JPH09512367A - 保持体要素 - Google Patents

保持体要素

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Publication number
JPH09512367A
JPH09512367A JP8509118A JP50911896A JPH09512367A JP H09512367 A JPH09512367 A JP H09512367A JP 8509118 A JP8509118 A JP 8509118A JP 50911896 A JP50911896 A JP 50911896A JP H09512367 A JPH09512367 A JP H09512367A
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Japan
Prior art keywords
contact
coil
flags
carrier element
semiconductor chip
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JP8509118A
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JP2785232B2 (ja
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ムンデイグル、ヨーゼフ
キルシユバウエル、ヨーゼフ
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Siemens AG
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Siemens AG
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/732—Location after the connecting process
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Abstract

(57)【要約】 特にチップカードのなかに組み込むための保持体要素であって、導体保持体（１）の上に配置されており、またその接触フラグ（５、６；５、７）と電気的に接続されている半導体チップ（２）を有し、その際に少なくとも半導体チップ（２）と、接触フラグ（５、６；５、７）とのその接続のために設けられているボンディングワイヤー（３）とが合成樹脂材料（４）により、接触フラグ（５、６；５、７）が半導体チップ（２）への導電性の接続として合成樹脂材料（４）から突き出るように、包囲されている保持体要素において、合成樹脂材料（４）の表面の１つの上の接触フラグが接触面（５）を形成し、その際に接触フラグの少なくとも２つが追加的に接触面（５）の延長部のなかにアンテナコイルの端部に対する接続端（６；７）を形成する。

Description

【発明の詳細な説明】 保持体要素 本発明は、特にチップカードのなかに組み込むための保持体要素であって、当 業者から一般にリードフレームと呼ばれる導体保持体の上に配置されており、ま たその接触フラグと電気的に接続されている半導体チップを有し、その際に少な くとも半導体チップと、接触フラグとのその接続のために設けられているボンデ ィングワイヤーとが合成樹脂材料により、接触フラグが半導体チップへの導電性 の接続として合成樹脂材料から突き出るように、包囲されている保持体要素に関 する。 このような保持体要素はヨーロッパ特許出願公開第 0254640号明細書から公知 である。この公知の保持体要素は、読出し装置から接触フラグを介しての機械的 接触によりエネルギーを供給されるチップカードのなかに入れられる。データフ ローも接触フラグを介して機械的接触により伝達される。 ドイツ特許第 4115065号明細書から、エネルギーおよびデータがアンテナコイ ルを介して、すなわち電磁誘導結合により伝達される無接触チップカードが公知 である。そこではアンテナコイルの端部がチップカードの半導体チップと接続さ れており、その際にチップカードは外方にその他の接触を有していない。このよ うな無接触チップカードの検査はその場合に組立られたコイルを介してのみ可能 である。 本発明の課題は、無接触チップカードのなかに組み込むのに適しており、また 接続されたコイルなしに検査を可能にし、またそれにコイルを組み立てるのに適 している保持体要素を提供することにある。 この課題は請求項１による保持体要素により解決される。本発明の有利な実施 態様は従属請求項に記載されている。 接触フラグによる半導体チップの合成樹脂包被の表面の上に本発明により接触 面を構成することにより、接触フラグの延長部にアンテナが接続されることなし に、たとえば検査の目的での機械的接触によるチップへの電気的アクセスが可能 である。検査はアンテナが接続されていても可能であるが、アンテナは本発明に よる構成に基づいて使用されなくてよい。 接触フラグ延長部が保持体要素の向かい合う側に配置されているならば、保持 体要素は有利なことに直接に平坦なコイルのターンの上に置かれ、また、コイル 端がターンと重ならなくてよいように、コイル端と接触され得る。このようにし て、Ｑ値のようなコイル品質値の高い再現性をもたらす保持体要素‐コイルの接 続の容易に自動化可能な製造が可能である。 相い異なる長さを有する接触フラグ延長部の構成により、接触フラグ延長部の 長いほうがターンの上もしくは下を導かれるので、同じくコイル端の重なりのな い接触形成が可能である。その際に、保持体要素を、それが曲げ応力により最も 強く負荷されるチップカードの中心線から遠く離れて配置されるように、チップ カードの縁の付近またはコーナーに置くことが可能である。 以下、図面に示す実施例により本発明を一層詳細に説明する。 図１および図２は本発明による保持体要素のそれぞれ断面図、また 図３は組立られた保持体要素の斜視図である。 図１、図２および図３によれば半導体チップ２が導体保持体１の上に取付けら れ、たとえば接着されており、またボンディングワイヤー３によりその接触フラ グ５、６または５、７と導電的に接続されている。半導体チップ２およびボンデ ィングワイヤー３はケース４を形成する合成樹脂材料４により鋳込まれている。 導体保持体１の接触フラグは、それらが合成樹脂材料４の表面に配置されている 接触面５を形成するように成形されている。接触面５の延長部はアンテナコイル の端部に対する接続端を形成する。図１中では接触フラグ延長部は、それらがア ンテナターンの下側を導かれるように、、２回曲げられている。図２中では接触 面の延長部は、それらがアンテナターンの上側を導かれるように、接触面と等し い平面内を延びている。図３は本発明による保持体要素の特に有利な組立を示す 。ここでは保持体要素は直接に平坦なコイルのターン９の上に被覆されており、 また保持体要素の向かい合う側に配置されている接触フラグ延長部の２つはコイ ルの端部と接続されている。このようにして保持体要素自体がコイルターンの橋 かけを形成する。それによって特に容易に自動化可能かつ良好に再現可能な組立 可 能性が得られる。アンテナターン９はその際に印刷された導体としてカード入れ 子８の上に実現されていてよい。半導体チップは本発明による保持体要素では接 触面５により組立てられた保持体要素においても、組立てられていない保持体要 素においても問題なしに機械的接触により検査することができる。

