TW432463B - A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus - Google Patents
A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus Download PDFInfo
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- TW432463B TW432463B TW087103564A TW87103564A TW432463B TW 432463 B TW432463 B TW 432463B TW 087103564 A TW087103564 A TW 087103564A TW 87103564 A TW87103564 A TW 87103564A TW 432463 B TW432463 B TW 432463B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
經濟部中央標準局員工消費合作杜印聚 A7 B7· 五、發明説明（Μ 本發明所屬之技術領域： 本發明係有關於一種卡Ε搬出入機構，以及具有卡Ε 搬出入機構之半導體製造裝置。 習知技藝： 近年來，於半導體製造工程上所使用之晶圓，有從6 对或8叶改變為12叶之傾向。因之，半導體製造裝置亦隨 著對應12吋晶圓，而正開發其產品。如是之晶圓的大口徑 化，不僅增大晶圓之重量，並且，亦助長形成在晶圓之積 體電路的微細化。當積體電路之線寬成為次四分之一微米 以下之場合，在半導體製造工廠岣清淨室之清淨化技術， 及晶圓之自動搬送化技術之提昇，將更加重要。又，晶圓 的大口徑化’將使各種半導體裝置之占用空間增大。 欲處理半導體晶圓之場合，一般係收納多數之晶圓的 卡匿，被搬入卡匣收納室内，而晶圓在該卡匣收納室内， 乃從卡匣搬出。尤其’於處理8吋以下之晶圓的場合，卡 匣，例如，其晶圓搬出入口向著上方，並且以將晶圓保持 為垂直之橫向狀態，搬送至卡匣收納室，其後，乃使晶圓 搬出入口向著側方，並且，將晶圓設定為保持在水平的縱 向狀態’從晶圓搬出入口，以水平狀態將晶圓搬出。又， 對於在卡匣收納室之卡匣的搬送，即，由操作人員或 AGV(automated guided Vehicle)予以進行。相對地，欲處 理12吋之晶圓的場合，卡匣乃以縱向狀態被搬送至卡匣收 納室。因為’若將卡匣以橫向狀態，而將晶圓保持為垂直 之原狀予以搬送時’即，晶圓,之下端部由於晶圓之自重及 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4 - IJ------Ο裝 I '..V- (請先閱讀背面之注意寧項再填寫本頁) 訂 43246 3 〜^ A7 γ ^^ --___ Β7* 发、發明説明（2) 搬送時之振動等，將有所損傷之故。又，此場合，為感輕 隨著晶圓之重量增加而所受之操作（作業）人員之負擔，同 時，為防止因微粒所生之不良影響，因之，對於在卡匣收 納至之卡匣的搬送，乃以自動進行之。 又，欲處理8吋以下之晶圓的場合，收納卡匣之卡匣 收、’内至，乃5又疋為所定之真空度，而後，從卡匣取出晶圓 之同時，所取出之晶圓將經由負載儲存室，而以各工片被 搬送至所定之處理室β相對地，欲處理12吋之晶圓的場合 由於卡匣之容量較大，因之，欲將卡匣收納室設定為所 疋之真空度，乃需要較長之時間，並,由於抽真空時從 塑^製之卡匣會放出有機氣體（瓦斯）等之不絕氣體，而使 裝置内被污染。因此，對應12吋之晶圓的製造裝置，乃在 卡匣收納室與負載儲存室之間設有中繼室，而將從卡匣收 納室之卡匣所取出之晶圓，經由中繼室搬送至負載儲存室 ’並從該負載儲存室以各1片搬送至各處理室·»又，收納 有晶圓之卡匣，於目前，乃大別為經過晶圓搬出入口，保 持晶圓露出於外部之原狀之開放方式；以及，晶圓搬出口 由蓋子予收閉合之密閉方式。 經濟部中央標準局員工消费合作社印紫 (請先閱讀背面之注意事項再填寫本頁) 第8圖係表示對應12 »寸之晶圓的習知之半導體製造裝 置之前端構成。如圖所示，該半導體製造裝置（1)耳有； 可收納用以收納保持多數片（例如為13片或25片）晶圓的容 器（Ρ)之卡匣收納室；用以將容器（Ρ)相對於卡匣收納室， 予以搬出入之托盤（2);於卡匣收納室（7)内，用以將載置 在托盤（2)上之容器（Ρ)的蓴子’予收開閉之開口器Du Yinju A7 B7, Consumer Cooperation of Staff of the Central Bureau of Standards, Ministry of Economic Affairs V. Description of Invention (M The technical field to which the present invention pertains: The present invention relates to a card E moving in and out mechanism, and a semiconductor manufacturing device having a card E moving in and out mechanism . Know-how: In recent years, the wafers used in semiconductor manufacturing processes have tended to change from 6 pairs or 8 leaves to 12 leaves. Because of this, semiconductor manufacturing equipment has also become more suitable for 12-inch wafers. Develop its products. If the size of the wafer is increased, it will not only increase the weight of the wafer, but also promote the miniaturization of the integrated circuit formed on the wafer. When the line width of the integrated circuit becomes a quarter In the case of micrometers and below, the improvement of cleaning and purification technology in the semiconductor manufacturing plant's clean room and the automatic transfer technology of wafers will be even more important. In addition, the larger diameter of wafers will increase the space occupied by various semiconductor devices. When semiconductor wafers are to be processed, the cassettes containing a large number of wafers are generally carried into a cassette storage chamber, and the wafers are carried out from the cassette in the cassette storage chamber. In particular, when processing wafers smaller than 8 inches, the cassette, for example, its wafer loading and unloading entrance faces upward, and the wafer is transported to the cassette storage room with the wafer kept in a vertical and horizontal state. The wafer loading and unloading entrance faces sideways, and the wafers are set in a horizontal and vertical state, 'from the wafer loading and unloading entrance, and the wafers are unloaded horizontally. For the cassette transfer in the cassette storage room, That is, it is performed by an operator or AGV (automated guided vehicle). In contrast, when a 12-inch wafer is to be processed, the cassette is transported to the cassette storage room in a vertical state. Because 'if the cassette is horizontally When the wafer is transported while maintaining the vertical state, that is, the wafer, the lower end of the wafer is subject to the Chinese National Standard (CNS) A4 specification (210X297 mm) due to the weight of the wafer and the paper size -4-IJ ------ Ο 装 I '..V- (Please read the note on the back before filling in this page) Order 43246 3 ～ ^ A7 γ ^^ --___ Β7 * Issued, Invention Description (2) Transfer The vibration of the time will cause damage. Also, this occasion In order to reduce the burden on the operators (operating personnel) due to the increase in the weight of the wafer, and to prevent the adverse effects caused by the particles, therefore, for the transport of the cassettes stored in the cassettes, Automatically. In addition, if you want to process wafers under 8 inches, the cassette containing the cassette will be closed, and the inside will be 5 degrees, and then the vacuum degree will be set. Then, the wafer will be removed from the cassette at the same time. The removed wafer will be transferred to the predetermined processing chamber through the load storage room, and each piece will be transferred to the predetermined processing room. Β. For the 12-inch wafer, the capacity of the cassette is large. It takes a long time to set the cassette storage chamber to the vacuum degree, and because the plastic cassette will release endless gases such as organic gas (gas) during vacuuming, the inside of the device is Pollution. Therefore, a manufacturing device corresponding to a 12-inch wafer has a relay chamber between the cassette storage chamber and the load storage chamber, and the wafer taken out from the cassette in the cassette storage chamber is transferred to the The load storage room 'is transferred from the load storage room to each processing room by one piece each. »Also, the cassette containing the wafers is currently a large-scale case that passes through the wafer carry-out entrance and keeps the wafers exposed to the outside. The original open method; and the closed method in which the wafer transfer opening is closed by a cover. Yinzi, a consumer cooperative of employees of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). Figure 8 shows the front-end structure of a conventional semiconductor manufacturing device corresponding to a 12-inch wafer. As shown in the figure, the semiconductor manufacturing device (1) has ears; a cassette storage room for storing a container (P) for holding a plurality of wafers (for example, 13 or 25 wafers); (P) Relative to the cassette storage room, the tray (2) to be carried in and out; in the cassette storage room (7), the crickets of the container (P) placed on the tray (2) are received in advance. Opener
