JPH0456189A - Manufacture of printed-wiring board - Google Patents
Manufacture of printed-wiring boardInfo
- Publication number
- JPH0456189A JPH0456189A JP16371290A JP16371290A JPH0456189A JP H0456189 A JPH0456189 A JP H0456189A JP 16371290 A JP16371290 A JP 16371290A JP 16371290 A JP16371290 A JP 16371290A JP H0456189 A JPH0456189 A JP H0456189A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resist film
- copper
- hole
- parallel light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 13
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 238000004070 electrodeposition Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
この発明はスルーホールを有するプリント配線板の製造
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a printed wiring board having through holes.
第２図は従来の露光方法を示す断面図であり、電着塗装
により銅張積層板の表面および穴内周面に形成した感光
性レジスト膜を露光する例を示している。図において、
（１）はスルーホール（ｌａ）を有する銅張積層板、（
２）はこの銅張積層板（１）の銅表面およびスルーホー
ル（１ａ）の内周面に電着塗装によって塗布した感光性
レジスト膜、（３）はこの感光性レジスト膜（２）に露
光するためのマスクフィルム、（４）はこれらを収容す
る真空焼枠の透明板で、矢印入方向に移動可能になって
いる。（５）は真空焼枠の透明板（４）の両側に設けら
れた光源で、矢印Ｂ方向に移動可能で、かつ散乱光（６
）を照射するようになっている。FIG. 2 is a sectional view showing a conventional exposure method, and shows an example in which a photosensitive resist film formed on the surface of a copper-clad laminate and the inner peripheral surface of a hole by electrodeposition is exposed. In the figure,
(1) is a copper-clad laminate with through holes (la), (
2) is a photosensitive resist film applied by electrodeposition to the copper surface of this copper-clad laminate (1) and the inner peripheral surface of the through hole (1a), and (3) is a photosensitive resist film that is exposed to light on this photosensitive resist film (2). The mask film (4) is a transparent plate of a vacuum printing frame that accommodates these, and is movable in the direction indicated by the arrow. (5) is a light source provided on both sides of the transparent plate (4) of the vacuum baking frame, which is movable in the direction of arrow B, and has scattered light (6).
).
次にプリント配線板の製造方法について説明する。まず
、穴明けおよび銅めっきを施した銅張積層板（１）に電
着塗装により感光性レジスト膜（２）を形成する。そし
てその両面にマスクフィルム（３）を付し、真空焼枠（
４）に入れて真空引きする。Next, a method for manufacturing a printed wiring board will be explained. First, a photosensitive resist film (2) is formed by electrodeposition on a copper-clad laminate (1) that has been subjected to perforation and copper plating. A mask film (3) is attached to both sides of the film, and a vacuum baking frame (
4) and vacuum it.
次いで、上下両面に配した光源（５）の間を真空焼枠（
４）が走査し、散乱光（６）によってマスクフィルム（
３）の透明部（３ａ）の直下の感光性レジスト膜（２）
およびスルーホール（ｌａ）内の感光性レジスト膜（２
）を照射して露光し、硬化させる。Next, a vacuum printing frame (
4) scans, and the mask film (
Photosensitive resist film (2) directly under the transparent part (3a) of 3)
and the photosensitive resist film (2) in the through hole (la).
) is exposed to light and cured.
次にマスクフィルム（３）の黒部（３ｂ）によって光が
照射されていない部分の感光性レジスト膜（２）を現像
で除去し、その後エツチングによって不必要な銅を除去
して導体パターンを形成する。Next, the portions of the photosensitive resist film (2) that are not irradiated with light due to the black portions (3b) of the mask film (3) are removed by development, and then unnecessary copper is removed by etching to form a conductor pattern. .
従来のプリント配線板の製造方法は以上のように構成さ
れているので、スルーホール（１ａ）を有する銅張積層
板（１）に電着塗装によって形成した感光性レジスト膜
（２）を露光するためには、散乱光（６）を発する専用
露光機が必要であり、一般に用いられている平行光（７
）を発する露光機では穴内周面への露光ができないとと
もに、平行光（７）を必要とするドライフィルムレジス
トを使用できないなどの問題点があった。The conventional method for producing a printed wiring board is configured as described above, and a photosensitive resist film (2) formed by electrodeposition on a copper-clad laminate (1) having through holes (1a) is exposed to light. For this purpose, a dedicated exposure machine that emits scattered light (6) is required, and the commonly used parallel light (7) is required.
) has problems such as not being able to expose the inner peripheral surface of the hole, and not being able to use dry film resist that requires parallel light (7).
この発明は上記のような問題点を除去するためになされ
たもので、一般に用いられている平行光を発する露光機
を用いて銅張積層板の表面のみならず、穴内周面の感光
性レジスト膜をも露光、硬化することのできるプリント
配線板の製造方法を提供することを目的とする。This invention was made to eliminate the above-mentioned problems, and uses a commonly used exposure machine that emits parallel light to remove photosensitive resist not only on the surface of the copper-clad laminate but also on the inner peripheral surface of the hole. An object of the present invention is to provide a method for manufacturing a printed wiring board in which a film can also be exposed and cured.
