JPH09312236A - Manufacture of electronic component - Google Patents
Manufacture of electronic componentInfo
- Publication number
- JPH09312236A JPH09312236A JP8128275A JP12827596A JPH09312236A JP H09312236 A JPH09312236 A JP H09312236A JP 8128275 A JP8128275 A JP 8128275A JP 12827596 A JP12827596 A JP 12827596A JP H09312236 A JPH09312236 A JP H09312236A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- external electrode
- dissolved oxygen
- plating solution
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子部品の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing electronic parts.
【０００２】[0002]
【従来の技術】従来の電子部品の製造方法の一例とし
て、積層セラミックコンデンサの製造方法を図１を用い
て説明する。図１は積層セラミックコンデンサの断面図
である。積層コンデンサの製造方法としては、学献社刊
「積層セラミックコンデンサ」に開示されている。図１
に示すように積層セラミックコンデンサは、誘電体セラ
ミック１と内部電極２とが交互に積層された電子部品素
体であるコンデンサ素子７と、内部電極２と接続した外
部電極３から構成されている。2. Description of the Related Art As an example of a conventional method of manufacturing an electronic component, a method of manufacturing a monolithic ceramic capacitor will be described with reference to FIG. FIG. 1 is a sectional view of a monolithic ceramic capacitor. A method of manufacturing a multilayer capacitor is disclosed in "Multilayer Ceramic Capacitor" published by Gakudensha. FIG.
As shown in FIG. 2, the monolithic ceramic capacitor includes a capacitor element 7 which is an electronic component element body in which dielectric ceramics 1 and internal electrodes 2 are alternately laminated, and an external electrode 3 connected to the internal electrode 2.
【０００３】外部電極３は、例えば、銀や銀ーパラジウ
ム合金などを主成分とする導電ペーストをコンデンサ素
子７上に塗布し焼き付けた第１の外部電極４と第１の外
部電極４上にニッケルなどの導電層を湿式めっき法等に
より形成した第２の外部電極５と第２の外部電極５上に
錫または半田などの導電層を湿式めっき法等により形成
した第３の外部電極６を順に形成することにより構成さ
れている。なお、第１の外部電極４は内部電極２との電
気的接続信頼性を高め、かつ十分な導電性を外部電極３
に与えるため、電気伝導性に優れた銀もしくは銀を含有
する導電材料などで構成し、第２の外部電極５は、第１
の外部電極４が銀含有材料のため、半田付けに際し第１
の外部電極４の半田食われを防ぐことを目的に半田食わ
れの少ないニッケルなどの導電層で構成し、また第３の
外部電極６は、第２の外部電極５が半田濡れ性が十分で
ないため半田濡れ性に優れた錫および半田などの導電層
で構成している。The external electrodes 3 are, for example, a first external electrode 4 obtained by applying a conductive paste containing silver or a silver-palladium alloy as a main component onto the capacitor element 7 and baking it, and nickel or the like on the first external electrode 4. A second external electrode 5 having a conductive layer formed by a wet plating method and a third external electrode 6 having a conductive layer made of tin or solder formed on the second external electrode 5 by a wet plating method. It is configured by The first outer electrode 4 enhances the reliability of electrical connection with the inner electrode 2 and has sufficient conductivity.
The second external electrode 5 is made of silver or a conductive material containing silver and has excellent electric conductivity.
Since the external electrode 4 of this is a silver-containing material,
In order to prevent the external electrode 4 from being eroded by solder, the second external electrode 5 of the third external electrode 6 does not have sufficient solder wettability. Therefore, it is composed of a conductive layer such as tin and solder having excellent solder wettability.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
従来の製造方法では、図１に示した第２の外部電極５お
よび第３の外部電極６を形成する際、コンデンサ素子７
と第１の外部電極４の密着強度が低下し、そのため内部
電極２との電気的接続信頼性が低下し、プリント基板等
への実装時に外部電極３が剥離するという課題がある。However, in the above conventional manufacturing method, when the second external electrode 5 and the third external electrode 6 shown in FIG. 1 are formed, the capacitor element 7 is formed.
Therefore, there is a problem that the adhesion strength between the first external electrode 4 and the electrical connection reliability with the internal electrode 2 is reduced, and the external electrode 3 peels off when it is mounted on a printed circuit board or the like.
