JPH1075036A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH1075036A JPH1075036A JP22892796A JP22892796A JPH1075036A JP H1075036 A JPH1075036 A JP H1075036A JP 22892796 A JP22892796 A JP 22892796A JP 22892796 A JP22892796 A JP 22892796A JP H1075036 A JPH1075036 A JP H1075036A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- light
- wiring board
- hole
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は印刷配線板の製造方
法に関し、特に高密度配線に適した微細な孔の形成が容
易な印刷配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board, and more particularly to a method of manufacturing a printed wiring board suitable for high-density wiring and capable of easily forming fine holes.
【０００２】[0002]
【従来の技術】従来の印刷配線板の製造方法に於いて、
電着塗装による感光性レジスト膜の露光工程では、あら
かじめ孔あけ、孔内メッキを施した銅張積層板の孔内と
表面全面に感光性レジスト膜を電着塗装した印刷配線板
を準備し、マスクフィルムを印刷配線板に当接させて露
光テーブル上にセットし、紫外線を照射することによっ
て感光性レジスト膜を選択的に露光させるという方法が
行われている。その後、現像〜エッチング工程を経て所
望のスルーホール、非スルーホール、回路を有する印刷
配線板を製造している。この場合、電着塗装による感光
レジスト膜は、光硬化型（ネガタイプ）か、光分解型
（ポジタイプ）を使用するのが一般的である。いずれの
タイプのレジスト膜においても、スルーホール、非スル
ーホールを同時形成する場合、 １）光硬化型（ネガタイプ）においては、スルーホール
となる孔内の感光性レジスト膜を露光し、エッチングレ
ジストとする。又、孔内に銅メッキが不要な非スルーホ
ールは、逆に紫外線をマスクフィルムで遮光することに
よって、現像により感光性レジスト膜を除去する。その
後エッチングによって、選択的に銅を除去してスルーホ
ール、非スルーホールを形成する。2. Description of the Related Art In a conventional method of manufacturing a printed wiring board,
In the step of exposing the photosensitive resist film by electrodeposition coating, a printed wiring board in which a photosensitive resist film is electrodeposited in the holes and on the entire surface of the copper-clad laminate that has been previously drilled and plated in the holes is prepared. There is a method in which a mask film is brought into contact with a printed wiring board, set on an exposure table, and selectively exposed to light by irradiating ultraviolet rays. Thereafter, a printed wiring board having desired through-holes, non-through-holes, and circuits is manufactured through development to etching steps. In this case, the photosensitive resist film formed by electrodeposition is generally of a photocurable type (negative type) or a photodecomposable type (positive type). When through-holes and non-through-holes are simultaneously formed in any type of resist film, 1) In a photo-curing type (negative type), a photosensitive resist film in a hole to be a through-hole is exposed, and an etching resist is formed. I do. On the other hand, in the non-through holes which do not require copper plating in the holes, the photosensitive resist film is removed by development by shielding ultraviolet rays with a mask film. Thereafter, copper is selectively removed by etching to form through holes and non-through holes.
【０００３】２）光分解型（ポジタイプ）においては、
ネガタイプとは逆に非スルーホールとなる孔内の感光性
レジスト膜を露光して光分解し、現像により除去する。
又、孔内に銅メッキが必要なスルーホールは逆に紫外線
をマスクフィルムで遮光することによって、そのままエ
ッチングレジストとして用いる。その後エッチングによ
って、選択的に銅を除去してスルーホール、非スルーホ
ールを形成する。2) In the photolysis type (positive type),
Contrary to the negative type, the photosensitive resist film in the hole which becomes a non-through hole is exposed to light to decompose and is removed by development.
On the other hand, through holes which require copper plating in the holes are used as they are as etching resists by shielding ultraviolet rays with a mask film. Thereafter, copper is selectively removed by etching to form through holes and non-through holes.
