JPH09512567A - 高温耐性を有する帯電防止性感圧接着テープ - Google Patents
高温耐性を有する帯電防止性感圧接着テープInfo
- Publication number
- JPH09512567A JPH09512567A JP7526345A JP52634595A JPH09512567A JP H09512567 A JPH09512567 A JP H09512567A JP 7526345 A JP7526345 A JP 7526345A JP 52634595 A JP52634595 A JP 52634595A JP H09512567 A JPH09512567 A JP H09512567A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- sensitive adhesive
- acrylate
- polymer
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31859—Next to an aldehyde or ketone condensation product
- Y10T428/31877—Phenol-aldehyde
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.2つの表面を有する基材を含んで成り、前記表面の少なくとも一方の上に 平均直径が少なくとも1μmの微粒子接着剤を有し、該微粒子の表面上に、ポリ マー電解質をベースとするポリマー、並びにアルカリ金属の塩およびアルカリ土 類金属の塩からなる群より選ばれる少なくとも1種のイオン性塩から形成された イオン的導電性材料を有し、前記接着剤がプライマーを用いて基材に接着してお り、プライマーが少なくとも1つのフェノール性樹脂および少なくとも1つのゴ ム状化合物を含んで成る帯電防止性感圧接着テープであり、該接着テープが26 0℃の溶融はんだ中で少なくとも5秒間の浸漬に耐えることのできる耐熱性を有 する感圧接着テープ。 2.フェノール性樹脂がフェノール−ホルムアルデヒド樹脂である請求項1に 記載の耐熱性を有する帯電防止性感圧接着テープ。 3.プライマーコーティングが、ブチルゴム、アクリロニトリル−ブタジエン 、アクリロニトリル−ブタジエン−スチレンコポリマー、スチレン−ブタジエン −スチレン、スチレン−エチレンブチレン−スチレンコポリマー、ポリクロロプ レン、ポリブタジエン、ポリイソプレン、スチレン−イソプレン−スチレン、お よびそれらの混合物からなる群より選ばれるゴム状化合物を含んで成る請求項1 に記載の耐熱性を有する帯電防止性感圧接着テープ。 4.プライマーコーティングが、アクリロニトリル−ブタジエン−スチレンコ ポリマーとポリクロロプレンの混合物を含んで成る請求項1に記載の耐熱性を有 する帯電防止性感圧接着テープ。 5.微粒子接着剤が a)少なくとも1つのアルキル(メタ)アクリレートまたはビニルエステル少な くとも70部、 b)それと対応して、100部のモノマーを作製するために、少なくとも1つの 極性モノマー30部まで から構成されるモノマーのポリマーを含んで成り、イオン導電性材料がポリエチ レンオキサイド、ポリフェニレンオキサイド、ポリフェニレンスルフィド、ポリ エチレンスルフィド、ポリエチレンイミン、ポリプロピレンオキサイド、ポリブ チレンオキサイド、ポリブチレンスルフィド、およびポリブチレンイミンからな る群より選ばれるポリマー電解質をベースとするポリマーから形成されたポリマ ー電解質を含んで成り、該ポリマー電解質をベースとするポリマーが、0.1〜 10部の量で添加される請求項1に記載の耐熱性を有する帯電防止性感圧接着テ ープ。 6.イオン導電性材料が、ポリマー電解質をベースとする単位1モルにつき、 アルカリ金属またはアルカリ土類金属の少なくとも1つの塩0.01〜10モル を含んで成る請求項1に記載の耐熱性を有する帯電防止性感圧接着テープ。 7.塩が、LiCl、LiNO3、LiCF3SO3、LiSO4、LiOH、K OH、NaSCN、NaI、BaSO3CF3、およびNH4OHからなる群より 選ばれる請求項6に記載の耐熱性を有する帯電防止性感圧接着テープ。 8.アルキル(メタ)アクリレートが、イソオクチル(メタ)アクリレート、 2−エチルヘキシル(メタ)アクリレート、イソノニル(メタ)アクリレート、 イソアミル(メタ)アクリレート、イソデシル(メタ)アクリレート、およびブ チル(メタ)アクリレートからなる群より選ばれ、ビニルエステルが、ビニル− 2−エチルヘキサノエート、ビニルカプロエート、ビニルラウレート、ビニルペ ラルゴネート、ビニルヘキサノエート、ビニルプロピオネート、ビニルデカノエ ート、およびビニルオクタノエートからなる群より選ばれ、並びに極性モノマー が、N−ビニル−2−ピロリドン、N−ビニルカプロラクタム、アクリロニトリ ル、ビニルアクリレート、ジアリルフタレート、アクリル酸、メタクリル酸、イ タコン酸、ヒドロキシアルキルアクリレート、シアノアルキルアクリレート、ア クリルアミド、および置換アクリルアミドからなる群より選ばれる請求項5に記 載の耐熱性を有する帯電防止性感圧接着テープ。 9.基材が、ポリイミド、ポリフェニレンスルフィド、熱処理した不織布、フ ァイバーガラス、金属化ポリマーフィルム、セラミックシート材料、および金属 箔からなる群より選ばれる請求項1に記載の耐熱性を有する帯電防止性感圧接着 テ ープ。 10.基材がポリイミドである請求項9に記載の耐熱性を有する帯電防止性感 圧接着テープ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23930994A | 1994-05-06 | 1994-05-06 | |
US08/239,309 | 1994-05-06 | ||
PCT/US1995/003381 WO1995030720A1 (en) | 1994-05-06 | 1995-03-16 | High temperature resistant antistatic pressure-sensitive adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09512567A true JPH09512567A (ja) | 1997-12-16 |
JP3473701B2 JP3473701B2 (ja) | 2003-12-08 |
Family
ID=22901605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52634595A Expired - Fee Related JP3473701B2 (ja) | 1994-05-06 | 1995-03-16 | 高温耐性を有する帯電防止性感圧接着テープ |
Country Status (9)
Country | Link |
---|---|
US (1) | US5631079A (ja) |
EP (1) | EP0758366B1 (ja) |
JP (1) | JP3473701B2 (ja) |
KR (1) | KR970702906A (ja) |
CN (1) | CN1147268A (ja) |
DE (1) | DE69507609T2 (ja) |
MX (1) | MX9605243A (ja) |