【０００５】また、上述した密着強度低下に起因する課
題以外として、第１の外部電極４以外の箇所に導電層が
形成され、外部電極４間を短絡するという課題もある。
したがって、この発明の目的は、上述した種々の課題を
解決し、電子部品素体と外部電極間の密着強度を向上す
ることができる電子部品の製造方法を提供することであ
る。In addition to the above-mentioned problem caused by the decrease in adhesion strength, there is also a problem that a conductive layer is formed in a portion other than the first external electrode 4 to short-circuit the external electrodes 4.
Therefore, an object of the present invention is to solve the above-mentioned various problems and to provide a method of manufacturing an electronic component capable of improving the adhesion strength between the electronic component element body and the external electrode.
【０００６】[0006]
【課題を解決するための手段】請求項１記載の電子部品
の製造方法は、電子部品素体の外部電極形成領域に第１
の外部電極を形成する工程と、溶存酸素を除去しためっ
き液を用いた湿式めっき法により第１の外部電極上に第
２の外部電極を形成する工程とを含むものである。According to a first aspect of the present invention, there is provided a method of manufacturing an electronic component, wherein a first portion is formed in an external electrode forming region of an electronic component body.
And a step of forming a second external electrode on the first external electrode by a wet plating method using a plating solution from which dissolved oxygen has been removed.
【０００７】請求項１記載の電子部品の製造方法によれ
ば、溶存酸素を除去しためっき液を用いた湿式めっき法
により電子部品の第２の外部電極を形成することによ
り、電子部品素体と第１の外部電極の密着強度の低下を
防ぎ、内部電極との電気的接続信頼性の向上を図り、プ
リント基板等への実装時の外部電極の剥離を防ぐことが
できる。また、めっきの際電子部品素体の表面が還元さ
れるので、外部電極以外の箇所に導電層は形成されず、
外部電極間の短絡を防ぐ効果も得られる。According to the method of manufacturing an electronic component according to claim 1, the second external electrode of the electronic component is formed by a wet plating method using a plating solution from which dissolved oxygen has been removed. It is possible to prevent a decrease in adhesion strength of the first external electrode, improve reliability of electrical connection with the internal electrode, and prevent peeling of the external electrode during mounting on a printed circuit board or the like. In addition, since the surface of the electronic component body is reduced during plating, a conductive layer is not formed in a portion other than the external electrodes,
The effect of preventing a short circuit between the external electrodes is also obtained.
【０００８】請求項２記載の電子部品の製造方法は、請
求項１において、湿式めっき法が電解めっき法である請
求項１記載の電子部品の製造方法。請求項２記載の電子
部品の製造方法によれば、請求項１と同効果がある。請
求項３記載の電子部品の製造方法は、請求項１におい
て、湿式めっき法が無電解めっき法である。The method of manufacturing an electronic component according to claim 2 is the method of manufacturing an electronic component according to claim 1, wherein the wet plating method is an electrolytic plating method. According to the method of manufacturing an electronic component of claim 2, the same effect as that of claim 1 can be obtained. According to a third aspect of the invention, in the first aspect, the wet plating method is an electroless plating method.
【０００９】請求項３記載の電子部品の製造方法によれ
ば、請求項１と同効果がある。請求項４記載の電子部品
の製造方法は、請求項１において、溶存酸素を除去した
めっき液に残存する溶存酸素の濃度が７．０mg／ｌ以下
である。請求項４記載の電子部品の製造方法によれば、
請求項１の第１の外部電極の密着強度の低下を防ぎ、プ
リント基板等への実装時の外部電極の剥離を防ぐ効果が
高い。According to the method of manufacturing an electronic component of claim 3, the same effect as that of claim 1 can be obtained. According to a fourth aspect of the present invention, in the electronic component manufacturing method according to the first aspect, the concentration of dissolved oxygen remaining in the plating solution from which dissolved oxygen has been removed is 7.0 mg / l or less. According to the method of manufacturing an electronic component of claim 4,
According to the first aspect of the present invention, it is highly effective in preventing the adhesion strength of the first external electrode from decreasing and preventing the external electrode from peeling off when it is mounted on a printed board or the like.
【００１０】請求項５記載の電子部品の製造方法は、請
求項１において、ヒドラジン、トリエタノールアミン、
亜硫酸塩から選択された少なくとも一種類以上をめっき
液に添加することにより、めっき液の溶存酸素を除去す
るものである。請求項５記載の電子部品の製造方法によ
れば、請求項１の効果のほか、溶存酸素と化学反応しめ
っき析出反応に影響を及ぼさない。According to a fifth aspect of the present invention, there is provided a method of manufacturing an electronic component according to the first aspect, wherein hydrazine, triethanolamine,
The dissolved oxygen in the plating solution is removed by adding at least one selected from sulfites to the plating solution. According to the method of manufacturing an electronic component according to claim 5, in addition to the effect of claim 1, a chemical reaction with dissolved oxygen does not affect the plating deposition reaction.