【０００４】昨今、印刷配線板の高密度化が進行し、特
にファイン回路、小径高アスペクト比（注：アスペクト
比＝板厚／孔径の比率）スルーホール、および高アスペ
クト比の非スルーホールを具備することが必要不可欠と
なっている。しかし、従来の製造方法においては、光硬
化型、光分解型のいずれの感光性レジスト膜を使用する
場合においても、孔のアスペクト比の進行にともない、
特に小径孔内部に、露光時、紫外線を大量照射する必要
が生じている。しかし、一方、ファイン回路形成と言う
視点でみると、露光時の紫外線量の増大は、感光性レジ
スト膜の解像性を低下させるため、自ずと高密度化対応
には限界が生じてくる。この為、一部紫外線が極力平行
光となるような光源を用いて対応するのが一般的である
が、スルーホール、非スルーホール部位は、逆に極力散
乱光を使用しないと孔内の露光が不十分となる二率背反
なる課題が生じていた。In recent years, the density of printed wiring boards has increased, and in particular, fine circuits, small-diameter high-aspect ratio (note: aspect ratio = plate thickness / hole diameter ratio) through holes, and high aspect ratio non-through holes have been provided. It has become essential. However, in the conventional manufacturing method, even when using a photosensitive resist film of the photo-curing type, photo-decomposition type, with the progress of the aspect ratio of the hole,
In particular, it has become necessary to irradiate the inside of the small-diameter hole with a large amount of ultraviolet light during exposure. However, from the viewpoint of fine circuit formation, on the other hand, an increase in the amount of ultraviolet light at the time of exposure lowers the resolution of the photosensitive resist film. For this reason, it is common to use a light source in which some ultraviolet rays become parallel light as much as possible. However, through-holes and non-through-hole parts are exposed to light in the holes unless scattered light is used as much as possible. There was a conflicting problem that was insufficient.
【０００５】こうした、電着塗装タイプのレジスト膜を
用いる印刷配線板の製造方法上の課題を解決するため
に、以下のような、孔内露光量のみを可能な限り増加さ
せようという試みが提案されている。特に孔内周面の感
光性レジスト膜への露光量を増加させるための露光方法
として、例えば、公知例（１）：特開平４−５６１８９
号公報では平行光を散乱光に変換する光散乱層を利用し
て露光する方法が知られている。図４は公知例（１）の
露光方法を示す断面図である。孔２を有する印刷配線板
１の表面及び孔２内に電着塗装により感光性レジスト膜
３を形成する（尚、この実施例では光硬化型のネガタイ
プレジストを使用している）。次いで、マスクフィルム
４に微細な凹凸のある透明シートなどの光散乱層１０を
貼付け印刷配線板１の両面に当接し、上下の真空焼き枠
５の透明板の間に配置する。上下に配置された光源６か
ら紫外線７を照射すると、マスクフィルム４を透過した
紫外線は微細な凹凸のある透明シートなどの光散乱層１
０で屈折し、散乱光９ａに変換される。前記の散乱光９
ａにより、マスクフィルム４の透明部（図中の非ハッチ
ング部）直下の感光性レジスト膜３を露光するととも
に、所望の孔内周面の感光性レジスト膜３をも照射して
露光し、現像、エッチング工程を経て印刷配線板１を製
造する。In order to solve such a problem in a method of manufacturing a printed wiring board using an electrodeposition type resist film, the following attempts have been proposed to increase only the exposure amount in the hole as much as possible. Have been. In particular, as an exposure method for increasing the exposure amount to the photosensitive resist film on the inner peripheral surface of the hole, for example, a known example (1): JP-A-4-56189
In Japanese Patent Application Laid-Open Publication No. H11-157, a method of performing exposure using a light scattering layer that converts parallel light into scattered light is known. FIG. 4 is a cross-sectional view showing the exposure method of the known example (1). A photosensitive resist film 3 is formed by electrodeposition coating on the surface of the printed wiring board 1 having the holes 2 and in the holes 2 (a photocurable negative type resist is used in this embodiment). Next, a light scattering layer 10 such as a transparent sheet having fine irregularities is attached to the mask film 4 and abuts on both surfaces of the printed wiring board 1, and is disposed between the upper and lower transparent plates of the vacuum firing frame 5. When ultraviolet rays 7 are radiated from light sources 6 arranged above and below, the ultraviolet rays transmitted through the mask film 4 are converted into light scattering layers 1 such as a transparent sheet having fine irregularities.
The light is refracted at 0 and converted into scattered light 9a. The scattered light 9
a, the photosensitive resist film 3 immediately below the transparent portion (non-hatched portion in the figure) of the mask film 4 is exposed, and the photosensitive resist film 3 on the inner peripheral surface of a desired hole is also exposed and exposed. The printed wiring board 1 is manufactured through an etching process.
