JPH10256346A - カセット搬出入機構及び半導体製造装置 - Google Patents

カセット搬出入機構及び半導体製造装置

Info

Publication number
JPH10256346A
JPH10256346A JP9078914A JP7891497A JPH10256346A JP H10256346 A JPH10256346 A JP H10256346A JP 9078914 A JP9078914 A JP 9078914A JP 7891497 A JP7891497 A JP 7891497A JP H10256346 A JPH10256346 A JP H10256346A
Authority
JP
Japan
Prior art keywords
cassette
loading
unloading
semiconductor manufacturing
manufacturing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9078914A
Other languages
English (en)
Japanese (ja)
Inventor
Yoji Iizuka
洋二 飯塚
Teruo Asakawa
輝雄 浅川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP9078914A priority Critical patent/JPH10256346A/ja
Priority to TW087103564A priority patent/TW432463B/zh
Priority to KR1019980008317A priority patent/KR19980080191A/ko
Publication of JPH10256346A publication Critical patent/JPH10256346A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP9078914A 1997-03-13 1997-03-13 カセット搬出入機構及び半導体製造装置 Pending JPH10256346A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9078914A JPH10256346A (ja) 1997-03-13 1997-03-13 カセット搬出入機構及び半導体製造装置
TW087103564A TW432463B (en) 1997-03-13 1998-03-11 A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus
KR1019980008317A KR19980080191A (ko) 1997-03-13 1998-03-12 카셋트 반출입 기구 및 반도체 제조 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9078914A JPH10256346A (ja) 1997-03-13 1997-03-13 カセット搬出入機構及び半導体製造装置

Publications (1)

Publication Number Publication Date
JPH10256346A true JPH10256346A (ja) 1998-09-25

Family

ID=13675123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9078914A Pending JPH10256346A (ja) 1997-03-13 1997-03-13 カセット搬出入機構及び半導体製造装置

Country Status (3)

Country Link
JP (1) JPH10256346A (ko)
KR (1) KR19980080191A (ko)
TW (1) TW432463B (ko)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217295A (ja) * 2000-02-07 2001-08-10 Yaskawa Electric Corp 半導体製造装置
JP2001298069A (ja) * 2000-03-16 2001-10-26 Applied Materials Inc カセットの保管および移動装置
US6439822B1 (en) 1998-09-22 2002-08-27 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP2002246432A (ja) * 2001-02-13 2002-08-30 Hitachi Kokusai Electric Inc 基板処理装置
JP2003536247A (ja) * 2000-06-06 2003-12-02 ブルックス オートメーション インコーポレイテッド 材料搬送システム
WO2004021411A3 (en) * 2002-08-31 2004-04-15 Applied Materials Inc Method and apparatus for supplying substrates to a processing tool
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7314345B2 (en) 1999-07-27 2008-01-01 Renesas Technology Corp. Semiconductor container opening/closing apparatus and semiconductor device manufacturing method
JP2008508731A (ja) * 2004-07-29 2008-03-21 ケーエルエー−テンカー テクノロジィース コーポレイション 迅速スワップロードポート
JP2009065189A (ja) * 2000-09-27 2009-03-26 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法および半導体装置の製造方法
US7792608B2 (en) 2002-08-31 2010-09-07 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
USRE43023E1 (en) 2000-04-17 2011-12-13 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
JP2013074183A (ja) * 2011-09-28 2013-04-22 Sinfonia Technology Co Ltd サイド用ロードポート、ｅｆｅｍ
US8814488B2 (en) 2007-04-02 2014-08-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100788068B1 (ko) * 2000-08-23 2007-12-21 동경 엘렉트론 주식회사 피처리체의 처리시스템
KR100699154B1 (ko) * 2005-11-08 2007-03-21 동부일렉트로닉스 주식회사 스탠더드 메케니컬 인터페이스 장치

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6439822B1 (en) 1998-09-22 2002-08-27 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6746197B2 (en) 1998-09-22 2004-06-08 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR100646906B1 (ko) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US7314345B2 (en) 1999-07-27 2008-01-01 Renesas Technology Corp. Semiconductor container opening/closing apparatus and semiconductor device manufacturing method
JP2001217295A (ja) * 2000-02-07 2001-08-10 Yaskawa Electric Corp 半導体製造装置
JP4505924B2 (ja) * 2000-02-07 2010-07-21 株式会社安川電機 半導体製造装置
JP2001298069A (ja) * 2000-03-16 2001-10-26 Applied Materials Inc カセットの保管および移動装置
USRE43023E1 (en) 2000-04-17 2011-12-13 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
JP2003536247A (ja) * 2000-06-06 2003-12-02 ブルックス オートメーション インコーポレイテッド 材料搬送システム
JP4729237B2 (ja) * 2000-06-06 2011-07-20 ブルックス オートメーション インコーポレイテッド 材料搬送システム乃至方法、搬入ポートモジュール
JP2009065189A (ja) * 2000-09-27 2009-03-26 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法および半導体装置の製造方法
JP2002246432A (ja) * 2001-02-13 2002-08-30 Hitachi Kokusai Electric Inc 基板処理装置
US7299831B2 (en) 2002-08-31 2007-11-27 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
CN100397558C (zh) * 2002-08-31 2008-06-25 应用材料有限公司 向处理工具提供衬底的方法和设备
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7792608B2 (en) 2002-08-31 2010-09-07 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
WO2004021411A3 (en) * 2002-08-31 2004-04-15 Applied Materials Inc Method and apparatus for supplying substrates to a processing tool
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
JP2008508731A (ja) * 2004-07-29 2008-03-21 ケーエルエー−テンカー テクノロジィース コーポレイション 迅速スワップロードポート
JP2014160882A (ja) * 2004-07-29 2014-09-04 Kla-Encor Corp 自動材料ハンドリングシステムの材料加工の間における処理量低減装置
US8814488B2 (en) 2007-04-02 2014-08-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
JP2013074183A (ja) * 2011-09-28 2013-04-22 Sinfonia Technology Co Ltd サイド用ロードポート、ｅｆｅｍ

Also Published As

Publication number Publication date
KR19980080191A (ko) 1998-11-25
TW432463B (en) 2001-05-01

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