【００１１】請求項６記載の電子部品の製造方法は、請
求項１において、不活性ガスをめっき液に通気し溶存酸
素を除去するものである。請求項６記載の電子部品の製
造方法によれば、請求項１と同効果かある。請求項７記
載の電子部品の製造方法は、請求項１において、電子部
品を少なくともチタン、ビスマス、鉛、ジルコニア、カ
ルシウムおよびニオブの酸化物を一種以上含むセラミッ
ク電子部品としたものである。According to a sixth aspect of the present invention, in the electronic component manufacturing method according to the first aspect, an inert gas is passed through the plating solution to remove dissolved oxygen. The electronic component manufacturing method according to the sixth aspect has the same effect as the first aspect. According to a seventh aspect of the present invention, in the electronic component manufacturing method according to the first aspect, the electronic component is a ceramic electronic component containing at least one or more oxides of titanium, bismuth, lead, zirconia, calcium and niobium.
【００１２】請求項７記載の電子部品の製造方法によれ
ば、請求項１と同効果がある。According to the method of manufacturing an electronic component of claim 7, the same effect as that of claim 1 can be obtained.
【００１３】[0013]
【発明の実施の形態】この発明の一実施の形態を説明す
る。すなわち、この電子部品の製造方法は、外部電極の
形成方法に関し、まず電子部品素体の外部電極形成領域
に、少なくとも１層の第１の外部電極を形成する工程を
有する。この少なくとも１層の第１の外部電極の形成に
ついては、例えば、導電ペーストを塗布し焼き付ける方
法、蒸着法、無電解めっき法、スパッタリング法などを
採用することができる。この第１の外部電極は、内部電
極との電気的接続信頼性を高め、かつ十分な導電性を外
部電極に与えるため、電気伝導性に優れた銀もしくは銀
を含有する導電材料などが望ましい。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described. That is, this method of manufacturing an electronic component relates to a method of forming an external electrode, and first has a step of forming at least one layer of the first external electrode in the external electrode formation region of the electronic component body. For forming the at least one layer of the first external electrode, for example, a method of applying and baking a conductive paste, a vapor deposition method, an electroless plating method, a sputtering method, or the like can be adopted. The first external electrode is preferably made of silver or a conductive material containing silver, which has excellent electrical conductivity, in order to enhance the reliability of electrical connection with the internal electrode and to provide the external electrode with sufficient conductivity.
【００１４】次に、この電子部品の製造方法は、溶存酸
素を除去しためっき液を用いた湿式めっき法、とくに無
電解めっき法もしくは電解めっき法により少なくとも１
層以上の第２の外部電極を形成する工程を有する。溶存
酸素の除去方法としては、窒素ガス、アルゴンガスなど
の不活性ガスをめっき液中に通気する方法、もしくはめ
っき液中の溶存酸素と化学反応し、めっき析出反応に悪
影響を及ぼさない化学物質、例えばヒドラジン、トリエ
タノールアミン、亜硫酸塩をめっき液中に添加する方法
を用いる。まためっき液を加温することにより除去する
方法もしくはめっき液面を上述したような不活性ガス雰
囲気にする方法でも除去は可能である。Next, at least one method of manufacturing this electronic component is a wet plating method using a plating solution from which dissolved oxygen is removed, particularly an electroless plating method or an electrolytic plating method.
There is a step of forming a second external electrode having a layer or more. As a method for removing dissolved oxygen, nitrogen gas, a method of ventilating an inert gas such as argon gas into the plating solution, or a chemical reaction with dissolved oxygen in the plating solution, which does not adversely affect the plating precipitation reaction, For example, a method of adding hydrazine, triethanolamine, and sulfite to the plating solution is used. It is also possible to remove by heating the plating solution or by making the surface of the plating solution into an inert gas atmosphere as described above.