【０００６】また、公知例（２）：特開平４−９３９５
０号公報、特開平３−３５５８７号公報では乱反射性を
有する光散乱鏡を光源と反対側の印刷配線板に配置し
て、表面及び孔内周面を露光する方法が知られている。
図５は公知例（２）の露光方法を示す断面図である。孔
２を有する印刷配線板１の表面及び孔２内に電着塗装等
により感光性レジスト膜３を形成し、フォトマスクフィ
ルム４を当接させる。次いで、露光性テーブル１１上に
光散乱性を有する散乱鏡１２を鏡面が露光テーブル１１
の反対を向くように配置させ、真空焼き枠５との間に前
記の印刷配線板１を置く。光源６より紫外線７を照射す
るとマスクフィルム４の透明部（図中の非ハッチング
部）直下の感光性レジスト膜３が露光され、さらに、孔
２を通過した紫外線７は、露光テーブル上に配置された
散乱鏡１２の鏡面により乱反射し全反射光１３に変換さ
れることによって所望の孔２内周面を露光する。その後
現像、エッチング等の工程を経てパターンニングされ、
印刷配線板１を製造する。A known example (2): JP-A-4-9395
Japanese Patent Laid-Open No. 0-35587 / 1990 discloses a method in which a light scattering mirror having diffuse reflection is arranged on a printed wiring board opposite to a light source to expose the surface and the inner peripheral surface of a hole.
FIG. 5 is a cross-sectional view showing the exposure method of the known example (2). A photosensitive resist film 3 is formed on the surface of the printed wiring board 1 having the holes 2 and in the holes 2 by electrodeposition coating or the like, and a photomask film 4 is brought into contact therewith. Next, a scattering mirror 12 having a light scattering property is placed on the exposure table 11 with a mirror surface.
The printed wiring board 1 is placed between the printed wiring board 1 and the vacuum firing frame 5. When the ultraviolet light 7 is irradiated from the light source 6, the photosensitive resist film 3 immediately below the transparent portion (non-hatched portion in the figure) of the mask film 4 is exposed, and the ultraviolet light 7 that has passed through the hole 2 is arranged on the exposure table. The desired inner peripheral surface of the hole 2 is exposed by being irregularly reflected by the mirror surface of the scattering mirror 12 and converted into total reflected light 13. After that, it is patterned through processes such as development and etching,
The printed wiring board 1 is manufactured.
【０００７】[0007]
【発明が解決しようとする課題】公知例（１）：特開平
４−５６１８９号公報では孔２内周面を露光するため
に、光源６から発せられた紫外線７を光散乱層１０を介
して散乱孔９ａに変換するので、孔２内周面の露光を行
う際、孔２内の露光量が増加し、高密度配線に必要とさ
れる高アスペクト比スルーホール、非スルーホールに対
しある程度有効である。しかし、発明者の研究によれ
ば、紫外線平行光７全てが散乱光９ａとなるわけではな
く一部の紫外線平行光７はそのままマスクフィルム４を
透過するケースがあり、効率的ではない。ファイン回路
形成対応上、表面の露光量を極限まで抑制し、更に、高
アスペクト比が進行し、孔２内周面を効率よく露光する
必要がある場合には、露光量が不足し微細な孔２を有す
る高密度印刷配線板の製造に於いて限界が生じるという
課題があった。Known example (1): In Japanese Patent Application Laid-Open No. 4-56189, ultraviolet light 7 emitted from a light source 6 is passed through a light scattering layer 10 in order to expose the inner peripheral surface of the hole 2. Since the light is converted into the scattering holes 9a, the amount of exposure in the holes 2 increases when the inner peripheral surface of the holes 2 is exposed, and is effective to some extent for through holes and non-through holes having a high aspect ratio required for high-density wiring. It is. However, according to the research of the inventor, not all of the ultraviolet collimated light 7 becomes the scattered light 9a, and there is a case where a part of the ultraviolet collimated light 7 passes through the mask film 4 as it is, which is not efficient. In order to cope with the fine circuit formation, the exposure amount on the surface is suppressed to the utmost limit. Furthermore, when the high aspect ratio progresses and it is necessary to expose the inner peripheral surface of the hole 2 efficiently, the exposure amount is insufficient and the fine hole However, there is a problem that a limit arises in the production of a high-density printed wiring board having the number 2.
【０００８】また、公知例（２）：特開平４−９３９５
０号公報および特開平３−３５５８７号公報では乱反射
性を有する散乱鏡１２を利用して孔２内周面の露光を行
う。しかし、公知例：特開平４−９３９５０号公報は、
散乱鏡１２は片面のみの配置としており、両面に配線を
有する印刷配線板１を製造するためには２回の露光作業
が必要である為、生産性の低下を招くという課題があ
る。さらに、特開平３−３５５８７号公報は露光工程に
於いてパターン形成部分のための光を照射する工程と次
いで光照射すべき孔２以外の部分をマスクとして所望の
孔内壁のみに光照射を行う工程の２回の露光作業を必要
がある為、同じく生産性の低下を招くという課題があっ
た。Further, a known example (2): JP-A-4-9395
In Japanese Patent Laid-Open No. 0-35587 and JP-A-3-35587, the inner peripheral surface of the hole 2 is exposed using a scattering mirror 12 having diffuse reflection. However, a known example: JP-A-4-93950 discloses that
Since the scattering mirror 12 is arranged only on one side, and two exposure operations are required to manufacture the printed wiring board 1 having wirings on both sides, there is a problem that productivity is reduced. Further, JP-A-3-35587 discloses a step of irradiating light for a pattern forming portion in an exposure step and a step of irradiating only a desired inner wall of a hole with a portion other than the hole 2 to be irradiated with light as a mask. Since the above two exposure operations are required, there is also a problem that productivity is lowered.