Claims (1)

  1. 【特許請求の範囲】 １．特にチップカードのなかに組み込むための保持体要素であって、導体保持体 （１）の上に配置されており、またその接触フラグ（５、６；５、７）と電気的 に接続されている半導体チップ（２）を有し、その際に少なくとも半導体チップ （２）と、接触フラグ（５、６；５、７）とのその接続のために設けられている ボンディングワイヤー（３）とが合成樹脂材料（４）により、、接触フラグ（５ 、６；５、７）が半導体チップ（２）への導電性の接続として合成樹脂材料（４ ）から突き出るように、包囲されている保持体要素において、合成樹脂材料（４ ）の表面の１つの上の接触フラグが接触面（５）を形成し、その際に接触フラグ の少なくとも２つが追加的に接触面（５）の延長部のなかにアンテナコイルの端 部に対する接続端（６；７）を形成することを特徴とする保持体要素。 ２．少なくとも２つの接触フラグのコイル接続端（６；７）が相い異なる長さを 有することを特徴とする請求項１記載の保持体要素。 ３．少なくとも２つの接触フラグのコイル接続端（６；７）が保持体要素の向か い合う側に配置されていることを特徴とする請求項１または２記載の保持体要素 。 ４．少なくとも２つの接触フラグのコイル接続端が互いに平行に配置されている ことを特徴とする請求項１または２記載の保持体要素。 ５．少なくとも２つの接触フラグのコイル接続端が互いに垂直に配置されている ことを特徴とする請求項１または２記載の保持体要素。 ６．少なくとも２つの接触フラグの接触面（５）およびコイル接続端（６）が１ つの平面内に位置していることを特徴とする請求項１ないし５の１つに記載の保 持体要素。 ７．少なくとも２つの接触フラグの接触面（５）およびコイル接続端（６）が相 い異なる平面内に位置していることを特徴とする請求項１ないし５の１つに記載 の保持体要素。
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Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005309520A (ja) * 2004-04-16 2005-11-04 Dainippon Printing Co Ltd インターポーザー付シート、その巻体およびその検査方法
WO2008023636A1 (fr) * 2006-08-24 2008-02-28 Murata Manufacturing Co., Ltd. Système d'inspection de circuits intégrés sans fil et procédé de fabrication de circuits intégrés sans fil l'utilisant
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
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US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
DE19534480C2 (de) * 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
DE19610507C2 (de) * 1996-03-15 1997-12-04 David Finn Chipkarte
DE19639025C2 (de) * 1996-09-23 1999-10-28 Siemens Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
DE19716342C2 (de) * 1997-04-18 1999-02-25 Pav Card Gmbh Verfahren zur Herstellung einer Chipkarte
FR2781068B1 (fr) * 1998-07-07 2000-10-13 Rue Cartes Et Systemes De Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue
JP3180086B2 (ja) 1998-08-31 2001-06-25 株式会社シーメディア 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触ｉｃメディア
FR2782822A1 (fr) * 1998-09-02 2000-03-03 Hitachi Maxell Module a semi-conducteur et procede de production
DE19932960C2 (de) * 1998-10-08 2002-09-12 Pav Card Gmbh Verfahren zur Herstellung eines Chipkartenmoduls, Positioniervorrichtung zur Durchführung eines derartigen Verfahrens und Positionierverfahren
WO2000043952A1 (en) * 1999-01-22 2000-07-27 Intermec Ip Corp. Rfid transponder
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
EP1440418B1 (en) * 2001-10-31 2005-02-02 Sokymat S.A. Transponder ic with optimized dimensions
EP2666344B1 (en) * 2011-01-20 2019-03-13 Hewlett-Packard Enterprise Development LP Chip carrier support systems
CN107912065B (zh) * 2015-06-23 2020-11-03 立联信控股有限公司 具有至少一个用于无接触地传输信息的接口的智能卡坯件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
EP0379592A4 (en) * 1988-06-29 1991-06-19 Matsushita Electric Industrial Co. Ltd. Ic memory card
US4931991A (en) * 1988-12-22 1990-06-05 Amp Incorporated Machine readable memory card with capacitive interconnect
FR2641102B1 (ja) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE4115065A1 (de) * 1991-05-08 1992-11-12 Angewandte Digital Elektronik Stromfluss kontroll-schaltung
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)
JP2672924B2 (ja) * 1992-07-30 1997-11-05 三菱電機株式会社 非接触ｉｃカードとその製造方法及びテスト方法
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag

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Publication number Priority date Publication date Assignee Title
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US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
WO2008023636A1 (fr) * 2006-08-24 2008-02-28 Murata Manufacturing Co., Ltd. Système d'inspection de circuits intégrés sans fil et procédé de fabrication de circuits intégrés sans fil l'utilisant
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
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KR970705804A (ko) 1997-10-09
ES2125649T3 (es) 1999-03-01
DE59504284D1 (de) 1998-12-24
WO1996007983A1 (de) 1996-03-14

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