【００１５】溶存酸素を除去しためっき液に残存する溶
存酸素の濃度は、外部電極の密着強度を向上する上で、
７．０mg／ｌ以下であることが好ましい。なお、第２の
外部電極を形成した後に、さらに錫や半田などの半田付
け性に優れた第３もしくは複数の外部電極を第２の外部
電極上に形成してもよい。第３の外部電極形成は、第１
の外部電極形成と同様の方法が可能であるが、無電解め
っき法もしくは電解めっき法などの湿式めっき法を用い
る場合は、上述した溶存酸素を除去する方法で、溶存酸
素を除去しためっき液を用いると発明の効果が更に得ら
れる。The concentration of the dissolved oxygen remaining in the plating solution from which the dissolved oxygen has been removed improves the adhesion strength of the external electrode.
It is preferably 7.0 mg / l or less. In addition, after forming the second external electrode, a third or a plurality of external electrodes having excellent solderability such as tin or solder may be formed on the second external electrode. The third external electrode formation is the first
Although the same method as the external electrode formation of is possible, when using a wet plating method such as an electroless plating method or an electrolytic plating method, a plating solution from which dissolved oxygen has been removed is used by the method of removing dissolved oxygen described above. When used, the effect of the invention can be further obtained.
【００１６】また、上述した電子部品は、少なくともチ
タン、ビスマス、鉛、ジルコニア、カルシウムおよびニ
オブの酸化物を一種以上含むセラミック電子部品、例え
ば、セラミックコンデンサ、セラミックフィルタ、セラ
ミック共振器およびセラミック発振子には特に発明の効
果が得られるが、電解コンデンサおよびセラミック基板
にも発明の効果は得られる。The above-mentioned electronic parts are ceramic electronic parts containing at least one or more oxides of titanium, bismuth, lead, zirconia, calcium and niobium, such as ceramic capacitors, ceramic filters, ceramic resonators and ceramic oscillators. In particular, the effect of the invention can be obtained, but the effect of the invention can be obtained also in the electrolytic capacitor and the ceramic substrate.
【００１７】この実施の形態によれば、溶存酸素を除去
しためっき液を用いた湿式めっき法により電子部品の第
２の外部電極を形成することにより、電子部品素体と第
１の外部電極の密着強度の低下を防ぎ、内部電極との電
気的接続信頼性の向上を図り、プリント基板等への実装
時の外部電極の剥離を防ぐことができる。また、めっき
の際電子部品のセラミック素体の表面が還元されるの
で、外部電極以外の箇所に導電層は形成されず、外部電
極間の短絡を防ぐ効果も得られる。According to this embodiment, the second external electrode of the electronic component is formed by the wet plating method using the plating solution from which the dissolved oxygen is removed, so that the electronic component body and the first external electrode are formed. It is possible to prevent a decrease in adhesion strength, improve reliability of electrical connection with the internal electrode, and prevent peeling of the external electrode during mounting on a printed circuit board or the like. In addition, since the surface of the ceramic body of the electronic component is reduced during plating, a conductive layer is not formed in a portion other than the external electrodes, and an effect of preventing a short circuit between the external electrodes can be obtained.
【００１８】[0018]
【実施例１】この発明の実施例１として、積層セラミッ
クコンデンサの製造方法について説明する。この実施例
１は、請求項１，２，３，４，５，６および７に対応す
る。BaO-TiO2系の誘電体仮焼粉末を、バインダ、可塑
剤、溶剤とともにスラリー化し、ドクターブレード法に
より、複数の誘電体セラミックグリーンシートを作製し
た。次いで、誘電体セラミックグリーンシート上に銀ペ
ーストをスクリーン印刷法により内部電極パターン状に
形成し、積層後圧着した。次に個片に切断し、脱バイン
ダを行った後、焼成を行いコンデンサ素体を作製した。
次に、コンデンサ素体の外部電極形成領域に、銀ペース
トを塗布した後、焼結を行い、厚み２０μm の第１の外
部電極を形成した。次に、硫酸ニッケル、塩化ニッケル
およびホウ酸の水溶液からなる電解ニッケルめっき液を
作製した。また、この電解ニッケルめっき液を基本めっ
き液にし、ヒドラジン、エタノールアミンおよび亜硫酸
ナトリウムを、各々適量添加した電解ニッケルめっき液
を作製した。このように作製した電解ニッケルめっき液
と窒素ガスおよびアルゴンガスを、各々基本めっき液
に、１０００cc／分の条件で電解めっき処理１時間前か
ら通気した電解ニッケルめっき液を用いて、バレルめっ
き法により、電解ニッケルめっきを行い、第１の外部電
極上に厚み２μmのニッケル膜を形成し、第２の外部電
極を形成した。なお、電解ニッケルめっきを行う直前
に、各電解ニッケルめっき液中の溶存酸素量を隔膜型ガ
ルバニ電池方式により測定した。次に第２の外部電極上
に、アルカノールスルフォン酸半田めっき液を用いて、
電解めっきにより第３の外部電極を形成した。この様に
して、外部電極を形成し積層セラミックコンデンサを作
製した。Example 1 As Example 1 of the present invention, a method for manufacturing a monolithic ceramic capacitor will be described. The first embodiment corresponds to claims 1, 2, 3, 4, 5, 6 and 7. A plurality of dielectric ceramic green sheets were prepared by a doctor blade method using slurry of BaO-TiO 2 based calcinated powder of a dielectric material, a binder, a plasticizer, and a solvent. Next, a silver paste was formed on the dielectric ceramic green sheet in a pattern of internal electrodes by a screen printing method, laminated and then pressure-bonded. Next, the pieces were cut into pieces, the binder was removed, and then firing was performed to produce capacitor element bodies.