【０００９】本発明の目的は、露光量の不足がなく、生
産性の高い印刷配線板の製造方法を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a printed wiring board having a high productivity without a shortage of light exposure.
【００１０】[0010]
【課題を解決するための手段】前述の課題を解決するた
めに、本発明では印刷配線板の表面及び孔内に感光性レ
ジスト膜を形成する工程と、前記感光性レジスト膜にマ
スクフィルムを介し、紫外線平行光を照射して露光する
工程と、その後現像及びエッチングにより所望のパター
ンを形成する工程とを有する印刷配線板の製造方法に於
いて、半透過性のハーフミラー層を有する光散乱層を介
して紫外線平行光を照射し露光することを特徴とする印
刷配線板の製造方法を提供することにある。In order to solve the above-mentioned problems, in the present invention, a step of forming a photosensitive resist film on the surface and in a hole of a printed wiring board, and a step of interposing a mask film on the photosensitive resist film. A method of manufacturing a printed wiring board having a step of irradiating and irradiating ultraviolet parallel light, and a step of forming a desired pattern by development and etching thereafter, wherein a light scattering layer having a semi-transparent half mirror layer is provided. And a method for manufacturing a printed wiring board, which comprises irradiating and irradiating ultraviolet parallel light through the substrate.
【００１１】本発明による製造方法によれば、印刷配線
板の露光工程に於いて、半透過性のハーフミラー層を有
する光散乱層を、感光性レジスト膜を電着塗装した印刷
配線板の両面に配置することにより、上下に配置された
光源より発せられた紫外線平行光が、半透過性ハーフミ
ラー層を有する光散乱層によって、 １）まず、一方の光源から発生した紫外線平行光の一部
が光散乱層の効果により、透過する際、屈折し散乱光と
なり、孔内の露光効率が増加する。According to the manufacturing method of the present invention, in the step of exposing the printed wiring board, the light-scattering layer having the semi-transmissive half-mirror layer is formed on both sides of the printed wiring board on which the photosensitive resist film is electrodeposited. 1) First, a part of the ultraviolet collimated light generated from one of the light sources is transmitted by the light scattering layer having the semi-transmissive half mirror layer. Due to the effect of the light scattering layer, when transmitted, the light is refracted and becomes scattered light, and the exposure efficiency in the hole increases.
【００１２】２）そのまま透過しようとする紫外線平行
光の一部が、反対面のハーフミラー層で反射、散乱し、
更に孔内周面に形成された感光性レジスト膜の露光効率
を増加させる。尚、ハーフミラー層で反射した一部の紫
外線平行光が、元の光源側へ抜ける際にも光源側のハー
フミラー層にて反射、散乱し、更に孔内の露光効率を一
層高める効果が生じる。尚、反対側の光源から発生した
紫外線平行光についても同様の作用が働くことはいうま
でもないことである。2) A part of the ultraviolet collimated light to be transmitted as it is is reflected and scattered by the half mirror layer on the opposite surface,
Further, the exposure efficiency of the photosensitive resist film formed on the inner peripheral surface of the hole is increased. In addition, even when a part of the ultraviolet parallel light reflected by the half mirror layer escapes to the original light source side, it is reflected and scattered by the half mirror layer on the light source side, and further has an effect of further improving the exposure efficiency in the hole. . It is needless to say that the same action also works for ultraviolet collimated light generated from the light source on the opposite side.
【００１３】[0013]
【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１４】図１は本発明の第１の実施の形態の印刷配
線板の製造方法を示す断面図、図２は図１の半透過性ハ
ーフミラー層を有する光散乱層の構成を示す断面図であ
る。本発明の第１の実施の形態の印刷配線板の製造方法
は、図１に示すように、まず、穴あけ後に銅めっき処理
を施した印刷配線板１の表面及び孔内２周面に電着塗装
法等により感光性レジスト膜３を形成する。なお、本実
施の形態では、感光性レジスト膜３に、日本ペイント
（株）製ポジ型（光分解型）電着レジスト（Ｐ−１００
０）を用い約７〜９μｍの厚みの感光性レジスト膜３を
形成した。FIG. 1 is a sectional view showing a method of manufacturing a printed wiring board according to a first embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of a light scattering layer having a semi-transmissive half mirror layer of FIG. It is. As shown in FIG. 1, the method for manufacturing a printed wiring board according to the first embodiment of the present invention is as follows. First, the surface of the printed wiring board 1 that has been subjected to copper plating after drilling and the two peripheral surfaces in the hole are electrodeposited. The photosensitive resist film 3 is formed by a coating method or the like. In the present embodiment, a positive type (photodecomposition type) electrodeposited resist (P-100) manufactured by Nippon Paint Co., Ltd.
