JPO&Japio
JP50125967A 1975-10-21 1975-10-21 Semiconductor device Pending JPS5250167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50125967A JPS5250167A (en) 1975-10-21 1975-10-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50125967A JPS5250167A (en) 1975-10-21 1975-10-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5250167A true JPS5250167A (en) 1977-04-21

Family

ID=14923398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50125967A Pending JPS5250167A (en) 1975-10-21 1975-10-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5250167A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164557A (en) * 1980-05-23 1981-12-17 Ricoh Co Ltd Tin bump
US5136360A (en) * 1989-08-07 1992-08-04 Hitachi, Ltd. Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals
US5550427A (en) * 1991-11-19 1996-08-27 Nec Corporation Substrate contact electrode having refractory metal bump structure with reinforcement sidewall film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164557A (en) * 1980-05-23 1981-12-17 Ricoh Co Ltd Tin bump
US5136360A (en) * 1989-08-07 1992-08-04 Hitachi, Ltd. Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals
US5550427A (en) * 1991-11-19 1996-08-27 Nec Corporation Substrate contact electrode having refractory metal bump structure with reinforcement sidewall film

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