本紙張尺度適用中國國家標準（CNS ) Α4规格（2ί〇Χ297公釐） ：~5~IThis paper size is applicable to China National Standard (CNS) Α4 specification (2ί〇 × 297 mm): ~ 5 ~ I
2.4 6 3 A7 B7’ 經濟部中央標率局員工消費合作社印製 五'、發明説明（3) (opener)(3);以及瞵按配置在卡匣收納室（7)，並且，具有 從容器（P)内將晶圓集中多數片予以取出之搬送機構的中 繼室（4)。在中繼室（4)，經由間閥訂而連按未圖示之負载 儲存室。在裝置（1)之前面側，設有用以區隔裝置（1)侧與 清淨室（8)側之前板（5)。於前板（5)設有可開閉之門（6)。 以如是之構成’於從前板（5)向外側拉出之托盤（2)上 載置容器（P) ’並以該狀態，將托盤（2)押入卡匣收納室（7) 侧，藉此，容器（P)就經過開放之門（6)，而被搬送至卡g 收納室（7)内之容器（P)，將晶圓搬送至中繼室（4)内〇中繼 室（4)内之晶圓，乃經由負載儲存室，以各丨片搬送至未圖 示之處理室。 在對於卡匣收納室（7)，搬出入容器（p)時，於托盤（2) 從前板（5)向外側拉出之如是構成，乃需要拉出托盤（2)之 專用空間’而由於成份量’乃使半導體製造裝置之占用空 間增大。 又’由於利用托盤（2)只能以各1個搬出入容器（P)之故 ’晶圓之處理週期較短，乃使容器（p)之搬出入次數較多 ’而降低裝置本體之運用效率。 本發明之目的在於提供能削減占用空間，並能提高運 %效率之卡匣搬出入機構，以及半導體製造裝置。 本發明之目的，可利用如下之卡匣搬出入機構達成。 即’ S亥卡匣搬出入機構，係具有：形成可收納已收納多數 被處理體的卡匣之收納空間的殼體；形成在殼體，對卡匣 可搬出入被處理體之被處理體搬出入口；形成在殼體，對 本紙張尺反通用中國國家榇準（CNS ) A4規格（2丨0x 297公釐 (請先閱讀背面之注意事項再填寫本頁}2.4 6 3 A7 B7 'Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs '5', Invention Description (3) (opener) (3); and 瞵 is arranged in the cassette storage room (7), and has a slave container (P) The relay room (4) of the transfer mechanism that collects a large number of wafers from the wafer. In the relay room (4), a load storage room (not shown) is connected with a valve. On the front side of the device (1), a front panel (5) is provided to separate the device (1) side from the clean room (8) side. A front door (5) is provided with an openable and closable door (6). With this structure, 'place the container (P) on the tray (2) pulled out from the front plate (5)' and push the tray (2) into the cassette storage chamber (7) side in this state, thereby, The container (P) passes through the open door (6) and is transferred to the container (P) in the card storage room (7), and the wafer is transferred to the relay room (4) and the wafer in the relay room (4). The wafers are transported to the processing chamber (not shown) through the load storage chamber. As for the cassette storage room (7), when the tray (2) is pulled out from the front plate (5) when the tray (2) is carried out and into the container (p), it is necessary to pull out the special space for the tray (2). The component amount 'increases the occupied space of the semiconductor manufacturing device. Also, because the use of the tray (2) can only be carried in and out of the container (P) one by one, the wafer processing cycle is short, so that the container (p) can be carried in and out more times, and the use of the device body is reduced. effectiveness. An object of the present invention is to provide a cassette loading / unloading mechanism capable of reducing the occupied space and improving the efficiency, and a semiconductor manufacturing apparatus. The object of the present invention can be achieved by the cassette loading / unloading mechanism described below. In other words, the cassette loading and unloading mechanism includes a housing that forms a storage space that can house a cassette that has accommodated a large number of processed objects, and a processed object that is formed in the housing and can carry the cassette into and out of the processed object. Remove the entrance; it is formed in the case, and it is anti-universal Chinese national standard (CNS) A4 specification (2 丨 0x 297 mm) (Please read the precautions on the back before filling this page}
4 3 24 6 3 A7 B7 經潴部中央標準局負工消费合作社印架4 3 24 6 3 A7 B7 Printing stand of the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs
五、發明説明（4) , 被處理體搬出入口的開口方向，大約為直交之方向作為開 —口 ’同時，對前述收納空間而具有予以搬出入卡匣之卡匣 搬出入口的卡g收納室；設在卡£收納室内，具有載置卡 匣之载置面並且，至少在被處理體搬出入口，與卡匣搬 出入口之間’可移動的多數卡匣载置體；以及’在卡匣收 納室之側方位置，而與卡匣搬出入口配置成對向，並在與 卡匣載置體之間，將卡匣予以收給之卡匣收給機構。 又，本發明之目的，可利用如下之半導體製造裝置達 成，即，該半導體製造裝置，係具有：設有處理被處理體 上，所必要之多數室的裝置本體；配置磷按在裝置本體， 並且’形成可收納已收納多數被處理體的卡！之收納.空間 的威體，形成在殼體，對卡匣可搬出入被處理體之被處理 體搬出入口；形成在殼體，對被處理體搬出入口的開口方 向，大約為直交之方向作為開口，同時，對前述收納空間 具有卡IE予以搬出入之卡匡搬出入口的卡匿收納室；設 在裝置本體’通過被處理體搬出入口，將被處理體在裝置 本體’與卡匣收納室之間作收給之搬送機構；.設在卡匣收 納室内’具有用以載置卡匣之載置面，並且至少於被處理 體搬出入口’與卡匣搬出入口之間，可移動的多數卡臣載 置體；以及’在卡匣收納室之側方位置，而與卡匣搬出入 口配置成對向，並且在於卡匣載置體之間，將卡匣予以收 給之卡匣收給機構。 本發明之實施態樣： <第1實施例> 本紙张尺度適财酬“^: ( CNS ) A4祕（2iGX297公楚5""" "~I~~7I • I I II · ：-------^ )裝-- JL、 (請先閱請背面之注意事項再填寫本頁)V. Description of the invention (4), the opening direction of the processing object entrance and exit is approximately orthogonal to the opening-mouth. At the same time, the storage space has a card g storage room with a cassette entrance and exit opening for the cassette. ; Located in the card storage room, having a loading surface on which the cassette is placed, and at least between the entrance and exit of the object to be processed, and a 'movable majority of cassette placement body'; and The side position of the storage room is arranged opposite to the cassette loading and unloading entrance, and a cassette receiving mechanism for receiving the cassette between the cassette loading body and the cassette loading body. In addition, the object of the present invention can be achieved by a semiconductor manufacturing apparatus having a device main body provided with a plurality of chambers necessary for processing an object to be processed, and phosphors arranged on the device main body, And 'form a card that can accommodate most objects to be processed! The prestige body of the storage. Space is formed in the casing, and the entrance of the processed object that can be carried in and out of the cassette to the cassette is formed; the opening direction of the entrance of the processed object to the processed object is approximately orthogonal. At the same time, a card storage room with a card entrance for card IE to be carried in and out of the above storage space is provided; it is provided in the device body 'through the object to be processed out of the entrance, the processed object is in the device body' and the cassette storage room A transport mechanism for receiving and receiving; provided in the cassette storage chamber 'has a mounting surface on which the cassette is placed, and is at least between the entrance to the object to be processed' and the entrance to the cassette to be moved, Card holders; and 'at the side of the cassette storage room, opposite to the cassette loading and unloading entrances, and between the cassette holders, the cassettes are received. mechanism. Implementation aspects of the present invention: < First Embodiment > The paper scale is suitable for financial gain "^: (CNS) A4 Secret (2iGX297 Gongchu 5 " " " " ~ I ~~ 7I • II II · ： ------- ^) Pack-JL, (Please read the notes on the back before filling this page)
