JPS55145725A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS55145725A
JPS55145725A JP5405079A JP5405079A JPS55145725A JP S55145725 A JPS55145725 A JP S55145725A JP 5405079 A JP5405079 A JP 5405079A JP 5405079 A JP5405079 A JP 5405079A JP S55145725 A JPS55145725 A JP S55145725A
Authority
JP
Japan
Prior art keywords
compound
resin composition
polysiloxane
epoxy resin
necessity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5405079A
Other languages
Japanese (ja)
Other versions
JPS5734856B2 (en
Inventor
Shiyuichi Suzuki
Sadao Kajiura
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5405079A priority Critical patent/JPS55145725A/en
Publication of JPS55145725A publication Critical patent/JPS55145725A/en
Publication of JPS5734856B2 publication Critical patent/JPS5734856B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To provide a curable resin with excellent mechanical property and heat resistance useful as an electric insulating material comprising a maleimide compound, an epoxy resin, a silane compound having a hydroxyl group or a polysiloxane compound and an aluminum compound.
CONSTITUTION: A resin composition containing (A) a maleimide compound, (B) an epoxy resin, (C) a silane compound containing a hydroxyl group or a polysiloxane, and (D) an aluminum compound as a curing catalyst. Moreover, a radical- polymerization initiator, e.g. benzoyl peroxide, or dicumyl peroxide used according to necessity is selected corresponding to a molding condition, usage conditions and purpose and the amount thereof is pref. 0.05W3pts.wt. to 100pts.wt. of a resin composition. Moreover, in order to enhance the compatibility among a maleimide compound, an epoxy resin and a silane compound or a polysiloxane compound, or furfuryl alcohol can be added according to necessity.
COPYRIGHT: (C)1980,JPO&Japio
JP5405079A 1979-05-04 1979-05-04 Heat-resistant resin composition Granted JPS55145725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5405079A JPS55145725A (en) 1979-05-04 1979-05-04 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5405079A JPS55145725A (en) 1979-05-04 1979-05-04 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS55145725A true JPS55145725A (en) 1980-11-13
JPS5734856B2 JPS5734856B2 (en) 1982-07-26

Family

ID=12959774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5405079A Granted JPS55145725A (en) 1979-05-04 1979-05-04 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS55145725A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS58113226A (en) * 1981-12-26 1983-07-06 Toho Rayon Co Ltd Strand prepreg and manufacture of the same
JPS59135217A (en) * 1982-12-21 1984-08-03 Nippon Debukon Kk Production of heat-resistant grout material
JPH0481424A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Resin composition for sealing
JPH0481423A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Epoxy resin composition for sealing
EP0592145A2 (en) * 1992-10-09 1994-04-13 General Electric Company Polyphenylene ether/polyepoxide resin system
JP2012149155A (en) * 2011-01-18 2012-08-09 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63112856U (en) * 1987-01-19 1988-07-20

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150941A (en) * 1974-10-31 1976-05-06 Nippon Paint Co Ltd NETSUKOKASEIHIFUKUSOSEIBUTSU
JPS52107049A (en) * 1976-02-23 1977-09-08 Dow Corning Curing compound for molding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150941A (en) * 1974-10-31 1976-05-06 Nippon Paint Co Ltd NETSUKOKASEIHIFUKUSOSEIBUTSU
JPS52107049A (en) * 1976-02-23 1977-09-08 Dow Corning Curing compound for molding

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS58113226A (en) * 1981-12-26 1983-07-06 Toho Rayon Co Ltd Strand prepreg and manufacture of the same
JPS59135217A (en) * 1982-12-21 1984-08-03 Nippon Debukon Kk Production of heat-resistant grout material
JPS6230216B2 (en) * 1982-12-21 1987-07-01 Nippon Debukon Kk
JPH0481424A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Resin composition for sealing
JPH0481423A (en) * 1990-07-24 1992-03-16 Matsushita Electric Works Ltd Epoxy resin composition for sealing
EP0592145A2 (en) * 1992-10-09 1994-04-13 General Electric Company Polyphenylene ether/polyepoxide resin system
EP0592145A3 (en) * 1992-10-09 1995-06-07 Gen Electric Polyphenylene ether/polyepoxide resin system.
JP2012149155A (en) * 2011-01-18 2012-08-09 Hitachi Chemical Co Ltd Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

Also Published As

Publication number Publication date
JPS5734856B2 (en) 1982-07-26

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