CN103614090B - 一种防静电压敏胶保护膜及其制备方法 - Google Patents
一种防静电压敏胶保护膜及其制备方法 Download PDFInfo
- Publication number
- CN103614090B CN103614090B CN201310654380.6A CN201310654380A CN103614090B CN 103614090 B CN103614090 B CN 103614090B CN 201310654380 A CN201310654380 A CN 201310654380A CN 103614090 B CN103614090 B CN 103614090B
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- Prior art keywords
- sensitive adhesive
- pressure
- antistatic
- protective film
- nano wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 77
- 230000001681 protective effect Effects 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims description 13
- 239000002070 nanowire Substances 0.000 claims abstract description 39
- 239000000203 mixture Substances 0.000 claims abstract description 34
- 239000010410 layer Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 238000002203 pretreatment Methods 0.000 claims abstract description 6
- 150000005846 sugar alcohols Polymers 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000006185 dispersion Substances 0.000 claims description 9
- 239000000470 constituent Substances 0.000 claims description 4
- 230000008595 infiltration Effects 0.000 claims description 4
- 238000001764 infiltration Methods 0.000 claims description 4
- -1 perfluoro alkyl sulfonic acid salt Chemical class 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- FHDQNOXQSTVAIC-UHFFFAOYSA-M 1-butyl-3-methylimidazol-3-ium;chloride Chemical compound [Cl-].CCCCN1C=C[N+](C)=C1 FHDQNOXQSTVAIC-UHFFFAOYSA-M 0.000 claims description 2
- ZXLOSLWIGFGPIU-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;acetate Chemical compound CC(O)=O.CCN1CN(C)C=C1 ZXLOSLWIGFGPIU-UHFFFAOYSA-N 0.000 claims description 2
- RCAIAWXCDYJARE-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;formate Chemical compound [O-]C=O.CC[NH+]1CN(C)C=C1 RCAIAWXCDYJARE-UHFFFAOYSA-N 0.000 claims description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims description 2
- JMNFVQWMBCLWAS-UHFFFAOYSA-N C(F)(F)F.C(C)N1CN(C=C1)C Chemical compound C(F)(F)F.C(C)N1CN(C=C1)C JMNFVQWMBCLWAS-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229920002614 Polyether block amide Polymers 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 claims description 2
- 238000005119 centrifugation Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- ZDIRKWICVFDSNX-UHFFFAOYSA-N diethyl phosphate 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium Chemical compound P(=O)(OCC)(OCC)O.C(C)N1CN(C=C1)C ZDIRKWICVFDSNX-UHFFFAOYSA-N 0.000 claims description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 239000002159 nanocrystal Substances 0.000 claims description 2
- 230000010355 oscillation Effects 0.000 claims description 2
- 229920001197 polyacetylene Polymers 0.000 claims description 2
- 229920000767 polyaniline Polymers 0.000 claims description 2
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 2
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920000053 polysorbate 80 Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001632 sodium acetate Substances 0.000 claims description 2
- 229960004249 sodium acetate Drugs 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- 239000001509 sodium citrate Substances 0.000 claims description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 claims description 2
- 229940039790 sodium oxalate Drugs 0.000 claims description 2
- 238000007669 thermal treatment Methods 0.000 claims description 2
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 2
- 229940038773 trisodium citrate Drugs 0.000 claims description 2
- 235000019263 trisodium citrate Nutrition 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 6
- 239000002216 antistatic agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 239000002270 dispersing agent Substances 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000002079 cooperative effect Effects 0.000 abstract 1
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 5