MY (1) | MY113845A (ja) |
WO (1) | WO1995030720A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009530470A (ja) * | 2006-03-23 | 2009-08-27 | エルジー・ケム・リミテッド | フレキシブル基板搬送用粘着剤組成物 |
JP2010525098A (ja) * | 2007-04-19 | 2010-07-22 | エルジー・ケム・リミテッド | アクリル系粘着剤組成物 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914186A (en) * | 1994-05-06 | 1999-06-22 | Minnesota Mining And Manufacturing Company | High temperature resistant antistatic pressure-sensitive adhesive tape |
US5759431A (en) * | 1994-12-15 | 1998-06-02 | Minnesota Mining And Manufacturing Company | Stain resistant composition containing sulphonated surfactant |
US6294250B1 (en) * | 1996-08-28 | 2001-09-25 | 3M Innovative Properties Company | Adhesive film and method for producing the same |
US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
JP2002319316A (ja) * | 2001-02-15 | 2002-10-31 | Sumitomo Chem Co Ltd | 絶縁フィルム類 |
US20030109630A1 (en) * | 2001-10-23 | 2003-06-12 | Smith Dawn E. | Microsphere adhesive formulations |
US7691925B2 (en) | 2004-03-08 | 2010-04-06 | Nitto Denko Corporation | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film |
JP2005314579A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 粘着剤組成物、および粘着シート類 |
TW200617124A (en) | 2004-06-01 | 2006-06-01 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film |
US20080166523A1 (en) * | 2007-01-04 | 2008-07-10 | Asahi Kasei Chemicals Corporation | Tab leader tape made of polyphenylene ether-based resin |
TWI387629B (zh) * | 2004-07-26 | 2013-03-01 | Nitto Denko Corp | 壓感黏合劑組成物、壓感黏合片及表面保護膜 |
KR100694445B1 (ko) * | 2004-08-24 | 2007-03-12 | 주식회사 엘지화학 | 대전 방지 성능을 갖는 아크릴계 점착제 조성물 |
JP4531628B2 (ja) | 2004-09-16 | 2010-08-25 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4917267B2 (ja) * | 2004-09-16 | 2012-04-18 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4358190B2 (ja) * | 2005-03-16 | 2009-11-04 | 日東電工株式会社 | 粘着剤組成物、粘着シート類および表面保護フィルム |
KR101258719B1 (ko) * | 2005-05-20 | 2013-04-26 | 닛토덴코 가부시키가이샤 | 점착제 조성물, 점착 시트 및 표면 보호 필름 |
US7799853B2 (en) * | 2005-09-05 | 2010-09-21 | Nitto Denko Corporation | Adhesive composition, adhesive sheet, and surface protective film |
JP5259940B2 (ja) * | 2005-09-05 | 2013-08-07 | 日東電工株式会社 | 粘着剤組成物、粘着シートおよび表面保護フィルム |
MXPA06010596A (es) * | 2005-12-23 | 2007-06-22 | 3M Innovative Properties Co | Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida. |
CN101517831B (zh) * | 2006-09-26 | 2010-11-17 | 日立化成工业株式会社 | 各向异性导电性粘接剂组合物、各向异性导电性薄膜、电路构件的连接结构、以及被覆粒子的制造方法 |
CN101775259A (zh) | 2009-01-09 | 2010-07-14 | 3M创新有限公司 | 一种防静电的耐高温聚酰亚胺胶带 |
JP5623020B2 (ja) | 2009-02-27 | 2014-11-12 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、及び、粘着シート |
US8986831B2 (en) | 2011-05-24 | 2015-03-24 | H. B. Fuller Company | Pressure sensitive adhesive tear tape |
CN102497170A (zh) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技(无锡)有限公司 | 一种用于层压板表面图贴装和回流焊的载具 |
CN102952468B (zh) * | 2012-10-27 | 2013-11-13 | 蚌埠凤凰滤清器有限责任公司 | 一种滤清器用氯丁橡胶与溴化丁基橡胶混炼而得的粘合剂胶片 |
CN103614090B (zh) * | 2013-12-06 | 2015-06-17 | 苏州贤聚科技有限公司 | 一种防静电压敏胶保护膜及其制备方法 |
CN104893607B (zh) * | 2015-05-29 | 2017-09-12 | 张家港康得新光电材料有限公司 | 一种抗静电防爆保护膜 |
US20170145169A1 (en) * | 2015-10-26 | 2017-05-25 | University Of Wyoming | Methods of Generating Microparticles and Porous Hydrogels Using Microfluidics |