0) to form a photosensitive resist film 3 having a thickness of about 7 to 9 μm.
【００１５】次いで、スルーホールとなる孔２ｂ部は遮
光し、所望の非スルーホールとなる孔２ａ部に対して紫
外線平行光７を透過させるようなマスクフィルム４を印
刷配線板１に当接し、半透過性のハーフミラー層を有す
る光散乱層８ａを貼り付けた、厚みが３〜１０ｍｍ程度
の透明アクリルからなる真空焼き枠５にセットする。特
に図２に示されるような半透過性のハーフミラー層を有
する光散乱層８ａには、例えば光散乱層１０として、微
細な凹凸のエンボス加工をした、厚みが０．１〜０．３
ｍｍ程度の透明シート（ソマール（株）：エンボスＹ
等）を使用し、ハーフミラー層１４として、銀をポーラ
スに蒸着させた、厚みが約０．０５ｍｍ程度のハーフミ
ラータイプのシート（モダンプラスチック工業（株）：
サンマイルド等）を使用して、両者を張り合わせ２層構
造を持たせ、これを透明アクリルからなる真空焼き枠５
のマスクフィルム側に配置する。Then, a mask film 4 that transmits ultraviolet collimated light 7 to the hole 2a, which is a desired non-through hole, is brought into contact with the printed wiring board 1 while shielding the hole 2b, which becomes a through hole, from light. The light scattering layer 8a having a semi-transmissive half mirror layer is attached to the vacuum firing frame 5 made of transparent acrylic and having a thickness of about 3 to 10 mm. In particular, the light scattering layer 8a having a semi-transparent half mirror layer as shown in FIG.
mm transparent sheet (Somar Corporation: Emboss Y
And the like, and as the half mirror layer 14, a half mirror type sheet having a thickness of about 0.05 mm in which silver is vapor-deposited porous (Modern Plastics Industry Co., Ltd .:
The two are laminated to each other to form a two-layer structure, which is made of a vacuum baked frame 5 made of transparent acrylic.
On the side of the mask film.
【００１６】次に、光源６より紫外線平行光７を照射す
ると、フォトマスクフィルム透明部（図中の非ハッチン
グ部）直下の感光性レジスト膜３が露光される。この
時、非スルーホールとなる孔２ａ部の半透過性のハーフ
ミラー層を有する光散乱層８ａを透過する紫外線平行孔
７は、凹凸のエンボス加工をした透明シートから成る光
散乱層１０により屈折し、散乱光９ａに変換される。さ
らに非スルーホールとなる孔２ａの孔内を通過した散乱
光９ａの一部は、反光源側の焼き枠の半透過性のハーフ
ミラー層を有する光散乱層８ａにより乱反射されるため
反射光９ｂを伴った光で光２内周面を露光することがで
きる。また、前記の反射光９ｂの一部は再度光源側の半
透過性のハーフミラー層を有する光散乱層８ａで再反射
光９ｃとなり孔２内周面を露光する効果も持つ。Next, when the ultraviolet light 7 is irradiated from the light source 6, the photosensitive resist film 3 immediately below the transparent portion of the photomask film (non-hatched portion in the drawing) is exposed. At this time, the ultraviolet ray parallel holes 7 penetrating the light scattering layer 8a having the semi-transmissive half mirror layer in the hole 2a serving as a non-through hole are refracted by the light scattering layer 10 made of a transparent sheet with embossed unevenness. Then, it is converted into scattered light 9a. Further, a part of the scattered light 9a passing through the hole 2a to be a non-through hole is irregularly reflected by the light scattering layer 8a having a semi-transmissive half mirror layer of the burning frame on the side opposite to the light source, so that the reflected light 9b The inner peripheral surface of the light 2 can be exposed with the light accompanied by A part of the reflected light 9b becomes the re-reflected light 9c again by the light scattering layer 8a having the semi-transmissive half mirror layer on the light source side, and has an effect of exposing the inner peripheral surface of the hole 2.