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經濟部中央摞準局舅工消費合作社印製 五、發明説明（5) 第1圖至第5圖係表示本發明之第i實施例。如在第1圖 至第3圖所示’本實施例之半導體製造裝置（1〇)，具有： 多數之處理室呈組群狀，配置在.移載室之周圍之裝置本體 (11);以及，配置在該裝置本體（11)之前面，而以卡匣單 將晶圓予以搬出入之卡匣搬出入機構（12)。以卡E搬出入 機構（12)所搬出入之卡匣（20)，例如為，12吋之晶圓，有 收納13月或25片，而由聚碳酸酯（1?〇15；(；_〇福&)' PEEK(Poly ether etherketone)等之合成樹脂所形成之密閉 式的容器’所構成。由於此’以下將就卡匣（2〇)作為容器 (20)予以說明之。又’在容器（2〇)内，例如，封入氮氣， 藉此，可極力防止晶圓的自然氧化之附著，同時，容器（2〇) 之空間亦能維持為清淨。 卡匣搬出入機構（12)，係具有•與裝置本體（11)之晶 圓的搬出入口對間配置，並且，將多數（例如為2個）之容 器（20)收納在上下方向的左右一對之卡昆收納機構（a); 以及’配置於各卡g收納機構（13)之間，並且，在與卡匿 收納機構之間，收給容器（20)之卡匣收於機構（14)，並依 照所定之程序予以驅動控制。各卡匣收機構3),係具有 :形成可收納已收納多數之晶圓的容器（2〇)，之收納空間 的殼體（51);形成在殼體（51)，且對向於裝置本體（11)的 晶圓之搬出入口，同時，對於容器（20)可搬出入晶圓之晶 圆搬出入口（50);以及形成在殼體（51)，且對晶圓搬出入 口（50)的開口方向，於大約呈直交之方向作為開口，同時 ，對前述收納空間，具有可搬出入容器（20)卡匣搬出入口 * 本紙張尺度逋用中國國家標準（CMS ) A4規格（210X29·?公釐} - 8 - I —J I n ΪΙ ^ I n I— ^ n n 1 加 (請'先閲讀背面之注意事項再填寫本頁) 4 λ 6 3 Α7 Β7’ 經濟部中央標準局I工消費合作社印製 五、發明説明（6) (52)的卡匣收納室（13A)。又，於卡匣搬出入口（52)，設有 於搬出入容器（20)時，予以開放之可開閉的門（13B)。 於卡匣收給機構（14)之上方，配設利用驅動控制部（6〇) 驅動控制之卡匣搬送裝置（15) ^該卡匣搬送裝置（15)，沿 著配置在清淨室之頂板的導執（丨6)，而移動於各種之半導 體製造裝置解的隔室區域，並將容器（20)直接收給予多數 之半導體製造裝置（10)的各卡匣收給機構（14)。因此，於 卡E搬送裝置（15)，乃設有經由鋼索等從頂板下降，同時 ’用以把持形成在容器（20)之本體（21)上面之被把持部（22) 之保持部（15A)。即’於本實施例，相對於卡匣收給機構（14) 之谷器（20)的搬送’完全藉由卡匣搬送裝置（丨5)予以進行 〇 如第4圖所示’在卡匣收納室（13 A)之深處，隔著間隔 配置中繼室（17)。於該中繼室（17)經由閘閥，連接觸器負 載儲存室（18)°在中繼室（17)内，配置多關節型之處理（操 作）手臂（未.圖示），藉由該操作手臂，多數片（例如為13片 或25片）晶圓集中被搬送於容器（2〇)與中繼室（π)之間，而 以水平保持在中繼室（17)内。在卡匣收納室（13A)與中繼 室（17)之間的前述間隙，配置利用驅動控制部（6〇)驅動控 制，並且，可開閉容器（20)之蓋子（23)的開口器（19)。如 第5圖所示，開口器（19)，在藉由操作手臂搬送晶圓時， 在相對於裝置本體（U)之晶圓搬出入位置，自動開閉容器 (20)之蓋子（23)。又，前述間隙乃由卡匣收納室（13 A)及外 部遮斷。在該間隙，通過過渡器，將經濟淨化之空氣等， 本紙張尺度適用中國國家榇準（CNS } Α4規格（210 X 297公釐） --Γ------!·.一裝------訂------知 (讀先閱讀背面之注意事項再填寫本頁) 3 3 經漪部中决標準局員工消費合作社印嚷 Α7 Β7' 五、發明説明（7) 以如第4圓所示之箭頭，以下降充向供給之β因此，利用 開口器（19) ’開放容器（20)之蓋子（23)之場合，亦能防止 微粒附著於晶圓，同時，前述間隙能經常維持於清淨狀態 β而在與開口器（19)相對向之中繼室（17)之面上，裝設有 閘閥（未圖示）。該閘閥，於搬出入晶圓之際，被開放，而 晶圓被搬入於中繼室（17)内之後，就閉合，使中繼室（j7) 内密閉《因此，以如是之構成，即，利用開口器（丨9)而使 容器（20)之蓋子（23)開放之給，晶圓乃藉由操作手臂，從 谷器（20)搬入至中繼室（17)内。然後，在該狀態下，晶圓 就以各1片之方式，從中繼室（17)取出，並經由負載儲存 室（19)被搬送至各種之處理室，同時，於各處理室内旋予 ，例如’刻蝕處理，成膜處理等。 如第3圖及第4圖所示，卡匣收納機構（丨3)，具有：例 如’配置在上下之2個卡匣載置體（13C)，以及用以將該等 卡匣載置體（13 C) ’ 一體性作昇降空制之驅動控制部（6〇) 。此場合，驅動控制部（60)，控制各卡匣載置體（13c), 使其正確地停止在晶圓搬出入位置。在各卡匣載置體（13C) 設有未圖示之卞匣定位機構，而該定位機構，乃將容器（2〇) 疋位在卡匣載載體（丨3C)上，而使開口器（19)可開閉蓋子（23) 。如是之定位機構，例如，由形成在卡匣載置體（13c)之 上面的多數之突起，與對應該等突起而形成在容器（2〇)之 底面的凹部所構成。或在卡匣载置體（13c)之上面形成凹 部’而容器（20)之底面形成突起亦可以β又，卡匣載置體 (13C)，構成為向著開口器（丨9)側可進退移動，而於利用 本紙張尺度適用中國國家標隼（CNS ) Α4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 、1Τ 4 3 24 〇 3 A7 B7 經瀦部中央標準局舅工消費合作社印製 五、發明説明（8) 驅動控制部（60)停止在晶圓搬出入位置之際，要成為在開 口器（19)侧進出。因此，卡匣收納機構（13)，能收納2個容 器（20)，同時’一方的容器（20)内之晶圓被處理時，能將 他方的容器（20)予以搬出入。因此，不必停止.半導體晶圓 導體製造裝置（10)，而能連續運轉β 卡匣收給機構（14)，乃在卡匣收納室（13 a)之側方位 置，與卡匣搬出入口（52)相對向配置。具體而言，卡匣收 給機構（14)，乃配置在裝置本體（11)之空位（死角）的左右 之卡匣收納室（13 A)之間。如第3圖所示，卡匣收給機構（14) ’具有：用以載置容器（20)之卡匣載置體（14A);以及， 使卡匣載置體（14A)對左右之卡匣收納室（13A)，進退動作 之驅動控制部（60) 6因此，利用驅動控制部（6〇)，使卡匣 載置體（14A)於左右之卡匣收納室（13A)内進出，藉此，容 器（20)乃收給於各卡匣載置體（13C)，與卡匣載置體（HA) 之間。又在卡匣載置體（14A)之上面’形成與卡匣收納 機構（13)之卡匣載置體（13C)，同樣之定位機構。又，卡 匣載置體（14A)’乃形成為於卡匣收納室（13A)内，當容器 (20)於卡匣載置體（13C)與卡匣載置體（14A)之間作收給之 際，不影響到卡匣載置體（13C)。因此，卡匣收給機構（14) ’對卡匣收納機構（13)使容器（20)圓滑收給。又，卡匣收 給機構（14) ’當接受由卡匣搬送裝置（15)所搬送來之容器 (20)之際，能自動定位在所定之位置。 其次說明動作。以下，如第3圖所示，於半導體製造 裝置（10)之左侧的卡匣收納室（13A)内，搬入容器（20)之場 本紙張尺度適用中國國家樣準（CNS.) A4規格（210X297公煃） -Π (請先閱讀背面之注意事項再填寫本頁)Printed by the Central Consumers 'Bureau of the Ministry of Economic Affairs and the Consumers' Cooperative. V. Description of the Invention (5) Figures 1 to 5 show the i-th embodiment of the present invention. As shown in FIG. 1 to FIG. 3, 'the semiconductor manufacturing device (10) of this embodiment has: most of the processing chambers are grouped, and the device body (11) is arranged around the transfer chamber; And a cassette loading and unloading mechanism (12) arranged on the front face of the device body (11) and loading and unloading wafers with cassette sheets. The cassette (20) carried in and out of the card E loading / unloading mechanism (12), for example, is a 12-inch wafer, which contains 13 or 25 wafers, and is made of polycarbonate (1? 015; (; _ 〇 福 &) 'closed container made of synthetic resin such as PEEK (Poly ether etherketone)'. Because of this, 'the cassette (20) will be described as the container (20) below.' In the container (20), for example, nitrogen gas is sealed, thereby preventing the natural oxidation of the wafer from being attached as much as possible, and at the same time, the space of the container (20) can be kept clean. Cassette carrying out mechanism (12) It is a Kakun storage mechanism (a) provided with a pair of wafer loading and unloading entrances of the device body (11), and a plurality of (for example, two) containers (20) stored in the up and down pair ); And 'arranged between each card storage mechanism (13), and between the card storage mechanism and the card storage mechanism, the cassette of the receiving container (20) is received in the mechanism (14), and given according to a predetermined procedure Drive control. Each cassette receiving mechanism 3) is provided with a container (20) for forming a large number of wafers, A housing (51) for the storage space; a wafer loading and unloading entrance formed in the housing (51) and facing the wafer of the device body (11), and a wafer loading and unloading inlet for the container (20) (50); and formed in the housing (51), and opening direction of the wafer carrying-out entrance (50) is approximately perpendicular to the opening direction, and at the same time, the storage space has a carrying-out container (20) Cassette carry-out entrance * This paper size adopts Chinese National Standard (CMS) A4 specification (210X29 ·? Mm)-8-I —JI n ΪΙ ^ I n I— ^ nn 1 plus (please 'read the notes on the back first Please fill in this page again for details) 4 λ 6 3 Α7 Β7 'Printed by the Central Standards Bureau of the