JPS53117378A - Assembling device of semiconductor device - Google Patents

Assembling device of semiconductor device

Info

Publication number
JPS53117378A
JPS53117378A JP3255377A JP3255377A JPS53117378A JP S53117378 A JPS53117378 A JP S53117378A JP 3255377 A JP3255377 A JP 3255377A JP 3255377 A JP3255377 A JP 3255377A JP S53117378 A JPS53117378 A JP S53117378A
Authority
JP
Japan
Prior art keywords
assembling
semiconductor device
semiconductor
diebonding
obviate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3255377A
Other languages
Japanese (ja)
Inventor
Yoshio Agata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3255377A priority Critical patent/JPS53117378A/en
Publication of JPS53117378A publication Critical patent/JPS53117378A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To obviate the application of more than a fixed load to an element by beforehand providing a charge sensitive device to the suction nozzle which presses the semiconductor element to an external terminal at the time of diebonding the semiconductor device.
COPYRIGHT: (C)1978,JPO&Japio
JP3255377A 1977-03-23 1977-03-23 Assembling device of semiconductor device Pending JPS53117378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3255377A JPS53117378A (en) 1977-03-23 1977-03-23 Assembling device of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3255377A JPS53117378A (en) 1977-03-23 1977-03-23 Assembling device of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53117378A true JPS53117378A (en) 1978-10-13

Family

ID=12362108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3255377A Pending JPS53117378A (en) 1977-03-23 1977-03-23 Assembling device of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53117378A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142461A (en) * 1982-02-18 1983-08-24 Nec Corp Data system selection circuit
JPS58186863A (en) * 1982-04-23 1983-10-31 Nec Corp Data system selecting circuit
JPS58186862A (en) * 1982-04-23 1983-10-31 Nec Corp Data system selecting circuit
JPS59224137A (en) * 1983-06-03 1984-12-17 Mitsubishi Electric Corp Die bonding device
JPS6021533A (en) * 1983-07-15 1985-02-02 Toshiba Corp Circuit element bonding method and apparatus thereof
JPH038432U (en) * 1989-06-12 1991-01-28
JPH04162730A (en) * 1990-10-26 1992-06-08 Nec Kyushu Ltd Pressing force control mechanism for die bonding apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142461A (en) * 1982-02-18 1983-08-24 Nec Corp Data system selection circuit
JPS58186863A (en) * 1982-04-23 1983-10-31 Nec Corp Data system selecting circuit
JPS58186862A (en) * 1982-04-23 1983-10-31 Nec Corp Data system selecting circuit
JPS59224137A (en) * 1983-06-03 1984-12-17 Mitsubishi Electric Corp Die bonding device
JPS6021533A (en) * 1983-07-15 1985-02-02 Toshiba Corp Circuit element bonding method and apparatus thereof
JPH038432U (en) * 1989-06-12 1991-01-28
JPH04162730A (en) * 1990-10-26 1992-06-08 Nec Kyushu Ltd Pressing force control mechanism for die bonding apparatus

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