Next, after applying a silver paste to the external electrode forming region of the capacitor body, sintering was performed to form a first external electrode having a thickness of 20 μm. Next, an electrolytic nickel plating solution made of an aqueous solution of nickel sulfate, nickel chloride and boric acid was prepared. Further, using this electrolytic nickel plating solution as a basic plating solution, an appropriate amount of hydrazine, ethanolamine and sodium sulfite was added to prepare an electrolytic nickel plating solution. The electrolytic nickel plating solution thus prepared and the nitrogen gas and the argon gas were each subjected to barrel plating using the basic nickel plating solution and the electrolytic nickel plating solution which had been aerated for 1 hour before the electrolytic plating treatment under the conditions of 1000 cc / min. Then, electrolytic nickel plating was carried out to form a nickel film having a thickness of 2 μm on the first external electrode to form a second external electrode. Immediately before performing electrolytic nickel plating, the amount of dissolved oxygen in each electrolytic nickel plating solution was measured by a diaphragm galvanic cell method. Next, using an alkanol sulfonic acid solder plating solution on the second external electrode,
A third external electrode was formed by electrolytic plating. In this way, external electrodes were formed to produce a monolithic ceramic capacitor.
【００１９】外部電極とコンデンサ素体の密着強度は、
外部電極にリード線を半田付けし、電極面と垂直方向に
引っ張り試験を行い測定した。表１に測定結果を示すよ
うに溶存酸素を除去しない場合、除去した場合に比べ密
着強度は低下する。また溶存酸素の低減に伴い、密着強
度は強くなる傾向が確認できた。また、第１の外部電極
以外の箇所に導電層は形成されなかった。このことか
ら、この発明の方法で、電子部品を製造するときは、そ
の電子部品に要求される密着強度に応じて溶存酸素の除
去の程度を決定することが可能である。The adhesion strength between the external electrode and the capacitor body is
A lead wire was soldered to the external electrode, and a tensile test was carried out in a direction perpendicular to the electrode surface for measurement. As shown in the measurement results in Table 1, when the dissolved oxygen is not removed, the adhesion strength is lower than when it is removed. Further, it was confirmed that the adhesive strength tends to increase as the dissolved oxygen decreases. In addition, the conductive layer was not formed in a portion other than the first external electrode. From this, when manufacturing an electronic component by the method of the present invention, it is possible to determine the degree of removal of dissolved oxygen according to the adhesion strength required for the electronic component.
【００２０】[0020]
【表１】 [Table 1]
【００２１】また、上述した製造方法の中で、第２の外
部電極の形成方法を、第１の外部電極上のみ触媒活性化
処理した後、溶存酸素を上述した方法で除去した無電解
ニッケルめっき液を用いて形成した結果、同様の結果が
得られた。Further, in the above-mentioned manufacturing method, electroless nickel plating in which dissolved oxygen is removed by the above-mentioned method after the catalyst activation treatment is applied only on the first external electrode in the method of forming the second external electrode. As a result of forming using the liquid, the same result was obtained.