Ministry of Economic Affairs, I Industrial Consumer Cooperative, V. Invention description (6) (52), the cassette storage room (13A). Also, at the cassette removal entrance (52) is provided with a door (13B) which can be opened and closed when carrying in and out of the container (20). Above the cassette receiving mechanism (14), a drive control unit (60) is provided for drive control Cassette conveying device (15) ^ The cassette conveying device (15) follows a guide (丨6), while moving in the compartment area of various semiconductor manufacturing devices, and directly receiving the container (20) to each cassette receiving mechanism (14) of the majority of semiconductor manufacturing devices (10). Therefore, the card E The conveying device (15) is provided with a holding portion (15A) for lowering from the top plate via a cable or the like, and 'for holding the grasped portion (22) formed on the main body (21) of the container (20). In this embodiment, the conveyance of the trough device (20) of the cassette receiving mechanism (14) is performed completely by the cassette conveying device (5). As shown in FIG. 4, 'in the cassette storage room ( 13 A), the relay room (17) is arranged at intervals. A relay valve (17) is connected to the contactor load storage chamber (18) through a gate valve. In the relay chamber (17), a multi-joint processing (operation) arm (not shown) is provided. Most wafers (for example, 13 or 25 wafers) are collectively transferred between the container (20) and the relay chamber (π), and are held horizontally in the relay chamber (17). An opener (19) capable of opening and closing a lid (23) of the container (20) is disposed in the aforementioned gap between the cassette storage chamber (13A) and the relay chamber (17), and is controlled by a drive control unit (60). ). As shown in Fig. 5, the opening device (19) automatically opens and closes the lid (23) of the container (20) at the wafer loading / unloading position with respect to the apparatus body (U) when the wafer is transferred by the operation arm. The gap is blocked by the cassette storage chamber (13 A) and the outside. In this gap, through the transition device, economically purified air, etc., this paper size applies to China's national standard (CNS} Α4 specification (210 X 297 mm) --Γ ------! ·. ----- Order ------ Know (Read the precautions on the back before you fill out this page) 3 3 Sealed by the Consumers 'Cooperatives of the Bureau of Criteria and Standards of the Ministry of Economic Affairs 嚷 Α7 Β7' V. Description of the Invention (7) With the arrow shown in the fourth circle, the β to be supplied to the battery is lowered. Therefore, when the lid (23) of the container (20) is opened using the opener (19), particles can be prevented from adhering to the wafer, and The gap can be maintained in a clean state β, and a gate valve (not shown) is installed on the surface of the relay chamber (17) opposite to the opener (19). This gate valve is used for loading and unloading wafers. After being opened and the wafer is moved into the relay chamber (17), it is closed to close the inside of the relay chamber (j7). Therefore, it is constituted as such, that is, the container (20) is opened by using an opener (丨 9). ), The lid (23) is opened, and the wafer is moved from the trough (20) into the relay chamber (17) by the operating arm. Then, in this state, The wafers are taken out from the relay chamber (17) one by one and transferred to various processing chambers through the load storage chamber (19). At the same time, the wafers are rotated in each processing chamber, for example, 'etching process, and forming a film. Processing, etc. As shown in Figs. 3 and 4, the cassette storage mechanism (丨 3) includes, for example, two cassette mounting bodies (13C) arranged above and below, and the cassettes Mounting body (13 C) 'is an integral drive control unit (60) for lifting and lowering. In this case, the drive control unit (60) controls each cassette mounting body (13c) to stop at the correct position. The wafer is carried in and out. Each cassette mounting body (13C) is provided with a cassette positioning mechanism (not shown), and the positioning mechanism positions the container (20) on the cassette carrier (丨 3C). So that the opening (19) can open and close the lid (23). If it is a positioning mechanism, for example, a plurality of protrusions formed on the cassette mounting body (13c) and corresponding protrusions are formed in the container. (20) is formed by a concave portion on the bottom surface. Or, a concave portion is formed on the upper surface of the cassette mounting body (13c), and the bottom surface of the container (20) is shaped The protrusion can also be β, and the cassette mounting body (13C) is configured to move forward and backward toward the opening (丨 9) side, and the Chinese national standard (CNS) Α4 specification (210 X 297) is used for this paper size (Mm) (Please read the precautions on the back before filling this page), 1T 4 3 24 〇3 A7 B7 Printed by the Ministry of Standards and Technology, Central Laboratories and Consumer Cooperatives V. Description of Invention (8) Drive Control Department (60) When stopping at the wafer loading / unloading position, it is necessary to move in and out on the side of the opener (19). Therefore, the cassette storage mechanism (13) can store two containers (20), and at the same time, one of the containers (20) When the wafer is processed, other containers (20) can be carried in and out. Therefore, there is no need to stop the semiconductor wafer conductor manufacturing device (10), and the β cassette receiving mechanism (14) can be continuously operated, which is at the side of the cassette storage chamber (13a) and the cassette carrying inlet ( 52) Relative configuration. Specifically, the cassette receiving mechanism (14) is arranged between the left and right cassette storage chambers (13 A) of the empty space (dead corner) of the apparatus body (11). As shown in FIG. 3, the cassette receiving mechanism (14) has: a cassette mounting body (14A) for mounting the container (20); and a cassette mounting body (14A) facing the left and right sides. The cassette storage room (13A), the drive control section (60) 6 for the forward and backward movements, therefore, the drive control section (60) is used to make the cassette mounting body (14A) enter and exit the left and right cassette storage rooms (13A). Thus, the container (20) is received between each cassette mounting body (13C) and the cassette mounting body (HA). On the top of the cassette mounting body (14A), a positioning mechanism similar to the cassette mounting body (13C) of the cassette storage mechanism (13) is formed. In addition, the cassette mounting body (14A) 'is formed in the cassette storage room (13A), and when the container (20) is operated between the cassette mounting body (13C) and the cassette mounting body (14A) When receiving, it does not affect the cassette carrier (13C). Therefore, the cassette receiving mechanism (14) 'smoothly feeds the container (20) to the cassette receiving mechanism (13). The cassette receiving mechanism (14) 'can automatically position itself at a predetermined position when receiving the container (20) transferred by the cassette transfer device (15). The operation will be described next. In the following, as shown in Figure 3, in the cassette storage room (13A) on the left side of the semiconductor manufacturing device (10), the field into which the container (20) is carried. This paper size applies to the Chinese National Standard (CNS.) A4 specification. (210X297) Π (Please read the notes on the back before filling this page)
五、發明説明（9) 經滴部中央標準局負工消費合作社印策 合作說明。此場合’為喚起應將容器（2〇)搬入卡匿收納室 ()之訊心，控制盤上之顯示燈（均未圖示）就點燈（燈亮） °藉此’操作人員護知為可搬人之狀態，而操作輕搬入 動作用之按鈕（未圖示）β藉由該操作，卡匣搬送裝置（15) ，在利用該保持部（15Α)保持容器（2〇)之狀態下，沿著導 軌（16)移動。當卡匣搬送裝置（15)在半導體製造裝置（⑼ 之卡匣收給機構（14)的正上方停止時，保持部（15Α)就下 降’並將容器（20)載置於卡匣載置體（14Α)上。此時容器（20) 藉著定位機構，正確定位在卡匣載置體（14Α)上之所定位 置。與其同時，驅動控制部（6〇) ’驅動卡匣載置體（13C) ，使卡匣載置體（13C)昇降至容器接受位置，並作待機。 其次，開啟卡匣收納室（13A)之門（13B)，卡匣收給機 構（14)之卡匣載置體（14A)，乃利用驅動控制部（6〇)驅動， 而通過卡匣搬出入口（52) ’進出卡匣收納室（13A)内，同 時，停止於容器交換位置。然後，卡匣载置體（13C)，如 穿過卡匣載置（14A)般作上昇，而將容器（2〇)定位於所定 位置β與其同時，卡匣載置體（14A)後退，而回復至卡g 收給機（14)之初期位置。欲將其次之容器搬入至卡£ 收納室（13A)内之場合，乃反覆前述之動作。又，將2個容 器（20)連績搬入至卡匣收納室（13A)内之場合，可在控制 盤上指定其訊息。當然，對於他方之卡匣收納機構（1 3)， 亦可以同一要領搬入容器（20)。 如是，將容器（20)搬入半導體製造裝置（10)内時，晶 圓之處理就開始。即，驅動卡匣收納機構（13)，而任一方 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2彳0'乂297公釐j -—12 - ' (請先閲讀背面之注意事項再填寫本頁)V. Description of the invention (9) Instruction of cooperation by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. In this case, 'to arouse the sense that the container (20) should be carried into the card storage room (), the display lights (none of which are shown) on the control panel are turned on (lights on). Can move people, and operate the button (not shown) for light loading operation β. With this operation, the cassette transfer device (15) holds the container (20) by the holding unit (15A). And move along the guide rail (16). When the cassette conveying device (15) stops immediately above the semiconductor manufacturing device (i.e., the cassette receiving mechanism (14), the holding portion (15A) is lowered) and the container (20) is placed on the cassette placement On the body (14Α). At this time, the container (20) is correctly positioned at the predetermined position on the cassette mounting body (14A) by the positioning mechanism. At the same time, the drive control section (60) 'drives the cassette mounting body (13C), raise and lower the cassette mounting body (13C) to the container receiving position, and wait. Second, open the door (13B) of the cassette storage chamber (13A), and the cassette of the cassette receiving mechanism (14) The mounting body (14A) is driven by the drive control unit (60), and enters and exits the cassette storage chamber (13A) through the cassette carrying-out entrance (52), and stops at the container exchange position. Then, the cassette The mounting body (13C) rises as if passing through the cassette mounting (14A), and the container (20) is positioned at a predetermined position β. At the same time, the cassette mounting body (14A) moves back and returns to the card g The initial position of the feeder (14). If you want to move the next container to the card £ storage room (13A), repeat the foregoing When two containers (20) are moved into the cassette storage room (13A) in succession, the message can be specified on the control panel. Of course, for other cassette storage mechanisms (1 3), It can be moved into the container (20) in the same way. If so, when the container (20) is moved into the semiconductor manufacturing apparatus (10), the wafer processing starts. That is, the cassette storage mechanism (13) is driven, and any one of the paper sizes Applicable to China National Standard (CNS) Λ4 specification (2 彳 0 '乂 297mm j -—12-' (Please read the precautions on the back before filling this page)
、1T 4 3 2d B 3 A7 ----- B7'_ 五、發明説明（10) .~~ ~~ 經濟部中央標準局員工消費合作社印製 之卡匣载置體（13C)即昇降至晶圓搬出入位置而停止。其 一人，驅動開口器（19)，使容器（20)之蓋子（23)開啟，同時 ，驅動中繼室（17)之操作手臂’容器（20)内之晶圓就集中 所疋片數，通過晶圓搬出入口（5〇)被搬入至中繼室（1乃内 。其後，再度驅動，開口器（19)，利用蓋子（23)閉合容器（20) β當晶圓搬入中繼室（17)内時，晶圓就以每次j片之方式 -里由負載倚存室（18)，而搬送至各處理室内’並在各個處 理室施予所定之處理。於各處理室内完成所定之處理時， 經過處理之晶圓，就送個至中繼室（17)内，同時，利用操 作手臂送回至容器（20)内。然後，其次之容器（20)就移動 至晶圓搬出入位置，同時，該容器（2〇)内之晶圓就被搬入 至中繼室（17)内，而作同樣之處理。其間，載置收納經處 理之晶圓之容器（2〇)的卡匣載置體（uc)，利用驅動控制 部（60) ’昇降至卡匣收拾位置並停止。位於卡匣收給位置 之容器（20)，乃經過與前述之動作相反之動作，利用卡匣 收給機構（14)之卡匣載置體（14A)，從卡匣收納室（i3A)被 搬出’同時，利用卡匣搬送裝置（15)搬送至所定之部位。 其後’利用卡匣搬送裝置（15)，將別的容器（20)搬送至卡 匣收給機構（14)之正上方，同時，將交給卡匣收給機構（14) 之卡匣載置體（14A)上。 藉由如之動作反覆進行’使容器（20)以續續性搬出入 於半導體製造裝置（10)，而可連續進行晶圓之處理β如上 述說明，依據本實施例’在卡S收納室（13Α)之侧面（2個 卡式收納室（13Α)之間），設有，卡匣收給機（14)，故可有效 13 本紙張尺度適用中國國家榇準（CNS ) Α4规格（210 X 297公釐） 經消部中央標準局負工消費合作社印製 4 3 24 ^3 A7 __ ._____ B7 ·____ 五、發明説明（n) 活用半導體製造裝置（1〇)之空位（死角）。因此，不必如習 知’在裝置之前面（卡匣收納室之前面）設置卡匣收給用之 專用空間，僅就此部份就能削減半導體製造裝置（1 〇)之占 用空間。又’依據本實施例，在卡匣收納機構（13)内，能 收給2個容器（20)，同時，對卡匣收納機構（13)‘可連續搬出 入容器（20) ’而可連續處理收納在容器（2〇)内之晶圓。因 此’於搬出入容器（20)時，亦能連續運轉半導體製造裝置 (10) ’因此’每次搬出入容器（2〇)時，不必停止半導體製 造裝置（10)，乃能將其運轉效率格外提高。 <第2實施例> 第6圖顯示本發明第2實施例。如圖示，有關本實施例 之半導體製造裝置（30) ’具有：裝置本體（3υ ;以及配置 在裝置本體（31)之前面的卡匣搬出入機構（32) β裝置本體 (31)具有：設有晶圓之搬出入口之中繼室（37);經由閘閥 而連續在中繼室（37)之負載儲存室（38);以及，隔著移載 至而連結在負載儲存室（38)，並且，配置成組群狀之多數 的處理室。於中繼室（37)内’配設與第1實施例相同之多 關節型操作手臂（37Α)。於晶圓處理中，藉由該操作手臂 (37Α)保持多數片之晶圓。又，在本實施例中，晶圓之搬 出入口，並非形成在中繼室（37)之正面側，而係形成於側 面侧。又，圖中之（37Β)為閘閥。 如第6圖所示，卡匣搬出入機構（32)，具有：卡匣收 納機構（33);及，卡匣收給機構（34) β卡匣收納機構（33) ，係以第1實施態稱為基準而辑成之，並配置成與裝置本 本紙張尺度適用中國國家榇準（CNS ) Α4現格（210X297公赛） (恭先閱讀背面之注意事項再填寫本頁) 一裝· 訂 經濟部中央梯準局員工消費合作社印製 4 3 2^63 A7 •·~~·____________B7 ' 五、發明説明（4 — 體（31)之中繼室（37)的晶圓搬出入口（50)相對向。另方向 ’卡E收給機構（34)，即，與第1實施例相異，成為旋轉 方式。即，卡匣收給機構（34)，具有；在開口器（19)之稍 為外侧，並且，接近於前板（F)之内侧，立設之可旋轉之 軸（34A);及’於其羞端之隅角部連結在軸（34A)，並且， 於水平方向延設之卡匣载置體（34B)。