この発明のプリント配線板の製造方法は、スルーホール
を有する銅張積層板の表面および穴内周面に感光性レジ
スト膜を形成し、この感光性レジスト膜にマスクフィル
ムを介して光を照射して露光し、その後現像およびエツ
チングしてパターニングするようにしたプリント配線板
の製造方法において、平行光を散乱光に変換する光散乱
層を通して平行光を照射し、露光する方法である。The method for manufacturing a printed wiring board of the present invention includes forming a photosensitive resist film on the surface of a copper-clad laminate having through holes and the inner peripheral surface of the hole, and irradiating the photosensitive resist film with light through a mask film. In a method of manufacturing a printed wiring board in which the printed wiring board is exposed, and then patterned by development and etching, parallel light is irradiated through a light scattering layer that converts parallel light into scattered light and then exposed.
この発明のプリント配線板の製造方法においては、スル
ーホールを有する銅張積層板の表面および穴内周面に感
光性レジスト膜を形成し、この感光性レジスト膜にマス
クフィルムを介して平行光を照射すると、光散乱層によ
り平行光は散乱光に変換され、銅張積層板の表面および
穴内周面に形成された感光性レジスト膜は露光される。In the method for manufacturing a printed wiring board of the present invention, a photosensitive resist film is formed on the surface of a copper-clad laminate having through holes and on the inner peripheral surface of the hole, and parallel light is irradiated to this photosensitive resist film through a mask film. Then, the parallel light is converted into scattered light by the light scattering layer, and the photosensitive resist film formed on the surface of the copper-clad laminate and the inner peripheral surface of the hole is exposed.
その後現像、エツチング等の工程によりパターニングさ
れ、プリント配線板が製造される。Thereafter, it is patterned through processes such as development and etching, and a printed wiring board is manufactured.
以下、この発明の一実施例を図について説明する。第１
図は実施例の素光方法を示す断面図である。図において
、（１）はスルーホール（１ａ）を有する銅張積層板、
（２）は電着塗装によって形成した感光性レジスト膜、
（３）はマスクフィルム、（４）は真空焼枠の透明板で
、これらは第２図と同様に構成されている。光源（５）
は従来と異なり、平行光（７）を照射するようになって
いる。（８）はマスクフィルム（３）の感光性レジスト
膜（２）側に貼付した微細な凹凸のあるシート（オーバ
ーコート）からなる光散乱層で、平行光（７）を散乱光
（６）に変換するようになっている。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view showing the elementary light method of the embodiment. In the figure, (1) is a copper-clad laminate having a through hole (1a),
(2) is a photosensitive resist film formed by electrodeposition coating;
(3) is a mask film, (4) is a transparent plate of a vacuum printing frame, and these are constructed in the same manner as shown in FIG. Light source (5)
Unlike the conventional method, it irradiates parallel light (7). (8) is a light scattering layer made of a sheet (overcoat) with fine irregularities attached to the photosensitive resist film (2) side of the mask film (3), which converts parallel light (7) into scattered light (6). It is supposed to be converted.
次にプリント配線板の製造方法について説明する。スル
ーホール（１ａ）の穴明けおよび銅めっきを施した銅張
積層板（１）の表面およびスルーホール（１ａ）の内周
面に、電着塗装により感光性レジスト膜（２）を形成す
る６そして微細な凹凸を施したシートを貼付して光散乱
層（８）を形成したマスクフィルム（３）を銅張積層板
（１）の両面に付し、真空焼枠（４）に入れて真空引き
する。Next, a method for manufacturing a printed wiring board will be explained. 6. Forming a photosensitive resist film (2) by electrodeposition on the surface of the copper-clad laminate (1) with the through-holes (1a) drilled and copper-plated and on the inner peripheral surface of the through-holes (1a)6. Then, a mask film (3) in which a light-scattering layer (8) is formed by pasting a sheet with fine irregularities is applied to both sides of the copper-clad laminate (1), and the film is placed in a vacuum baking frame (4) and vacuumed. Pull.
次いで上下両面に配した光源（５）の間に真空焼枠（４
）を配置し、平行光（７）を照射すると、マスクフィル
ム（３）を透過した平行光（７）は光散乱層（８）を形
成するシートの凹凸によって散乱光（６）に変換され、
マスクフィルム（３）の透明部（３ａ）の直下の感光性
レジスト膜（２）を露光させるとともに、スルーホール
（ｌａ）の内周面の感光性レジスト膜（２）をも照射し
て露光させ、硬化させる。Next, a vacuum baking frame (4) is placed between the light sources (5) placed on both the upper and lower sides.