【００２２】[0022]
【実施例２】次に、この発明の実施例２として、積層セ
ラミックフィルタの製造方法について説明する。この実
施例は、請求項１，２，４，５，６および７に対応す
る。Bi 2O3-CaO-Nb2O5 系の誘電体仮焼粉末を、バイン
ダ、可塑剤、溶剤とともにスラリー化し、ドクターブレ
ード法により、複数の誘電体セラミックグリーンシート
を作製した。次いで、誘電体セラミックグリーンシート
上に銀ペーストをスクリーン印刷法により内部電極パタ
ーン状に形成し、積層後圧着した。次に個片に切断し、
脱バインダを行った後、焼成を行いフィルタ素体を作製
した。次に、フィルタ素体の外部電極形成領域に、銀ペ
ーストを塗布した後、焼結を行い、厚み２０μm の第１
の外部電極を形成した。次に、実施例１と同様の方法に
より、第２の外部電極および第３の外部電極を形成し、
積層セラミックフィルタを作製した。そして、実施例１
と同様の方法で外部電極とフィルタ素体の密着強度を測
定した結果、実施例１と同様の結果が得られた。[Embodiment 2] Next, as Embodiment 2 of the present invention, a laminated cell
A method of manufacturing the Lamic filter will be described. This fruit
Examples correspond to claims 1, 2, 4, 5, 6 and 7.
You. Bi TwoOThree-CaO-NbTwoOFive System dielectric calcination powder
Slurry with a plasticizer, solvent, and
Multiple dielectric ceramic green sheets
Was prepared. Then, the dielectric ceramic green sheet
Apply silver paste on top of the internal electrode pattern by screen printing.
It was formed into a cone shape and laminated and then pressure-bonded. Then cut into pieces,
After removing the binder, firing is performed to make a filter element.
did. Next, in the external electrode formation area of the filter element,
After applying the first paste, sinter it to the first layer with a thickness of 20 μm.
The external electrode of was formed. Next, in the same manner as in Example 1,
Form a second external electrode and a third external electrode,
A multilayer ceramic filter was produced. And Example 1
Measure the adhesion strength between the external electrode and the filter element in the same way as
As a result, the same result as in Example 1 was obtained.
【００２３】尚、PbTiO3-PbZrO3 系の圧電体仮焼粉末を
用いて作製したものでも同様の効果が得られた。The same effect was obtained with the one prepared by using the PbTiO 3 -PbZrO 3 system piezoelectric calcined powder.
【００２４】[0024]
【発明の効果】請求項１記載の電子部品の製造方法によ
れば、溶存酸素を除去しためっき液を用いた湿式めっき
法により電子部品の第２の外部電極を形成することによ
り、電子部品素体と第１の外部電極の密着強度の低下を
防ぎ、内部電極との電気的接続信頼性の向上を図り、プ
リント基板等への実装時の外部電極の剥離を防ぐことが
できる。また、めっきの際電子部品素体の表面が還元さ
れるので、外部電極以外の箇所に導電層は形成されず、
外部電極間の短絡を防ぐ効果も得られる。According to the method of manufacturing an electronic component according to claim 1, the second external electrode of the electronic component is formed by a wet plating method using a plating solution from which dissolved oxygen is removed. The adhesion strength between the body and the first external electrode can be prevented from decreasing, the reliability of the electrical connection with the internal electrode can be improved, and the external electrode can be prevented from peeling off when it is mounted on a printed circuit board or the like. In addition, since the surface of the electronic component body is reduced during plating, a conductive layer is not formed in a portion other than the external electrodes,
The effect of preventing a short circuit between the external electrodes is also obtained.
【００２５】請求項２記載の電子部品の製造方法によれ
ば、請求項１と同効果がある。請求項３記載の電子部品
の製造方法によれば、請求項１と同効果がある。請求項
４記載の電子部品の製造方法によれば、請求項１の第１
の外部電極の密着強度の低下を防ぎ、プリント基板等へ
の実装時の外部電極の剥離を防ぐ効果が高い。According to the method of manufacturing an electronic component described in claim 2, the same effect as that of claim 1 can be obtained. According to the method of manufacturing an electronic component of claim 3, the same effect as that of claim 1 can be obtained. According to the method of manufacturing an electronic component described in claim 4,
It is highly effective in preventing the decrease in the adhesion strength of the external electrodes and preventing the external electrodes from peeling off during mounting on a printed circuit board or the like.
【００２６】請求項５記載の電子部品の製造方法によれ
ば、請求項１の効果のほか、溶存酸素と化学反応しめっ
き析出反応に影響を及ぼさない。請求項６記載の電子部
品の製造方法によれば、請求項１と同効果かある。請求
項７記載の電子部品の製造方法によれば、請求項１と同
効果がある。According to the manufacturing method of the electronic component of the fifth aspect, in addition to the effect of the first aspect, the chemical reaction with dissolved oxygen does not affect the plating deposition reaction. The electronic component manufacturing method according to the sixth aspect has the same effect as the first aspect. According to the method of manufacturing an electronic component of claim 7, the same effect as that of claim 1 can be obtained.