軸（34A)如圖中箭頭 所示’利用驅動控制部（60)，例如，作正逆旋轉9〇。。又 ’卡匣載置艘（34B) ’當其到達卡匣收納室（13 A)内之容器 (20)的收給位置之狀態下，縱使卡i收納機構（33)之卡g 载置體（13C)昇降之場合，亦不影響到卡匣載置體（13C)， 乃將其形成梳子狀。而其他之構成，乃以第丨實施例為基 準而構成之。 如是’於本實施例，晶圓搬出入口（5〇)，係設在欲收 給晶圓之中繼室（37)的侧方，同時，與晶圓搬出入口（5〇) 相對向’配置卡E搬出入機構（3 2)，而可有效活用半導體 製造裝置（3 0)則面側方（中繼室之側方）之空位。因此，只 不過是在第1實施例之卡匣搬出入機構所占有之空間，有 卡匣收給機構（34)之卡匣載置體（34B)占有，是故，亦僅 需要於第1實施例之卡匣搬出入機構的占有空間，因之， 與習知相比較，與第1實施例同稱，能削減占有空間。又 ，依據本第2實施例，與第1實施例同稱，故，能提高半導 體晶圓導體製造裝置（30)之運用效率。 <第3實施例> : 第7圖表示本發明之第3實施例。如圖所示，於本第3 本紙張尺度適用中國國家標举（CNS ) A4規格（210 X 297公费） (请先閱讀背面之注意事項再填寫本頁) 裝_ 、tr 經濟部中央標隼局貝工消費合作杜印架 A7 B7’ 五、發明説明（13) 實施例之半導體製造裝置（40)中，中繼室（37)藉由閘閥（37B) 分割成第1及第2之中繼室（37C，37D)兩部份。在第1中繼 (37C)内’配設多關節型之操作手臂（37A)，而在第2中繼 室（37D)，配設用以將多數之晶圓予以集中，而保持在上 下之晶圓保持機構（47)。其以外之構成，即，依據第6圖 所示之半導體晶圓導體製造裝置（30)構成之β因此，於本 第3實施例’亦能發揮與在第6圖所示之半導體製造置（3〇) 同稱之作用效果。 在第6圖及第7圖之實施例中，亦可將卡匣收納機構（33) ，與卡匣收給機構（34)構成為一體。即’轴（34Α)構成為 不能旋轉，而可昇降，同時，排除卡匣載置體（34Β)，而 將2個卡匣載置體（13C) ’可旋轉地安裝於軸（34Α)上下位 置。此塲合，2個卡匣載置體（i3c)，利用驅動控制部（6〇) 個別予以旋轉，同時，隨著軸（34Α)之昇降（由驅動控制部 (60)所控制）以一體方式昇降，並移動於晶圓搬出入口（5〇) 與卡Ε搬出入口（52)之間。於如是之構成，在卡匣搬送裝 置（15)(參照第3圖）與裝置（3〇，40)之間，於收給容器（20) 之際，任一方之卡匣載置體（13C)旋轉，並通過卡匣搬出 入口（52) ’而占有在前板（？）之外側，於從容器（2〇)搬出入 晶圓之際’ 2個卡匣載置體（I3C)—齊被昇降，而使任一方 之卡匣載置體（13C)對向於中繼室（37)之晶圓搬出入口（5〇) 。因此’卡匣搬出入機構可成為輕巧，且能以低成本製造 卡匣搬出入機構。 在前述之各實施例，容琴（2〇)藉由卡匣搬送裝置（15) 本紙張尺度適财國國家標率（CNS.) Λ4規格（210X2^7公兹） 16 (請先閱讀背面之注意事項再填寫本頁) -訂 --k' 4 3 2,4 - A7 B7 ' 五、 發明説明（I4) 經濟部中央標率局員工消費合作社印製 ’而直接觸H收給予卡g收給機構。但是，卡&搬送裝置 (I5)，亦可僅使用於以各半㈣製造置群所構成之隔室間 ，予以搬送容器（20)。即，在各隔室區域，亦可由AGV或 操作人員，將容器（20)收給予各卡匣收給機構。又，在前 述之各實施例’使用密閉式卡匣之容器，搬送晶圓，惟， 亦可利用開放式卡匣搬送晶圓。 圖式之簡單說明： 第1圖係表示具體本發明第〖實施例之卡匣搬出入機構 的半導體製造裝置之前端的透視圖。 第2圖係表示第1圖之半導體製造裝置的卡匣搬出入機 構的要部之平面圖。 第3圖係表示第2圊之卡匣搬出入機構的正面圖。 第4圖係表示第丨圖之半導體製造裝置的前端之側視圖 〇 第5圖係表示利用開口器開放鍋盆之蓋子之狀態的透 視圖。 第6圖係表示本發明第2實施例半導體製造裝置的前端 之平面圖。 第7圖係表示本發明第3實施例之半導體製造裝置的前 端之平面圖。 第8圖係表示習知之半導體製造裝置的前端之平面圖 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 17 (請'先閱碘背面之注意事項再填寫本頁)、 1T 4 3 2d B 3 A7 ----- B7'_ V. Description of the invention (10). ~~ ~~ The cassette mounting body (13C) printed by the staff consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs is lifted to The wafer is moved in and out and stopped. One of them drives the opener (19) to open the lid (23) of the container (20), and at the same time drives the operation arm of the relay chamber (17). The wafers in the container (20) concentrate the number of wafers, and pass The wafer loading and unloading entrance (50) is moved into the relay room (1). After that, it is driven again, the opener (19), and the container (20) is closed with the lid (23). Β When the wafer is moved into the relay room (17) When the wafers are inside, the wafers are transported to the processing chambers in the form of j wafers each time-and are processed in each processing chamber. The predetermined processing is completed in each processing chamber. At this time, the processed wafers are sent to the relay room (17), and at the same time, they are returned to the container (20) by the operating arm. Then, the next container (20) is moved to the wafer loading and unloading position. At the same time, the wafers in the container (20) are moved into the relay room (17), and the same processing is performed. Meanwhile, the cassette on which the container (20) containing the processed wafers is placed is placed. Body (uc), use the drive control unit (60) 'to lift and stop at the cassette collecting position. It is located at the cassette receiving position The container (20) that is placed is moved out of the cassette storage chamber (i3A) by using the cassette mounting body (14A) of the cassette receiving mechanism (14) through the operation opposite to the aforementioned operation. The cassette conveying device (15) is moved to a predetermined position. Then, using the cassette conveying device (15), another container (20) is conveyed directly above the cassette receiving mechanism (14), and at the same time, the Carry the cassette receiving mechanism (14) on the cassette mounting body (14A). By repeating this operation, the container (20) can be continuously moved into and out of the semiconductor manufacturing device (10), and can be continuously used. Carrying out wafer processing β As described above, according to the present embodiment, “on the side of the card S storage room (13A) (between two card storage rooms (13A)), a cassette feeder (14) is provided. 13 paper sizes are applicable to China National Standards (CNS) A4 specifications (210 X 297 mm). Printed by the Consumers ’Cooperative of the Central Standards Bureau of the Ministry of Consumer Affairs 4 3 24 ^ 3 A7 __ ._____ B7 · ____ 5 2. Description of the invention (n) Make use of the space (dead corner) of the semiconductor manufacturing device (10). The front surface (front surface of the cassette storage room) is provided with a dedicated space for receiving the cassette, and the space occupied by the semiconductor manufacturing device (10) can be reduced only in this part. Also, according to this embodiment, the cassette is stored in the cassette. In the mechanism (13), two containers (20) can be received. At the same time, the cassette storage mechanism (13) can be continuously carried in and out of the container (20), and the crystals stored in the container (20) can be continuously processed. Therefore, the semiconductor manufacturing apparatus (10) can be continuously operated when the container (20) is moved in and out. "Therefore, the semiconductor manufacturing apparatus (10) does not need to be stopped each time the container is moved into or out of the container (20). Operational efficiency has been greatly improved. < Second Embodiment > Fig. 6 shows a second embodiment of the present invention. As shown in the figure, the semiconductor manufacturing device (30) according to this embodiment has: a device body (3υ); and a cassette carrying-in / out mechanism (32) arranged in front of the device body (31). The β device body (31) has: A relay room (37) provided with a wafer carry-out entrance; a load storage room (38) continuously connected to the relay room (37) through a gate valve; and connected to the load storage room (38) via transfer to, and In the relay chamber (37), the same multi-joint type operation arm (37A) as in the first embodiment is provided. In the wafer processing, the operation arm (37A) 37A) Holds a large number of wafers. In this embodiment, the wafer loading and unloading entrances