JPS5387173A - Molding mold - Google Patents
Molding moldInfo
- Publication number
- JPS5387173A JPS5387173A JP149777A JP149777A JPS5387173A JP S5387173 A JPS5387173 A JP S5387173A JP 149777 A JP149777 A JP 149777A JP 149777 A JP149777 A JP 149777A JP S5387173 A JPS5387173 A JP S5387173A
- Authority
- JP
- Japan
- Prior art keywords
- molding mold
- leads
- elastic material
- material layers
- contact parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prevent resin leakage by providing elastic material layers to the contact parts with leads in one of upper and lower molds.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP149777A JPS5387173A (en) | 1977-01-12 | 1977-01-12 | Molding mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP149777A JPS5387173A (en) | 1977-01-12 | 1977-01-12 | Molding mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5387173A true JPS5387173A (en) | 1978-08-01 |
Family
ID=11503086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP149777A Pending JPS5387173A (en) | 1977-01-12 | 1977-01-12 | Molding mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5387173A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55128108U (en) * | 1979-02-28 | 1980-09-10 | ||
JPS58110048A (en) * | 1981-12-24 | 1983-06-30 | Toshiba Corp | Metal mold for resin sealing |
JPH05211187A (en) * | 1991-12-26 | 1993-08-20 | Nippon Steel Corp | Molding die for ic package |
-
1977
- 1977-01-12 JP JP149777A patent/JPS5387173A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55128108U (en) * | 1979-02-28 | 1980-09-10 | ||
JPS58110048A (en) * | 1981-12-24 | 1983-06-30 | Toshiba Corp | Metal mold for resin sealing |
JPH05211187A (en) * | 1991-12-26 | 1993-08-20 | Nippon Steel Corp | Molding die for ic package |
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