【図１】電子部品である積層セラミックコンデンサの断
面図である。FIG. 1 is a cross-sectional view of a monolithic ceramic capacitor that is an electronic component.
１ 誘電体セラミック ２ 内部電極 ３ 外部電極 ４ 第１の外部電極 ５ 第２の外部電極 ６ 第３の外部電極 ７ コンデンサ素子 1 Dielectric Ceramic 2 Internal Electrode 3 External Electrode 4 First External Electrode 5 Second External Electrode 6 Third External Electrode 7 Capacitor Element
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成９年５月１５日[Submission date] May 15, 1997
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００７】請求項１記載の電子部品の製造方法によれ
ば、溶存酸素を除去しためっき液を用いた湿式めっき法
により電子部品の第２の外部電極を形成することによ
り、電子部品素体と第１の外部電極の密着強度の低下を
防ぎ、内部電極との電気的接続信頼性の向上を図り、プ
リント基板等への実装時の外部電極の剥離を防ぐことが
できる。また、めっきの際電子部品素体の表面の還元が
防げるため、外部電極以外の個所に導電層は形成され
ず、外部電極間の短絡を防ぐ効果も得られる。According to the method of manufacturing an electronic component according to claim 1, the second external electrode of the electronic component is formed by a wet plating method using a plating solution from which dissolved oxygen has been removed. It is possible to prevent a decrease in adhesion strength of the first external electrode, improve reliability of electrical connection with the internal electrode, and prevent peeling of the external electrode during mounting on a printed circuit board or the like. In addition, the reduction of the surface of the electronic component body when plating
In order to prevent this , a conductive layer is not formed in a portion other than the external electrodes, and the effect of preventing a short circuit between the external electrodes can be obtained.
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１０】請求項５記載の電子部品の製造方法は、請
求項１において、ヒドラジン、トリエタノールアミン、
亜硫酸塩から選択された少なくとも一種類以上をめっき
液に添加することにより、めっき液の溶存酸素を除去す
るものである。請求項５記載の電子部品の製造方法によ
れば、請求項１と同様な効果がある。 According to a fifth aspect of the present invention, there is provided a method of manufacturing an electronic component according to the first aspect, wherein hydrazine, triethanolamine,
The dissolved oxygen in the plating solution is removed by adding at least one selected from sulfites to the plating solution. According to the method of manufacturing an electronic component of claim 5, the same effect as that of claim 1 can be obtained.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１７[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１７】この実施の形態によれば、溶存酸素を除去
しためっき液を用いた湿式めっき法により電子部品の第
２の外部電極を形成することにより、電子部品素体と第
１の外部電極の密着強度の低下を防ぎ、内部電極との電
気的接続信頼性の向上を図り、プリント基板等への実装
時の外部電極の剥離を防ぐことができる。また、めっき
の際電子部品のセラミック素体の表面の還元が防げるた
め、外部電極以外の個所に導電層は形成されず、外部電
極間の短絡を防ぐ効果も得られる。According to this embodiment, the second external electrode of the electronic component is formed by the wet plating method using the plating solution from which the dissolved oxygen is removed, so that the electronic component body and the first external electrode are formed. It is possible to prevent a decrease in adhesion strength, improve reliability of electrical connection with the internal electrode, and prevent peeling of the external electrode during mounting on a printed circuit board or the like. Also, it is possible to prevent the reduction of the surface of the ceramic body of the electronic component during plating .