are not formed on the front side of the relay chamber (37), but are formed on the side. (37B) It is a gate valve. As shown in Fig. 6, the cassette loading and unloading mechanism (32) includes: a cassette storage mechanism (33); and, a cassette receiving mechanism (34) and a beta cassette storage mechanism (33). The first embodiment is called a reference and is compiled, and is arranged to fit the Chinese standard of the paper size of the device. Standard (CNS) Α4 is now available (210X297 race) (Please read the precautions on the back before filling out this page) One pack · Order printed by the Central Consumers ’Cooperative Bureau of the Ministry of Economic Affairs printed by the Consumer Cooperatives 4 3 2 ^ 63 A7 • · ~~ · ____________ B7 'V. Description of the invention (4 — The wafer entrance / exit (50) of the relay room (37) of the body (31) is opposite. The other direction is the' card E receiving mechanism (34) ', that is, the first embodiment Different, it becomes the rotation mode. That is, the cassette take-up mechanism (34) has: a slightly rotatable shaft (on the outside of the opening (19) and close to the inside of the front plate (F)) 34A); and 'the corner of the shame end is connected to the shaft (34A), and the cassette mounting body (34B) is extended in the horizontal direction. The shaft (34A) is shown by the arrow in the figure' The control unit (60), for example, rotates forward and reverse by 90. And the state of the 'cart loading vessel (34B)' when it reaches the receiving position of the container (20) in the cassette storage chamber (13 A) Next, even when the card g mounting body (13C) of the card i storage mechanism (33) is raised and lowered, it does not affect the cassette mounting body (13C), but it is formed into a comb shape. His structure is based on the first embodiment. If it is' in this embodiment, the wafer carry-out entrance (50) is located at the side of the relay room (37) to be received by the wafer, At the same time, with the wafer loading / unloading entrance (50), the configuration card E loading / unloading mechanism (32) is used, and the semiconductor manufacturing equipment (30) can be effectively utilized, and the space is lateral (side of the relay room). Therefore, it is only in the space occupied by the cassette loading and unloading mechanism of the first embodiment, and is occupied by the cassette mounting body (34B) of the cassette receiving mechanism (34). The space occupied by the cassette loading and unloading mechanism of the embodiment is the same as that of the first embodiment, and the space occupied can be reduced as compared with the prior art. In addition, according to the second embodiment, which is the same as the first embodiment, the operating efficiency of the semiconductor wafer conductor manufacturing apparatus (30) can be improved. < Third embodiment >: Fig. 7 shows a third embodiment of the present invention. As shown in the figure, the third paper size of this paper applies the Chinese National Standards (CNS) A4 specification (210 X 297 public expense) (please read the precautions on the back before filling this page). _ 、 Tr Bureau Shell ’s consumer cooperation Du Yinjia A7 B7 'V. Description of the invention (13) In the semiconductor manufacturing device (40) of the embodiment, the relay room (37) is divided into the first and second relay rooms by the gate valve (37B). (37C, 37D) two parts. In the first relay (37C), a multi-joint type operation arm (37A) is provided, and in the second relay room (37D), a large number of wafers are concentrated to maintain the upper and lower crystals. Circle retaining mechanism (47). The other structure, that is, β according to the structure of the semiconductor wafer conductor manufacturing apparatus (30) shown in FIG. 6, therefore, in the third embodiment, the semiconductor manufacturing equipment shown in FIG. 6 can also be used ( 3) The effect of the same name. In the embodiments of FIGS. 6 and 7, the cassette storage mechanism (33) and the cassette receiving mechanism (34) may also be integrated. That is, 'the shaft (34A) is configured to be non-rotatable and can be raised and lowered, and at the same time, the two cassette holders (13C) are rotatably mounted on the shaft (34Α), excluding the cassette holder (34B). position. In this combination, the two cassette mounting bodies (i3c) are individually rotated by the drive control section (60), and at the same time, the shaft (34A) is lifted and lowered (controlled by the drive control section (60)) to be integrated into one. The method moves up and down, and moves between the wafer carrying-out entrance (50) and the card carrying-out entrance (52). In such a configuration, between the cassette conveying device (15) (refer to FIG. 3) and the device (30, 40), when receiving the container (20), either of the cassette placing bodies (13C) ) Rotate and occupy the outside of the front plate (?) Through the cassette loading and unloading entrance (52), and when loading and unloading the wafer from the container (20), 2 cassette mounting bodies (I3C)-Qi It is raised and lowered, so that the cassette mounting body (13C) of either side faces the wafer carrying-out entrance (50) facing the relay room (37). Therefore, the cassette loading and unloading mechanism can be made lightweight and can be manufactured at a low cost. In each of the foregoing embodiments, Rong Qin (20) uses a cassette conveying device (15). The paper size is suitable for the national standard of the country (CNS.) Λ4 specification (210X2 ^ 7 km) 16 (Please read the back first Please note this page and fill in this page again)-Order --k '4 3 2,4-A7 B7' V. Description of the invention (I4) Printed by the Consumers 'Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs' and directly contact H to give the card g To institutions. However, the card & transfer device (I5) can also be used only for the compartments formed by manufacturing units in each half, and the container (20) can be transferred. That is, in each compartment area, the container (20) can also be delivered to each cassette receiving mechanism by the AGV or the operator. In the foregoing embodiments, wafers are transferred using a container with a closed cassette. However, wafers can also be transferred using an open cassette. Brief description of the drawings: Fig. 1 is a perspective view showing a front end of a semiconductor manufacturing apparatus for a cassette carrying-in / out mechanism according to the embodiment of the present invention. Fig. 2 is a plan view showing a main part of the cassette loading / unloading mechanism of the semiconductor manufacturing apparatus of Fig. 1; Fig. 3 is a front view showing the cassette loading and unloading mechanism of the second frame. Fig. 4 is a side view showing the front end of the semiconductor manufacturing apparatus shown in Fig. 