JPS5381073A - Oroduction of resin seal type semiconductor device and lead frame used the same - Google Patents
Oroduction of resin seal type semiconductor device and lead frame used the sameInfo
- Publication number
- JPS5381073A JPS5381073A JP15653176A JP15653176A JPS5381073A JP S5381073 A JPS5381073 A JP S5381073A JP 15653176 A JP15653176 A JP 15653176A JP 15653176 A JP15653176 A JP 15653176A JP S5381073 A JPS5381073 A JP S5381073A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- oroduction
- semiconductor device
- same
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To achieve the rationalization and expedition of work by supporting the molding part of a pellet with mold strips on a lead frame and treating in a multilinked state.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15653176A JPS5381073A (en) | 1976-12-27 | 1976-12-27 | Oroduction of resin seal type semiconductor device and lead frame used the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15653176A JPS5381073A (en) | 1976-12-27 | 1976-12-27 | Oroduction of resin seal type semiconductor device and lead frame used the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16101281A Division JPS57132345A (en) | 1981-10-12 | 1981-10-12 | Lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5381073A true JPS5381073A (en) | 1978-07-18 |
JPS5730307B2 JPS5730307B2 (en) | 1982-06-28 |
Family
ID=15629818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15653176A Granted JPS5381073A (en) | 1976-12-27 | 1976-12-27 | Oroduction of resin seal type semiconductor device and lead frame used the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5381073A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5521124A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame |
JPS5587469A (en) * | 1978-12-25 | 1980-07-02 | Fujitsu Ltd | Semiconductor device and its manufacture |
JPS5632462U (en) * | 1979-08-20 | 1981-03-30 | ||
JPS59136956A (en) * | 1983-01-25 | 1984-08-06 | Rohm Co Ltd | Semiconductor device |
JPS59143334A (en) * | 1983-02-03 | 1984-08-16 | Rohm Co Ltd | Manufacture of semiconductor device |
JPS59148354A (en) * | 1983-02-15 | 1984-08-25 | Internatl Rectifier Corp Japan Ltd | Lead frame for semiconductor device |
JPS60121751A (en) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | Semiconductor device |
JPS6271253A (en) * | 1985-07-23 | 1987-04-01 | フエアチヤイルド セミコンダクタ コ−ポレ−シヨン | Semiconductor chip package structure, its test and facilitating method for mounting on substrate |
JPS63205941A (en) * | 1987-02-23 | 1988-08-25 | Sony Corp | Semiconductor device |
JPS6489354A (en) * | 1987-09-29 | 1989-04-03 | Nec Corp | Flat package |
JPH0334358A (en) * | 1989-06-29 | 1991-02-14 | Nec Corp | Manufacture of resin sealed semiconductor device |
JPH04127459A (en) * | 1990-09-18 | 1992-04-28 | Nec Kyushu Ltd | Manufacture of semiconductor device |
-
1976
- 1976-12-27 JP JP15653176A patent/JPS5381073A/en active Granted
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6217381B2 (en) * | 1978-08-02 | 1987-04-17 | Hitachi Ltd | |
JPS5521124A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame |
JPS5587469A (en) * | 1978-12-25 | 1980-07-02 | Fujitsu Ltd | Semiconductor device and its manufacture |
JPS5632462U (en) * | 1979-08-20 | 1981-03-30 | ||
JPS59136956A (en) * | 1983-01-25 | 1984-08-06 | Rohm Co Ltd | Semiconductor device |
JPS59143334A (en) * | 1983-02-03 | 1984-08-16 | Rohm Co Ltd | Manufacture of semiconductor device |
JPS59148354A (en) * | 1983-02-15 | 1984-08-25 | Internatl Rectifier Corp Japan Ltd | Lead frame for semiconductor device |
JPS60121751A (en) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | Semiconductor device |
JPS6242388B2 (en) * | 1984-07-25 | 1987-09-08 | Hitachi Ltd | |
JPS6271253A (en) * | 1985-07-23 | 1987-04-01 | フエアチヤイルド セミコンダクタ コ−ポレ−シヨン | Semiconductor chip package structure, its test and facilitating method for mounting on substrate |
JPS63205941A (en) * | 1987-02-23 | 1988-08-25 | Sony Corp | Semiconductor device |
JPS6489354A (en) * | 1987-09-29 | 1989-04-03 | Nec Corp | Flat package |
JPH0334358A (en) * | 1989-06-29 | 1991-02-14 | Nec Corp | Manufacture of resin sealed semiconductor device |
JPH04127459A (en) * | 1990-09-18 | 1992-04-28 | Nec Kyushu Ltd | Manufacture of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5730307B2 (en) | 1982-06-28 |
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