) is placed and irradiated with parallel light (7), the parallel light (7) transmitted through the mask film (3) is converted into scattered light (6) by the unevenness of the sheet forming the light scattering layer (8),
The photosensitive resist film (2) directly under the transparent part (3a) of the mask film (3) is exposed to light, and the photosensitive resist film (2) on the inner peripheral surface of the through hole (la) is also irradiated and exposed. , harden.
次にマスクフィルム（３）の黒部（３ｂ）によって光が
照射されていない部分の感光性レジスト膜（２）を現像
で除去し、その後エツチングによって不必要な銅を除去
して導体パターンを形成する。Next, the portions of the photosensitive resist film (2) that are not irradiated with light due to the black portions (3b) of the mask film (3) are removed by development, and then unnecessary copper is removed by etching to form a conductor pattern. .
なお、上記実施例では、光散乱層（８）として微細な凹
凸を施したシートをマスクフィルム（３）に貼付ける場
合について説明したが、このシートをマスクフィルム（
３）と真空焼枠（４）の間に配置してもよく、またマス
クフィルム（３）自体の片側のみに微細な凹凸を形成し
て光散乱層（８）としてもよく、上記実施例と同様の効
果を奏する。In the above example, a case was explained in which a sheet with fine irregularities was attached to the mask film (3) as the light scattering layer (8), but this sheet was attached to the mask film (3).
3) and the vacuum baking frame (4), or the mask film (3) itself may be formed with fine irregularities on only one side to form a light scattering layer (8). It has a similar effect.
以上のように、この発明によれば、光散乱層により平行
光を散乱光に変換するようにしたので、穴内周面にも散
乱光を照射する専用素光機が不要で、一般に用いられて
いる平行光を発する露光機を使用して穴内周面にも露光
できるとともに、平行光が必要なドライフィルムレジス
トを使用でき、工場の省スペース化が図れるなどの効果
がある。As described above, according to the present invention, parallel light is converted into scattered light by the light scattering layer, so there is no need for a dedicated elementary light device that irradiates scattered light also on the inner peripheral surface of the hole, and it is In addition to being able to expose the inner peripheral surface of the hole using an exposure machine that emits parallel light, it also allows the use of dry film resists that require parallel light, which has the effect of saving space in the factory.
第１図は実施例の露光方法を示す断面図、第２図は従来
の露光方法を示す断面図である。
各図中、同一符号は同一または相当部分を示し、（１）
は銅張積層板、（ｌａ）はスルーホール、（２）は感光
性レジスト膜、（３）はマスクフィルム、（４）は真空
焼枠の透明板、（５）は光源、（６）は散乱光、（７）
は平行光、（８）は光散乱層である。FIG. 1 is a sectional view showing an exposure method according to an embodiment, and FIG. 2 is a sectional view showing a conventional exposure method. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
is a copper-clad laminate, (la) is a through hole, (2) is a photosensitive resist film, (3) is a mask film, (4) is a transparent plate with a vacuum baking frame, (5) is a light source, and (6) is a Scattered light, (7)
is parallel light, and (8) is a light scattering layer.
Claims (1)
内周面に感光性レジスト膜を形成し、この感光性レジス
ト膜にマスクフィルムを介して光を照射して露光し、そ
の後現像およびエッチングしてパターニングするように
したプリント配線板の製造方法において、平行光を散乱
光に変換する光散乱層を通して平行光を照射し、露光す
ることを特徴とするプリント配線板の製造方法。(1) A photosensitive resist film is formed on the surface of a copper-clad laminate having through holes and on the inner peripheral surface of the hole, and the photosensitive resist film is exposed to light through a mask film, and then developed and etched. 1. A method for manufacturing a printed wiring board in which parallel light is irradiated and exposed through a light scattering layer that converts parallel light into scattered light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16371290A JPH0456189A (en) | 1990-06-21 | 1990-06-21 | Manufacture of printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16371290A JPH0456189A (en) | 1990-06-21 | 1990-06-21 | Manufacture of printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456189A true JPH0456189A (en) | 1992-02-24 |
Family
ID=15779208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16371290A Pending JPH0456189A (en) | 1990-06-21 | 1990-06-21 | Manufacture of printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456189A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075037A (en) * | 1996-08-29 | 1998-03-17 | Nec Toyama Ltd | Method for manufacturing of printed wiring board |
| JP2006317693A (en) * | 2005-05-12 | 2006-11-24 | Nec Toppan Circuit Solutions Inc | Exposure method, exposure mask, and protecting film for mask |
-
1990
- 1990-06-21 JP JP16371290A patent/JPH0456189A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075037A (en) * | 1996-08-29 | 1998-03-17 | Nec Toyama Ltd | Method for manufacturing of printed wiring board |
| US5942375A (en) * | 1996-08-29 | 1999-08-24 | Nec Corporation | Method of fabricating printed wiring board |
| JP2006317693A (en) * | 2005-05-12 | 2006-11-24 | Nec Toppan Circuit Solutions Inc | Exposure method, exposure mask, and protecting film for mask |
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