【００１７】前記の光の散乱は印刷配線板の反対側に配
置された光源より照射された紫外線平行光７にも全く同
様に行われる。したがって、孔２ａ内周面の露光不足等
の不良が無く、高密度配線に適した微細な孔の露光が可
能となるとともに、スルーホール及び微細非スルーホー
ルの形成が１度の露光作業で製造することが可能とな
る。The light scattering is performed in the same manner on the ultraviolet collimated light 7 irradiated from the light source disposed on the opposite side of the printed wiring board. Accordingly, there is no defect such as insufficient exposure of the inner peripheral surface of the hole 2a, and it is possible to expose fine holes suitable for high-density wiring, and it is possible to form through holes and fine non-through holes in a single exposure operation. It is possible to do.
【００１８】下記に本発明の具備的実施例を示す。印刷
配線板１として、板厚１．６ｍｍのガラスエポキシ積層
板を用い、感光性レジスト膜３に光分解型電着レジスト
（Ｐ−１００）を電着塗装させた。露光工程に於いて、
本発明の実施例の半透過性のハーフミラー層を有する光
散乱層８ａを用いたケース、従来例の光散乱層１０を用
いたケース、光散乱層を用いないケースについて、露光
量と非スルーホールの形成性及び解像度の関係を調査し
た結果を表１に示した。The following is an illustrative embodiment of the present invention. A 1.6 mm thick glass epoxy laminate was used as the printed wiring board 1, and the photosensitive resist film 3 was electrodeposited with a photodecomposable electrodeposition resist (P-100). In the exposure process,
In the case of using the light scattering layer 8a having the semi-transmissive half mirror layer of the embodiment of the present invention, the case of using the light scattering layer 10 of the conventional example, and the case of not using the light scattering layer, the exposure amount and the non-through Table 1 shows the results of investigating the relationship between the hole formation properties and the resolution.
【００１９】[0019]
【表１】 [Table 1]
【００２０】一般的に光分解型の電着レジスト膜の露光
は、レジスト面上で２００４００ｍＪ／ｃｍ2 の露光量
で行われる。露光量の条件は１５０、３００、４５０ｍ
Ｊ／ｃｍ2 で行い、非スルーホールの形成性は０．８、
１．２、１．６の孔径を使用した。また、解像度はマス
クフィルムの回路幅（Ｗ0 ）に対する、露光、現像後の
感光性レジスト膜の回路幅（Ｗ）の変動量（｜Ｗ0 −Ｗ
｜）で示した。Generally, the exposure of the photodecomposition type electrodeposited resist film is performed on the resist surface at an exposure amount of 200,400 mJ / cm 2 . Exposure conditions are 150, 300, and 450 m
J / cm 2 , the non-through hole formation was 0.8,
A pore size of 1.2, 1.6 was used. Also, the resolution is the variation (| W 0 −W) of the circuit width (W) of the photosensitive resist film after exposure and development with respect to the circuit width (W 0 ) of the mask film.
|).
【００２１】露光工程で非スルーホールを同時形成する
場合、高アスペクト比に成る程、孔内の露光量が低下す
るため、紫外線の露光量を増大する必要がある。従来例
では露光量が３００ｍＪ／ｃｍ2 の場合、１．６（アス
ペクト比１）の非スルーホールの形成が限界ポイントと
なる為、１．２の非スルーホールを形成するには４５０
ｍＪ／ｃｍ2 の露光量を照射しなければならない。これ
に対し本発明の実施の形態の露光方法によると、露光量
が３００ｍＪ／ｃｍ2 の場合でも０．８（アスペクト比
２）の如く高アスペクトスルーホールの孔内露光を均一
にかつ十分に行うことができる。When non-through holes are simultaneously formed in the exposure step, the higher the aspect ratio, the lower the amount of exposure in the holes. Therefore, it is necessary to increase the amount of ultraviolet light exposure. In the conventional example, when the exposure amount is 300 mJ / cm 2 , the formation of a 1.6 (aspect ratio 1) non-through hole is a critical point.
An exposure dose of mJ / cm 2 must be applied. On the other hand, according to the exposure method of the embodiment of the present invention, even when the exposure amount is 300 mJ / cm 2 , the inside of the high aspect through hole is uniformly and sufficiently exposed as 0.8 (aspect ratio 2). be able to.
