JPS5387173A - Molding mold - Google Patents

Molding mold

Info

Publication number
JPS5387173A
JPS5387173A JP149777A JP149777A JPS5387173A JP S5387173 A JPS5387173 A JP S5387173A JP 149777 A JP149777 A JP 149777A JP 149777 A JP149777 A JP 149777A JP S5387173 A JPS5387173 A JP S5387173A
Authority
JP
Japan
Prior art keywords
molding mold
leads
elastic material
material layers
contact parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP149777A
Other languages
Japanese (ja)
Inventor
Minoru Mishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP149777A priority Critical patent/JPS5387173A/en
Publication of JPS5387173A publication Critical patent/JPS5387173A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent resin leakage by providing elastic material layers to the contact parts with leads in one of upper and lower molds.
COPYRIGHT: (C)1978,JPO&Japio
JP149777A 1977-01-12 1977-01-12 Molding mold Pending JPS5387173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP149777A JPS5387173A (en) 1977-01-12 1977-01-12 Molding mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP149777A JPS5387173A (en) 1977-01-12 1977-01-12 Molding mold

Publications (1)

Publication Number Publication Date
JPS5387173A true JPS5387173A (en) 1978-08-01

Family

ID=11503086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP149777A Pending JPS5387173A (en) 1977-01-12 1977-01-12 Molding mold

Country Status (1)

Country Link
JP (1) JPS5387173A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128108U (en) * 1979-02-28 1980-09-10
JPS58110048A (en) * 1981-12-24 1983-06-30 Toshiba Corp Metal mold for resin sealing
JPH05211187A (en) * 1991-12-26 1993-08-20 Nippon Steel Corp Molding die for ic package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128108U (en) * 1979-02-28 1980-09-10
JPS58110048A (en) * 1981-12-24 1983-06-30 Toshiba Corp Metal mold for resin sealing
JPH05211187A (en) * 1991-12-26 1993-08-20 Nippon Steel Corp Molding die for ic package

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