- 230000002195 synergetic effect Effects 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2469/00—Presence of polycarbonate
- C09J2469/006—Presence of polycarbonate in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310654380.6A CN103614090B (zh) | 2013-12-06 | 2013-12-06 | 一种防静电压敏胶保护膜及其制备方法 |
PCT/CN2014/081744 WO2015081698A1 (zh) | 2013-12-06 | 2014-07-07 | 一种防静电压敏胶保护膜及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310654380.6A CN103614090B (zh) | 2013-12-06 | 2013-12-06 | 一种防静电压敏胶保护膜及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103614090A CN103614090A (zh) | 2014-03-05 |
CN103614090B true CN103614090B (zh) | 2015-06-17 |
Family
ID=50164810
Family Applications (1)
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CN201310654380.6A Expired - Fee Related CN103614090B (zh) | 2013-12-06 | 2013-12-06 | 一种防静电压敏胶保护膜及其制备方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103614090B (zh) |
WO (1) | WO2015081698A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106010329A (zh) * | 2016-05-23 | 2016-10-12 | 浙江美登特种薄膜有限公司 | 一种抗静电硅胶保护膜 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103614090B (zh) * | 2013-12-06 | 2015-06-17 | 苏州贤聚科技有限公司 | 一种防静电压敏胶保护膜及其制备方法 |
CN104635292B (zh) * | 2015-03-13 | 2017-06-16 | 京东方科技集团股份有限公司 | 一种偏振光片及其制备方法和显示屏 |
CN104999072B (zh) * | 2015-06-29 | 2017-09-26 | 南京宜洛辞电子科技有限公司 | 一种可再分散的银纳米线混合物及其制备方法 |
CN105733464B (zh) * | 2015-10-30 | 2019-06-04 | 昆山乐凯锦富光电科技有限公司 | 一种液晶偏光板用光学保护膜 |
CN107057592A (zh) * | 2016-12-28 | 2017-08-18 | 太仓金煜电子材料有限公司 | 一种高稳定剥离硅胶保护膜的生产方法 |
CN108081726A (zh) * | 2018-02-05 | 2018-05-29 | 浙江欣麟新材料技术有限公司 | 一种防静电保护膜及其用途 |
CN108384476A (zh) * | 2018-02-28 | 2018-08-10 | 昆山乐凯锦富光电科技有限公司 | 一种偏光片保护膜用压敏胶制备方法及其保护膜 |
CN114106688B (zh) * | 2021-12-22 | 2022-06-17 | 华中科技大学 | 防静电涂层材料的配置方法、防静电涂层及其形成方法 |
CN114456728A (zh) * | 2021-12-31 | 2022-05-10 | 江苏吉腾新材料科技有限公司 | 一种耐高温亚克力保护膜及其制备方法 |
CN115820199B (zh) * | 2022-12-09 | 2024-05-03 | 浙江工业大学 | 改性黑滑石抗菌导电压敏胶、医用电极片及其制备方法 |
Citations (5)
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US4728583A (en) * | 1984-08-31 | 1988-03-01 | Fuji Photo Film Co., Ltd. | Radiation image storage panel and process for the preparation of the same |
CN102208563A (zh) * | 2011-04-18 | 2011-10-05 | 电子科技大学 | 一种柔性发光器件用基板及其制备方法 |
CN102453446A (zh) * | 2010-10-28 | 2012-05-16 | 比亚迪股份有限公司 | 一种防静电薄膜及其制备方法 |
CN202595027U (zh) * | 2012-06-06 | 2012-12-12 | 太湖金张科技有限公司 | 一种胶层防静电保护膜 |
CN102936357A (zh) * | 2012-10-31 | 2013-02-20 | 北京化工大学 | 一种银纳米线官能化碳纳米管抗静电剂及制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1147268A (zh) * | 1994-05-06 | 1997-04-09 | 美国3M公司 | 耐高温抗静电的压敏胶粘带 |
JP2008055710A (ja) * | 2006-08-30 | 2008-03-13 | Nitto Denko Cs System Kk | 帯電防止性粘着テープ |
JP5339284B2 (ja) * | 2008-03-04 | 2013-11-13 | リンテック株式会社 | 粘着剤組成物及び粘着シート |
CN101323191A (zh) * | 2008-07-28 | 2008-12-17 | 金国华 | 一种透明抗紫外线隔热复合膜及制备方法 |
CN103614090B (zh) * | 2013-12-06 | 2015-06-17 | 苏州贤聚科技有限公司 | 一种防静电压敏胶保护膜及其制备方法 |
-
2013
- 2013-12-06 CN CN201310654380.6A patent/CN103614090B/zh not_active Expired - Fee Related
-
2014
- 2014-07-07 WO PCT/CN2014/081744 patent/WO2015081698A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728583A (en) * | 1984-08-31 | 1988-03-01 | Fuji Photo Film Co., Ltd. | Radiation image storage panel and process for the preparation of the same |
CN102453446A (zh) * | 2010-10-28 | 2012-05-16 | 比亚迪股份有限公司 | 一种防静电薄膜及其制备方法 |
CN102208563A (zh) * | 2011-04-18 | 2011-10-05 | 电子科技大学 | 一种柔性发光器件用基板及其制备方法 |
CN202595027U (zh) * | 2012-06-06 | 2012-12-12 | 太湖金张科技有限公司 | 一种胶层防静电保护膜 |
CN102936357A (zh) * | 2012-10-31 | 2013-02-20 | 北京化工大学 | 一种银纳米线官能化碳纳米管抗静电剂及制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106010329A (zh) * | 2016-05-23 | 2016-10-12 | 浙江美登特种薄膜有限公司 | 一种抗静电硅胶保护膜 |
Also Published As
Publication number | Publication date |
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WO2015081698A1 (zh) | 2015-06-11 |
CN103614090A (zh) | 2014-03-05 |
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