【００２２】一方、解像度の観点でみると、露光量の増
大は感光性レジスト膜の解像度を低下させる傾向を示
す。本発明の実施例と従来例を比較した場合、各露光量
における回路幅変動量に相違は見らず解像度は同等であ
るが、両者は光散乱層を利用するため照射光に斜光成分
が多く、光散乱層無しのケースと比較すると解像度が劣
ってしまうという不利な点を有する。しかし光散乱層無
しのケースは孔内の露光はほとんど行われないために、
非スルーホールの同時形成は不可能である。このように
露光量に対して非スルーホールの形成性と解像度は密接
な関係を持つが、本発明の実施例によれば、従来例と比
較して解像度を低下させることなく、かつ孔内露光量の
みを可能な限り増加させることができる。On the other hand, from the viewpoint of resolution, an increase in the amount of exposure tends to lower the resolution of the photosensitive resist film. When comparing the embodiment of the present invention with the conventional example, no difference is observed in the amount of circuit width variation at each exposure amount, and the resolutions are the same, but since both use a light scattering layer, the irradiation light has a large oblique light component. In addition, there is a disadvantage that the resolution is inferior to the case without the light scattering layer. However, in the case without a light scattering layer, exposure inside the hole is hardly performed, so
Simultaneous formation of non-through holes is not possible. As described above, the formability of the non-through hole and the resolution are closely related to the exposure amount. However, according to the embodiment of the present invention, the exposure in the hole can be performed without lowering the resolution as compared with the conventional example. Only the amount can be increased as much as possible.
【００２３】図３は本発明の第２の実施の形態の半透過
性のハーフミラー層を有する光散乱層の構成を示す断面
図である。本発明の第２の実施の形態の印刷配線板の製
造方法は、図２で示される第１の実施の形態の半透過性
のハーフミラー層を有する光散乱層は２層構造となって
いるが、第２の実施の形態のハーフミラー層では、図３
に示すように、銀をポーラスに蒸着させた、厚みが約
０．５ｍｍ程度のハーフミラータイプのシートに、微細
な凹凸のエンボス加工をした、厚みが、０．１〜０．３
ｍｍ程度の透明シートを両面に張り合わせた３層構造と
しても第１の実施の形態の半透過性ハーフミラー層と同
様の効果が得られる。FIG. 3 is a sectional view showing the structure of a light scattering layer having a semi-transmissive half mirror layer according to a second embodiment of the present invention. In the method for manufacturing a printed wiring board according to the second embodiment of the present invention, the light scattering layer having the semi-transparent half mirror layer according to the first embodiment shown in FIG. 2 has a two-layer structure. However, in the half mirror layer of the second embodiment, FIG.
As shown in FIG. 5, a half mirror type sheet having a thickness of about 0.5 mm, in which silver is vapor-deposited in a porous manner, is embossed with fine irregularities, and has a thickness of 0.1 to 0.3 mm.
The same effect as in the semi-transmissive half mirror layer of the first embodiment can be obtained even with a three-layer structure in which a transparent sheet of about mm is bonded to both sides.
【００２４】[0024]
【発明の効果】以上説明したように本発明によれば、従
来露光技術に対して、孔内周面の露光不足のない高密度
配線に適した微細な孔を有する印刷配線板を１度の露光
作業で製造することが可能となる。また、マスクフィル
ム側に配置した微細な凹凸を有する透明シートにより、
真空引きを行う際の焼き枠内のエアー抜け性が向上し、
エアー溜まりにより発生する密着不良や部分的な解像度
の低下不良を防止できるという効果が得られる。As described above, according to the present invention, a printed wiring board having fine holes suitable for high-density wiring without underexposure on the inner peripheral surface of the hole can be formed at one time with respect to the conventional exposure technique. It can be manufactured by exposure work. In addition, with a transparent sheet with fine irregularities arranged on the mask film side,
Improved air bleeding inside the grill when vacuuming,
The effect of preventing poor adhesion and partial resolution deterioration caused by air accumulation can be obtained.
【図１】本発明の第１の実施の形態の印刷配線板の製造
方法を示す断面図である。FIG. 1 is a cross-sectional view illustrating a method for manufacturing a printed wiring board according to a first embodiment of the present invention.
【図２】図１の半透過性のハーフミラー層を有する光散
乱層の構成を示す断面図である。FIG. 2 is a sectional view showing a configuration of a light scattering layer having a semi-transparent half mirror layer of FIG.
【図３】本発明の第２の実施の形態の半透過性のハーフ
ミラー層を有する光散乱層の構成を示す断面図である。FIG. 3 is a cross-sectional view illustrating a configuration of a light scattering layer having a semi-transparent half mirror layer according to a second embodiment of the present invention.
【図４】公知例（１）の露光方法を示す断面図である。FIG. 4 is a cross-sectional view illustrating an exposure method of a known example (1).
【図５】公知例（２）の露光方法を示す断面図である。FIG. 5 is a cross-sectional view illustrating an exposure method of a known example (2).
