JPS52107049A - Curing compound for molding - Google Patents
Curing compound for moldingInfo
- Publication number
- JPS52107049A JPS52107049A JP4347476A JP4347476A JPS52107049A JP S52107049 A JPS52107049 A JP S52107049A JP 4347476 A JP4347476 A JP 4347476A JP 4347476 A JP4347476 A JP 4347476A JP S52107049 A JPS52107049 A JP S52107049A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- curing compound
- curing
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/660,572 US4082719A (en) | 1976-02-23 | 1976-02-23 | Silicone epoxy curable compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52107049A true JPS52107049A (en) | 1977-09-08 |
JPS5329720B2 JPS5329720B2 (ja) | 1978-08-22 |
Family
ID=24650073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4347476A Granted JPS52107049A (en) | 1976-02-23 | 1976-04-16 | Curing compound for molding |
Country Status (14)
Country | Link |
---|---|
US (1) | US4082719A (ja) |
JP (1) | JPS52107049A (ja) |
AU (1) | AU499421B2 (ja) |
BE (1) | BE842673A (ja) |
BR (1) | BR7608786A (ja) |
CA (1) | CA1051586A (ja) |
CH (1) | CH628915A5 (ja) |
DE (1) | DE2615689C3 (ja) |
FR (1) | FR2343025A1 (ja) |
GB (1) | GB1538619A (ja) |
IT (1) | IT1059211B (ja) |
MX (1) | MX143291A (ja) |
NL (1) | NL160582C (ja) |
SE (1) | SE7603729L (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS553474A (en) * | 1978-06-21 | 1980-01-11 | Dow Corning | Composition for improved molding of hardening siloxaneeepoxy |
JPS55145725A (en) * | 1979-05-04 | 1980-11-13 | Toshiba Corp | Heat-resistant resin composition |
JPS562319A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Corp | Epoxy resin composition |
JPS564625A (en) * | 1979-06-25 | 1981-01-19 | Toshiba Corp | Epoxy resin composition |
JPS56139527A (en) * | 1980-04-03 | 1981-10-31 | Toshiba Corp | Epoxy series resin composition |
JPS5718754A (en) * | 1980-07-08 | 1982-01-30 | Shin Etsu Chem Co Ltd | Epoxy-silicone resin composition |
JPS60168767A (ja) * | 1983-11-14 | 1985-09-02 | ダウ コ−ニング コ−ポレ−シヨン | 硬化性液体塗料組成物 |
JP2007002233A (ja) * | 2005-05-24 | 2007-01-11 | Shin Etsu Chem Co Ltd | エポキシ・シリコーン樹脂組成物及びその硬化物、並びに該組成物で封止保護された発光半導体装置 |
US7276562B2 (en) | 2004-04-30 | 2007-10-02 | Shin-Etsu Chemical Co., Ltd. | Epoxy-silicone mixed resin composition and light-emitting semiconductor device |
JP2008133442A (ja) * | 2006-10-31 | 2008-06-12 | Nippon Shokubai Co Ltd | 樹脂組成物、光学材料、及び、該光学材料の制御方法 |
US7498085B2 (en) | 2003-11-20 | 2009-03-03 | Shin-Etsu Chemical Co., Ltd. | Epoxy/silicone mixed resin composition and light-emitting semiconductor device |
KR20100133898A (ko) | 2009-06-12 | 2010-12-22 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 광반도체 소자 밀봉용 수지 조성물 |
US8524841B2 (en) | 2006-09-29 | 2013-09-03 | Nippon Shokubai Co., Ltd. | Curable resin composition, optical material, and method for controlling optical material |
US8710158B2 (en) | 2010-04-07 | 2014-04-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy composition for encapsulating an optical semiconductor element |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52147657A (en) * | 1976-06-02 | 1977-12-08 | Toray Silicone Co Ltd | Curable organopolysiloxane compositions |
US4125510A (en) * | 1977-03-01 | 1978-11-14 | Dow Corning Corporation | Method of improving crack resistance of siloxane molding compositions |
JPS53111336A (en) * | 1977-03-11 | 1978-09-28 | Toray Ind Inc | Coating composition |
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
JPS5681906A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Heat resisting electrical insulated coil |
US4287326A (en) * | 1980-03-03 | 1981-09-01 | Toray Silicone Company, Ltd. | Siloxane-modified epoxy resin compositions |
