JPS55145725A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS55145725A JPS55145725A JP5405079A JP5405079A JPS55145725A JP S55145725 A JPS55145725 A JP S55145725A JP 5405079 A JP5405079 A JP 5405079A JP 5405079 A JP5405079 A JP 5405079A JP S55145725 A JPS55145725 A JP S55145725A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- polysiloxane
- epoxy resin
- necessity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To provide a curable resin with excellent mechanical property and heat resistance useful as an electric insulating material comprising a maleimide compound, an epoxy resin, a silane compound having a hydroxyl group or a polysiloxane compound and an aluminum compound.
CONSTITUTION: A resin composition containing (A) a maleimide compound, (B) an epoxy resin, (C) a silane compound containing a hydroxyl group or a polysiloxane, and (D) an aluminum compound as a curing catalyst. Moreover, a radical- polymerization initiator, e.g. benzoyl peroxide, or dicumyl peroxide used according to necessity is selected corresponding to a molding condition, usage conditions and purpose and the amount thereof is pref. 0.05W3pts.wt. to 100pts.wt. of a resin composition. Moreover, in order to enhance the compatibility among a maleimide compound, an epoxy resin and a silane compound or a polysiloxane compound, or furfuryl alcohol can be added according to necessity.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5405079A JPS55145725A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5405079A JPS55145725A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55145725A true JPS55145725A (en) | 1980-11-13 |
JPS5734856B2 JPS5734856B2 (en) | 1982-07-26 |
Family
ID=12959774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5405079A Granted JPS55145725A (en) | 1979-05-04 | 1979-05-04 | Heat-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55145725A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
JPS58113226A (en) * | 1981-12-26 | 1983-07-06 | Toho Rayon Co Ltd | Strand prepreg and manufacture of the same |
JPS59135217A (en) * | 1982-12-21 | 1984-08-03 | Nippon Debukon Kk | Production of heat-resistant grout material |
JPH0481424A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Resin composition for sealing |
JPH0481423A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing |
EP0592145A2 (en) * | 1992-10-09 | 1994-04-13 | General Electric Company | Polyphenylene ether/polyepoxide resin system |
JP2012149155A (en) * | 2011-01-18 | 2012-08-09 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63112856U (en) * | 1987-01-19 | 1988-07-20 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150941A (en) * | 1974-10-31 | 1976-05-06 | Nippon Paint Co Ltd | NETSUKOKASEIHIFUKUSOSEIBUTSU |
JPS52107049A (en) * | 1976-02-23 | 1977-09-08 | Dow Corning | Curing compound for molding |
-
1979
- 1979-05-04 JP JP5405079A patent/JPS55145725A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5150941A (en) * | 1974-10-31 | 1976-05-06 | Nippon Paint Co Ltd | NETSUKOKASEIHIFUKUSOSEIBUTSU |
JPS52107049A (en) * | 1976-02-23 | 1977-09-08 | Dow Corning | Curing compound for molding |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
JPS58113226A (en) * | 1981-12-26 | 1983-07-06 | Toho Rayon Co Ltd | Strand prepreg and manufacture of the same |
JPS59135217A (en) * | 1982-12-21 | 1984-08-03 | Nippon Debukon Kk | Production of heat-resistant grout material |
JPS6230216B2 (en) * | 1982-12-21 | 1987-07-01 | Nippon Debukon Kk | |
JPH0481424A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Resin composition for sealing |
JPH0481423A (en) * | 1990-07-24 | 1992-03-16 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing |
EP0592145A2 (en) * | 1992-10-09 | 1994-04-13 | General Electric Company | Polyphenylene ether/polyepoxide resin system |
EP0592145A3 (en) * | 1992-10-09 | 1995-06-07 | Gen Electric | Polyphenylene ether/polyepoxide resin system. |
JP2012149155A (en) * | 2011-01-18 | 2012-08-09 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5734856B2 (en) | 1982-07-26 |
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