１ 印刷配線板 ２ 孔 ２ａ 非スルーホールとなる孔 ２ｂ スルーホールとなる孔 ３ 感光性レジスト膜 ４ マスクフィルム ５ 真空焼き枠 ６ 光源 ７ 紫外線平行光 ８ａ 半透過性のハーフミラー層を有する光散乱層 ８ｂ 半透過性のハーフミラー層を有する光散乱層
（３層構造） ９ａ 散乱光 ９ｂ 半反射光 ９ｃ 再反射光 １０ 光散乱層 １１ 露光テーブル １２ 散乱鏡 １３ 全反射光 １４ 半透過性のハーフミラー層DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Hole 2a Hole to be a non-through hole 2b Hole to be a through hole 3 Photosensitive resist film 4 Mask film 5 Vacuum frame 6 Light source 7 Ultraviolet parallel light 8a Light scattering layer having a semi-transparent half mirror layer 8b Light scattering layer having a semi-transmissive half mirror layer (three-layer structure) 9a Scattered light 9b Semi-reflected light 9c Re-reflected light 10 Light scattering layer 11 Exposure table 12 Scattering mirror 13 Totally reflected light 14 Semi-transmissive half mirror layer
Claims (3)
スト膜を形成する工程と、マスクフィルムを介し前記感
光性レジスト膜に紫外線を照射して露光する工程と、そ
の後現像及びエッチングにより所望のスルーホール及び
非スルーホールを形成する工程とを有する印刷配線板の
製造方法に於いて、半透過性のハーフミラー層を有する
光散乱層を介して、紫外線平行光を照射し露光すること
を特徴とする印刷配線板の製造方法。1. A step of forming a photosensitive resist film on the surface and in a hole of a printed wiring board; a step of irradiating the photosensitive resist film with ultraviolet rays through a mask film; Forming a through hole and a non-through hole of the printed wiring board, through a light scattering layer having a semi-transparent half mirror layer, irradiating and irradiating ultraviolet parallel light. A method for manufacturing a printed wiring board, which is characterized by the following.
ーラスに蒸着させた透明シートを使用して微細な凹凸の
エンボス加工をした透明シートとを張り合わせ２層構造
としたことを特徴とする請求項１記載の印刷配線板の製
造方法。2. A semi-transparent half mirror layer comprising a transparent sheet in which silver is vapor-deposited in a porous manner and a transparent sheet in which fine irregularities are embossed, which are laminated to form a two-layer structure. A method for manufacturing a printed wiring board according to claim 1.
ーラスに蒸着させた透明シートを使用して微細な凹凸の
あるエンボス加工をした透明シートを両面に張り合わせ
３層構造としたことを特徴とする印刷配線板の製造方
法。3. A three-layer structure in which the transparent semi-transparent half mirror layer is made of a transparent sheet in which silver is vapor-deposited in a porous manner and a transparent sheet which is embossed with fine irregularities is stuck on both sides to form a three-layer structure. Manufacturing method of a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22892796A JP2872137B2 (en) | 1996-08-29 | 1996-08-29 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22892796A JP2872137B2 (en) | 1996-08-29 | 1996-08-29 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1075036A true JPH1075036A (en) | 1998-03-17 |
| JP2872137B2 JP2872137B2 (en) | 1999-03-17 |
Family
ID=16884045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22892796A Expired - Lifetime JP2872137B2 (en) | 1996-08-29 | 1996-08-29 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2872137B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006229033A (en) * | 2005-02-18 | 2006-08-31 | Hitachi Aic Inc | Method for manufacturing wiring-board for side-surface electrode |
| JP2009033034A (en) * | 2007-07-30 | 2009-02-12 | Sumitomo Electric Ind Ltd | Printed wiring board and its manufacturing method |
| KR20210129680A (en) * | 2019-02-14 | 2021-10-28 | 오르보테크 엘티디. | Method and apparatus for manufacturing PCB products with high density conductors |
-
1996
- 1996-08-29 JP JP22892796A patent/JP2872137B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006229033A (en) * | 2005-02-18 | 2006-08-31 | Hitachi Aic Inc | Method for manufacturing wiring-board for side-surface electrode |
| JP2009033034A (en) * | 2007-07-30 | 2009-02-12 | Sumitomo Electric Ind Ltd | Printed wiring board and its manufacturing method |
| KR20210129680A (en) * | 2019-02-14 | 2021-10-28 | 오르보테크 엘티디. | Method and apparatus for manufacturing PCB products with high density conductors |
| US11596070B2 (en) | 2019-02-14 | 2023-02-28 | Orbotech Ltd. | Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2872137B2 (en) | 1999-03-17 |
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