丨. Fig. 5 is a perspective view showing a state where the lid of the pot is opened with an opener. Fig. 6 is a plan view showing a front end of a semiconductor manufacturing apparatus according to a second embodiment of the present invention. Fig. 7 is a plan view showing a front end of a semiconductor manufacturing apparatus according to a third embodiment of the present invention. Figure 8 is a plan view showing the front end of a conventional semiconductor manufacturing device. The paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm). 17 (Please 'read the precautions on the back of iodine before filling out this page)
五、 發明説明（15) Α7 Β7 元件標號對照表 經濟部中央標準局员工消費合作社印製 1.. ·.半導體製造裝置 2….托盤 3.. ..開口器 4.. ..中繼室 5.. ..前板 6….門 7.. ..卡匣收納室 8.. ..清淨室 9.. ..容器 F....前板 10,30,40··..半導體製造裝置 11，31.…裝置本體 12.32.. ..卡匣搬出入機構 13.33.. .·卡匣收納機構 13Α....卡匣收納室 13Β....Η 13C，14A，34B.·.·卡 g 載置體 14,34··..卡匣收給機構 15.…卡匣搬送機構 15A..· _保持部 16…·導軌 17.37.. ..中繼室 18,38·.. _負載儲存室 19….開口器 20_…容器（卡匣） 21. …容器本體 22. …被把持部 23_…蓋子（容器） 3 4A…轴 37 A.…多關節型操作手臂 閘閥 37C.·.·第1中繼室 37D·...第2中繼室 47…·晶圓保持機構 50.. ..晶圓搬出入口 51____殼體 52.. ..卡匣搬出入口 60.. ..驅動控制部 (諫先閲讀背面之注f項再填寫本f jV. Description of the invention (15) Α7 Β7 Component label comparison table Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 1 ... Semiconductor manufacturing equipment 2. Tray 3. Opener 4 .. Relay room 5. .. .. Front plate 6…. Door 7 .... Cassette storage room 8 ... Clean room 9 ... Container F .... Front plate 10, 30, 40 ... Semiconductor manufacturing Device 11, 31 ... Device body 12.32 ...... Cassette carrying-out mechanism 13.33 ... Cassette storage mechanism 13A ... Cassette storage room 13B ... Η 13C, 14A, 34B ... · Card g mounts 14,34 ···· Cartridge receiving mechanism 15 ... · Cartridge transfer mechanism 15A .. · _Holding section 16 ... · Guide 17.37 ... · Relay room 18,38 · .._ Load storage chamber 19… .opener 20_… container (cartridge) 21.… container body 22.… held part 23_… cover (container) 3 4A… shaft 37 A.… multi-joint type operating arm gate valve 37C ... · 1st relay room 37D · ... 2nd relay room 47… · Wafer holding mechanism 50 ... wafer loading / unloading entrance 51____ Housing 52 ... Cartridge loading / unloading entrance 60 ... Drive control (Please read the note f on the back before filling in this fj
本紙乐尺度適用中國國家楯举（CMS ) Λ4規格（210X 297公釐） 18This paper scale is applicable to the Chinese National Examination (CMS) Λ4 specification (210X 297 mm) 18
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9078914A JPH10256346A (en) | 1997-03-13 | 1997-03-13 | Cassette transferring mechanism and semiconductor manufacturing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW432463B true TW432463B (en) | 2001-05-01 |
Family
ID=13675123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087103564A TW432463B (en) | 1997-03-13 | 1998-03-11 | A cassette loading/unloading mechanism and a semiconductor manufacturing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH10256346A (en) |
| KR (1) | KR19980080191A (en) |
| TW (1) | TW432463B (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100646906B1 (en) | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and substrate processing method |
| JP4260298B2 (en) | 1999-07-27 | 2009-04-30 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor parts |
| JP4505924B2 (en) * | 2000-02-07 | 2010-07-21 | 株式会社安川電機 | Semiconductor manufacturing equipment |
| US6506009B1 (en) * | 2000-03-16 | 2003-01-14 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
| US6641350B2 (en) * | 2000-04-17 | 2003-11-04 | Hitachi Kokusai Electric Inc. | Dual loading port semiconductor processing equipment |
| US6364593B1 (en) * | 2000-06-06 | 2002-04-02 | Brooks Automation | Material transport system |
| KR100788068B1 (en) * | 2000-08-23 | 2007-12-21 | 동경 엘렉트론 주식회사 | A processing system for an object to be processed |
| JP4838293B2 (en) * | 2000-09-27 | 2011-12-14 | 株式会社日立国際電気 | Substrate processing method, semiconductor device manufacturing method, and substrate processing apparatus |
| JP2002246432A (en) * | 2001-02-13 | 2002-08-30 | Hitachi Kokusai Electric Inc | Substrate processor |
| US7258520B2 (en) | 2002-08-31 | 2007-08-21 | Applied Materials, Inc. | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing |
| WO2004021411A2 (en) * | 2002-08-31 | 2004-03-11 | Applied Materials, Inc. | Method and apparatus for supplying substrates to a processing tool |
| US7243003B2 (en) | 2002-08-31 | 2007-07-10 | Applied Materials, Inc. | Substrate carrier handler that unloads substrate carriers directly from a moving conveyor |
| US6955197B2 (en) | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
| US7234584B2 (en) * | 2002-08-31 | 2007-06-26 | Applied Materials, Inc. | System for transporting substrate carriers |
| US7221993B2 (en) | 2003-01-27 | 2007-05-22 | Applied Materials, Inc. | Systems and methods for transferring small lot size substrate carriers between processing tools |
| US7578650B2 (en) * | 2004-07-29 | 2009-08-25 | Kla-Tencor Technologies Corporation | Quick swap load port |
| KR100699154B1 (en) * | 2005-11-08 | 2007-03-21 | 동부일렉트로닉스 주식회사 | Standard mechanical interface apparatus |
| US8814488B2 (en) | 2007-04-02 | 2014-08-26 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and semiconductor device manufacturing method |
| JP6014982B2 (en) * | 2011-09-28 | 2016-10-26 | シンフォニアテクノロジー株式会社 | Side load port, EFEM |
-
1997
- 1997-03-13 JP JP9078914A patent/JPH10256346A/en active Pending
-
1998
- 1998-03-11 TW TW087103564A patent/TW432463B/en not_active IP Right Cessation
- 1998-03-12 KR KR1019980008317A patent/KR19980080191A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980080191A (en) | 1998-11-25 |
| JPH10256346A (en) | 1998-09-25 |
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| GD4A | Issue of patent certificate for granted invention patent | ||
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