US4283513A (en) * | 1980-03-03 | 1981-08-11 | Toray Silicone Company, Ltd. | Siloxane-modified epoxy resin composition |
JPS6056171B2 (ja) * | 1980-03-17 | 1985-12-09 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
DE3010995A1 (de) * | 1980-03-21 | 1981-10-01 | Toray Silicone Co., Ltd., Tokyo | Siloxanmodifizierte epoxyharzmasse |
DE3010994A1 (de) * | 1980-03-21 | 1981-10-01 | Toray Silicone Co., Ltd., Tokyo | Siloxanmodifizierte epoxyharzmasse |
JPS5734150A (en) * | 1980-08-08 | 1982-02-24 | Toray Silicone Co Ltd | Organopolysiloxane resin composition |
US4332923A (en) * | 1980-10-23 | 1982-06-01 | Dow Corning Corporation | Composition for coating heat sensitive substrates |
WO1982001710A1 (en) * | 1980-11-10 | 1982-05-27 | Dow Corning | Aluminum catalyzed silicon alkoxide-epoxy compositions |
JPS60115619A (ja) * | 1983-11-28 | 1985-06-22 | Toray Silicone Co Ltd | 熱硬化性エポキシ樹脂組成物 |
USRE32958E (en) * | 1983-11-28 | 1989-06-20 | Toray Silicone Co., Ltd. | Thermosetting epoxy resin compositions |
JPS60166327A (ja) * | 1984-02-09 | 1985-08-29 | Toshiba Silicone Co Ltd | 新規な共重合体の製造方法 |
JPS61271319A (ja) * | 1985-05-24 | 1986-12-01 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JP2791438B2 (ja) * | 1988-09-09 | 1998-08-27 | 関西ペイント株式会社 | 樹脂組成物及びその硬化方法 |
JPH0368478A (ja) * | 1989-08-07 | 1991-03-25 | Kansai Paint Co Ltd | 塗膜形成法 |
US5102960A (en) * | 1989-09-11 | 1992-04-07 | Bayer Aktiengesellschaft | Silicon-epoxy resin composition |
US5057550A (en) * | 1989-12-04 | 1991-10-15 | Dow Corning Corporation | Epoxy-silanol functional uv curable polymers |
US5292827A (en) * | 1993-02-25 | 1994-03-08 | General Electric Company | Epoxy-capped branched silicones and copolymers thereof |
TW343218B (en) * | 1994-03-25 | 1998-10-21 | Shinetsu Chem Ind Co | Integral composite consisted of polysiloxane rubber and epoxy resin and process for producing the same |
JP3011617B2 (ja) * | 1994-08-11 | 2000-02-21 | 信越化学工業株式会社 | シリコーン−エポキシ樹脂組成物 |
KR970053283A (ko) * | 1995-12-26 | 1997-07-31 | 윌리엄 이. 힐러 | 반도체 패키지 윤곽 측정용 측정 유니트 |
US5866261A (en) * | 1996-12-20 | 1999-02-02 | Rhodia Inc. | Release composition |
US20060270808A1 (en) * | 2005-05-24 | 2006-11-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device |
US7588967B2 (en) * | 2005-05-27 | 2009-09-15 | Shin-Etsu Chemical Co., Ltd. | Curable silicone rubber composition and semiconductor device |
JP5170765B2 (ja) * | 2008-09-22 | 2013-03-27 | 日東電工株式会社 | 熱硬化性組成物及び光半導体装置 |
TWI408174B (zh) * | 2010-02-09 | 2013-09-11 | Nanya Plastics Corp | 應用在光學封裝及塗佈之環氧矽氧烷樹脂組成物 |
CN102234426B (zh) * | 2010-05-05 | 2013-10-30 | 南亚塑胶工业股份有限公司 | 用于光学镜片与光学封装的树脂组合物 |
US9623591B2 (en) * | 2013-01-15 | 2017-04-18 | Basf Se | Method of encapsulating an electronic component |
KR102264361B1 (ko) | 2013-05-17 | 2021-06-15 | 다우 실리콘즈 코포레이션 | 경화성 조성물, 경화된 물품의 제조 방법 및 이에 의해 형성된 경화된 물품 |
EP3460959A1 (de) * | 2017-09-20 | 2019-03-27 | Siemens Aktiengesellschaft | Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine sowie ein isolationssystem daraus |
CN115449228B (zh) * | 2022-09-28 | 2023-11-10 | 汇涌进光电(浙江)有限公司 | 耐高温高湿及光老化的光电封装材料及其制备方法、应用 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3070559A (en) * | 1958-09-12 | 1962-12-25 | Wacker Chemie Gmbh | Silicone rubber stocks |
US3131161A (en) * | 1960-02-25 | 1964-04-28 | Wacker Chemie Gmbh | Silicone rubber containing an epoxide compound |
US3842141A (en) * | 1972-02-22 | 1974-10-15 | Dexter Corp | Silicone-epoxy copolymers and molding powders obtained therefrom |
-
1976
- 1976-02-23 US US05/660,572 patent/US4082719A/en not_active Expired - Lifetime
- 1976-03-25 CA CA248,759A patent/CA1051586A/en not_active Expired
