JPS53117378A - Assembling device of semiconductor device - Google Patents
Assembling device of semiconductor deviceInfo
- Publication number
- JPS53117378A JPS53117378A JP3255377A JP3255377A JPS53117378A JP S53117378 A JPS53117378 A JP S53117378A JP 3255377 A JP3255377 A JP 3255377A JP 3255377 A JP3255377 A JP 3255377A JP S53117378 A JPS53117378 A JP S53117378A
- Authority
- JP
- Japan
- Prior art keywords
- assembling
- semiconductor device
- semiconductor
- diebonding
- obviate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To obviate the application of more than a fixed load to an element by beforehand providing a charge sensitive device to the suction nozzle which presses the semiconductor element to an external terminal at the time of diebonding the semiconductor device.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3255377A JPS53117378A (en) | 1977-03-23 | 1977-03-23 | Assembling device of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3255377A JPS53117378A (en) | 1977-03-23 | 1977-03-23 | Assembling device of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53117378A true JPS53117378A (en) | 1978-10-13 |
Family
ID=12362108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3255377A Pending JPS53117378A (en) | 1977-03-23 | 1977-03-23 | Assembling device of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53117378A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58142461A (en) * | 1982-02-18 | 1983-08-24 | Nec Corp | Data system selection circuit |
JPS58186863A (en) * | 1982-04-23 | 1983-10-31 | Nec Corp | Data system selecting circuit |
JPS58186862A (en) * | 1982-04-23 | 1983-10-31 | Nec Corp | Data system selecting circuit |
JPS59224137A (en) * | 1983-06-03 | 1984-12-17 | Mitsubishi Electric Corp | Die bonding device |
JPS6021533A (en) * | 1983-07-15 | 1985-02-02 | Toshiba Corp | Circuit element bonding method and apparatus thereof |
JPH038432U (en) * | 1989-06-12 | 1991-01-28 | ||
JPH04162730A (en) * | 1990-10-26 | 1992-06-08 | Nec Kyushu Ltd | Pressing force control mechanism for die bonding apparatus |
-
1977
- 1977-03-23 JP JP3255377A patent/JPS53117378A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58142461A (en) * | 1982-02-18 | 1983-08-24 | Nec Corp | Data system selection circuit |
JPS58186863A (en) * | 1982-04-23 | 1983-10-31 | Nec Corp | Data system selecting circuit |
JPS58186862A (en) * | 1982-04-23 | 1983-10-31 | Nec Corp | Data system selecting circuit |
JPS59224137A (en) * | 1983-06-03 | 1984-12-17 | Mitsubishi Electric Corp | Die bonding device |
JPS6021533A (en) * | 1983-07-15 | 1985-02-02 | Toshiba Corp | Circuit element bonding method and apparatus thereof |
JPH038432U (en) * | 1989-06-12 | 1991-01-28 | ||
JPH04162730A (en) * | 1990-10-26 | 1992-06-08 | Nec Kyushu Ltd | Pressing force control mechanism for die bonding apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS53117378A (en) | Assembling device of semiconductor device | |
JPS532094A (en) | Photoelectric conversion circuit | |
JPS5380916A (en) | Terminal unit | |
JPS53126268A (en) | Semiconductor device | |
JPS5315762A (en) | Production of semiconductor device | |
JPS542662A (en) | Semiconductor device | |
JPS5228868A (en) | Semiconductor device | |
JPS5279775A (en) | Semiconductor device | |
JPS51122375A (en) | Semiconductor device | |
JPS5221641A (en) | Constant-voltage circuit | |
JPS52149392A (en) | Wire release device of without screw terminal | |
JPS53110370A (en) | Semiconductor device | |
JPS5353968A (en) | Electronic circuit device | |
JPS53118021A (en) | Power driving device of cameras | |
JPS5395080A (en) | Comparator circuit | |
JPS547272A (en) | Semiconductor package | |
JPS5258370A (en) | Semiconductor device | |
JPS5314562A (en) | Mounting method of semiconductor pellet to lead frame | |
JPS51115618A (en) | Dc-dc converter circuit | |
JPS5279776A (en) | Semiconductor device | |
JPS544545A (en) | Charge transfer device | |
JPS5360176A (en) | Semiconductor device | |
JPS5414674A (en) | Lead fram an resin-sealed electronic parts using it | |
JPS53128980A (en) | Positioning device for bonding | |
JPS5379393A (en) | Hall power generator device |