CN106281201A (zh) * | 2016-08-29 | 2017-01-04 | 无锡万能胶粘剂有限公司 | 一种厌氧胶 |
US11642642B2 (en) | 2017-10-17 | 2023-05-09 | University Of Wyoming | Exploiting oxygen inhibited photopolymerization within emulsion droplets for the fabrication of microparticles with customizable properties |
CN108130003A (zh) * | 2017-12-19 | 2018-06-08 | 江苏斯瑞达新材料科技有限公司 | 电子元器件用防水耐热保护膜 |
CN110240875B (zh) * | 2019-06-11 | 2021-06-01 | 恩平市盈嘉丰胶粘制品有限公司 | 一种耐高温石棉纸胶带及其制备方法 |
CN113801601A (zh) * | 2021-09-27 | 2021-12-17 | 浙江福莱新材料股份有限公司 | 一种抗静电弹性防滑胶带及其制备方法 |
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US4166152B1 (en) * | 1977-08-17 | 1999-05-18 | Minnesota Mining & Mfg | Tacky polymeric microspheres |
DE3442695A1 (de) * | 1984-11-23 | 1986-06-05 | Beiersdorf Ag, 2000 Hamburg | Klebeband |
GB2170427B (en) * | 1985-02-01 | 1989-06-07 | Sanyo Kokusaku Pulp Co | Pressure-sensitive adhesive tapes or sheets |
US4656218A (en) * | 1985-02-08 | 1987-04-07 | Sanyo Kokusaku Pulp Co., Ltd. | Adhesive copolymer microspheres-containing aqueous suspension and method for producing the same |
JPS6312681A (ja) * | 1986-07-02 | 1988-01-20 | Sekisui Chem Co Ltd | 帯電防止粘着テ−プもしくはシ−ト |
US5045569A (en) * | 1988-11-30 | 1991-09-03 | Minnesota Mining And Manufacturing Company | Hollow acrylate polymer microspheres |
IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
US5378405A (en) * | 1993-07-28 | 1995-01-03 | Minnesota Mining And Manufacturing Company | Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
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1995
- 1995-03-16 JP JP52634595A patent/JP3473701B2/ja not_active Expired - Fee Related
- 1995-03-16 CN CN95192921A patent/CN1147268A/zh active Pending
- 1995-03-16 WO PCT/US1995/003381 patent/WO1995030720A1/en active IP Right Grant
- 1995-03-16 DE DE69507609T patent/DE69507609T2/de not_active Expired - Lifetime
- 1995-03-16 EP EP95913753A patent/EP0758366B1/en not_active Expired - Lifetime
- 1995-03-16 MX MX9605243A patent/MX9605243A/es not_active IP Right Cessation
- 1995-04-27 MY MYPI95001104A patent/MY113845A/en unknown
- 1995-06-29 US US08/496,533 patent/US5631079A/en not_active Expired - Lifetime
-
1996
- 1996-11-04 KR KR1019960706208A patent/KR970702906A/ko not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009530470A (ja) * | 2006-03-23 | 2009-08-27 | エルジー・ケム・リミテッド | フレキシブル基板搬送用粘着剤組成物 |
US8436122B2 (en) | 2006-03-23 | 2013-05-07 | Lg Chem, Ltd. | Pressure sensitive adhesive composition for transporting flexible substrate |
JP2010525098A (ja) * | 2007-04-19 | 2010-07-22 | エルジー・ケム・リミテッド | アクリル系粘着剤組成物 |
JP2015014011A (ja) * | 2007-04-19 | 2015-01-22 | エルジー・ケム・リミテッド | アクリル系粘着剤組成物 |
US9499725B2 (en) | 2007-04-19 | 2016-11-22 | Lg Chem, Ltd. | Acrylic pressure-sensitive adhesive compositions |
Also Published As
Publication number | Publication date |
---|---|
JP3473701B2 (ja) | 2003-12-08 |
MY113845A (en) | 2002-06-29 |
WO1995030720A1 (en) | 1995-11-16 |
US5631079A (en) | 1997-05-20 |
EP0758366B1 (en) | 1999-01-27 |
DE69507609D1 (de) | 1999-03-11 |
MX9605243A (es) | 1997-10-31 |
EP0758366A1 (en) | 1997-02-19 |
DE69507609T2 (de) | 1999-09-30 |
CN1147268A (zh) | 1997-04-09 |
KR970702906A (ko) | 1997-06-10 |
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