- 1976-03-29 SE SE7603729A patent/SE7603729L/xx not_active Application Discontinuation
- 1976-03-31 AU AU12528/76A patent/AU499421B2/en not_active Expired
- 1976-04-02 GB GB13422/76A patent/GB1538619A/en not_active Expired
- 1976-04-09 DE DE2615689A patent/DE2615689C3/de not_active Expired
- 1976-04-12 NL NL7603853.A patent/NL160582C/xx not_active IP Right Cessation
- 1976-04-16 JP JP4347476A patent/JPS52107049A/ja active Granted
- 1976-04-20 IT IT22459/76A patent/IT1059211B/it active
- 1976-04-30 CH CH546776A patent/CH628915A5/de not_active IP Right Cessation
- 1976-06-01 FR FR7616476A patent/FR2343025A1/fr active Granted
- 1976-06-08 BE BE167691A patent/BE842673A/xx not_active IP Right Cessation
- 1976-12-09 MX MX167331A patent/MX143291A/es unknown
- 1976-12-29 BR BR7608786A patent/BR7608786A/pt unknown
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6258389B2 (ja) * | 1978-06-21 | 1987-12-05 | Dow Corning | |
JPS553474A (en) * | 1978-06-21 | 1980-01-11 | Dow Corning | Composition for improved molding of hardening siloxaneeepoxy |
JPS55145725A (en) * | 1979-05-04 | 1980-11-13 | Toshiba Corp | Heat-resistant resin composition |
JPS5734856B2 (ja) * | 1979-05-04 | 1982-07-26 | ||
JPS562319A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Corp | Epoxy resin composition |
JPS5817536B2 (ja) * | 1979-06-21 | 1983-04-07 | 株式会社東芝 | エポキシ樹脂系組成物 |
JPS564625A (en) * | 1979-06-25 | 1981-01-19 | Toshiba Corp | Epoxy resin composition |
JPS5817537B2 (ja) * | 1979-06-25 | 1983-04-07 | 株式会社東芝 | エポキシ樹脂系組成物 |
JPS56139527A (en) * | 1980-04-03 | 1981-10-31 | Toshiba Corp | Epoxy series resin composition |
JPS588701B2 (ja) * | 1980-04-03 | 1983-02-17 | 株式会社東芝 | エポキシ系樹脂組成物 |
JPS5718754A (en) * | 1980-07-08 | 1982-01-30 | Shin Etsu Chem Co Ltd | Epoxy-silicone resin composition |
JPS626573B2 (ja) * | 1980-07-08 | 1987-02-12 | Shinetsu Chem Ind Co | |
JPS60168767A (ja) * | 1983-11-14 | 1985-09-02 | ダウ コ−ニング コ−ポレ−シヨン | 硬化性液体塗料組成物 |
US7498085B2 (en) | 2003-11-20 | 2009-03-03 | Shin-Etsu Chemical Co., Ltd. | Epoxy/silicone mixed resin composition and light-emitting semiconductor device |
US7276562B2 (en) | 2004-04-30 | 2007-10-02 | Shin-Etsu Chemical Co., Ltd. | Epoxy-silicone mixed resin composition and light-emitting semiconductor device |
JP2007002233A (ja) * | 2005-05-24 | 2007-01-11 | Shin Etsu Chem Co Ltd | エポキシ・シリコーン樹脂組成物及びその硬化物、並びに該組成物で封止保護された発光半導体装置 |
US8524841B2 (en) | 2006-09-29 | 2013-09-03 | Nippon Shokubai Co., Ltd. | Curable resin composition, optical material, and method for controlling optical material |
JP2008133442A (ja) * | 2006-10-31 | 2008-06-12 | Nippon Shokubai Co Ltd | 樹脂組成物、光学材料、及び、該光学材料の制御方法 |
KR20100133898A (ko) | 2009-06-12 | 2010-12-22 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 광반도체 소자 밀봉용 수지 조성물 |
US8710158B2 (en) | 2010-04-07 | 2014-04-29 | Shin-Etsu Chemical Co., Ltd. | Epoxy composition for encapsulating an optical semiconductor element |
Also Published As
Publication number | Publication date |
---|---|
DE2615689B2 (de) | 1978-01-05 |
NL160582C (nl) | 1979-11-15 |
GB1538619A (en) | 1979-01-24 |
US4082719A (en) | 1978-04-04 |
BR7608786A (pt) | 1977-10-25 |
FR2343025B1 (ja) | 1978-08-25 |
NL7603853A (nl) | 1977-08-25 |
CH628915A5 (de) | 1982-03-31 |
AU499421B2 (en) | 1979-04-12 |
SE7603729L (sv) | 1977-08-24 |
BE842673A (fr) | 1976-12-08 |
FR2343025A1 (fr) | 1977-09-30 |
DE2615689A1 (de) | 1977-08-25 |
AU1252876A (en) | 1977-10-20 |
NL160582B (nl) | 1979-06-15 |
MX143291A (es) | 1981-04-13 |
JPS5329720B2 (ja) | 1978-08-22 |
DE2615689C3 (de) | 1978-08-31 |
CA1051586A (en) | 1979-03-27 |
IT1059211B (it) | 1982-05-31 |
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