Therefore , the conductive layer is not formed in a portion other than the external electrodes, and the effect of preventing a short circuit between the external electrodes can be obtained.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１８[Correction target item name] 0018
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１８】[0018]
【実施例１】この発明の実施例１として、積層セラミッ
クコンデンサの製造方法について説明する。この実施例
１は、請求項１，２，３，４，５，６および７に対応す
る。BaO-TiO2系の誘電体仮焼粉末を、バインダ、可塑
剤、溶剤とともにスラリー化し、ドクターブレード法に
より、複数の誘電体セラミックグリーンシートを作製し
た。次いで、誘電体セラミックグリーンシート上に銀ペ
ーストをスクリーン印刷法により内部電極パターン状に
形成し、積層後圧着した。次に個片に切断し、脱バイン
ダを行った後、焼成を行いコンデンサ素体を作製した。
次に、コンデンサ素体の外部電極形成領域に、銀ペース
トを塗布した後、焼結を行い、厚み２０μｍの第１の外
部電極を形成した。次に、硫酸ニッケル、塩化ニッケル
およびホウ酸の水溶液からなる電解ニッケルめっき液を
作製した。また、この電解ニッケルめっき液を基本めっ
き液にし、ヒドラジン、トリエタノールアミンおよび亜
硫酸ナトリウムを、各々適量添加した電解ニッケルめっ
き液を作製した。このように作製した電解ニッケルめっ
き液と窒素ガスおよびアルゴンガスを、各々基本めっき
液に、１０００cc／分の条件で電解めっき処理１時間前
から通気した電解ニッケルめっき液を用いて、バレルめ
っき法により、電解ニッケルめっきを行い、第１の外部
電極上に厚み２μｍのニッケル膜を形成し、第２の外部
電極を形成した。なお、電解ニッケルめっきを行なう直
前に、各電解ニッケルめっき液中の溶存酸素量を隔膜型
ガルバニ電池方式により測定した。次に第２の外部電極
上に、アルカノールスルフォン酸半田めっき液を用い
て、電解めっきにより第３の外部電極を形成した。この
様にして、外部電極を形成し積層セラミックコンデンサ
を作製した。Example 1 As Example 1 of the present invention, a method for manufacturing a monolithic ceramic capacitor will be described. The first embodiment corresponds to claims 1, 2, 3, 4, 5, 6 and 7. A plurality of dielectric ceramic green sheets were prepared by a doctor blade method using slurry of BaO-TiO 2 based calcinated powder of a dielectric material, a binder, a plasticizer, and a solvent. Next, a silver paste was formed on the dielectric ceramic green sheet in a pattern of internal electrodes by a screen printing method, laminated and then pressure-bonded. Next, the pieces were cut into pieces, the binder was removed, and then firing was performed to produce capacitor element bodies.
Next, after applying a silver paste to the external electrode forming region of the capacitor body, sintering was performed to form a first external electrode having a thickness of 20 μm. Next, an electrolytic nickel plating solution made of an aqueous solution of nickel sulfate, nickel chloride and boric acid was prepared. Further, using this electrolytic nickel plating solution as a basic plating solution, an appropriate amount of hydrazine, triethanolamine and sodium sulfite was added to prepare an electrolytic nickel plating solution. The electrolytic nickel plating solution thus prepared and the nitrogen gas and the argon gas were each subjected to barrel plating using the basic nickel plating solution and the electrolytic nickel plating solution which had been aerated for 1 hour before the electrolytic plating treatment under the conditions of 1000 cc / min. Electrolytic nickel plating was performed to form a nickel film having a thickness of 2 μm on the first external electrode to form a second external electrode. Immediately before performing electrolytic nickel plating, the amount of dissolved oxygen in each electrolytic nickel plating solution was measured by a diaphragm galvanic cell method. Next, an alkanol sulfonic acid solder plating solution was used to form a third external electrode on the second external electrode by electrolytic plating. In this way, external electrodes were formed to produce a monolithic ceramic capacitor.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２０[Correction target item name] 0020
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２０】[0020]
【表１】 [Table 1]
【手続補正６】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２４[Name of item to be corrected] 0024
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２４】[0024]
【発明の効果】請求項１記載の電子部品の製造方法によ
れば、溶存酸素を除去しためっき液を用いた湿式めっき
法により電子部品の第２の外部電極を形成することによ
り、電子部品素体と第１の外部電極の密着強度の低下を
防ぎ、内部電極との電気的接続信頼性の向上を図り、プ
リント基板等への実装時の外部電極の剥離を防ぐことが
できる。また、めっきの際電子部品素体の表面の還元が
防げるため、外部電極以外の個所に導電層は形成され
ず、外部電極間の短絡を防ぐ効果も得られる。According to the method of manufacturing an electronic component according to claim 1, the second external electrode of the electronic component is formed by a wet plating method using a plating solution from which dissolved oxygen is removed. The adhesion strength between the body and the first external electrode can be prevented from decreasing, the reliability of the electrical connection with the internal electrode can be improved, and the external electrode can be prevented from peeling off when it is mounted on a printed circuit board or the like. In addition, the reduction of the surface of the electronic component body when plating
In order to prevent this , a conductive layer is not formed in a portion other than the external electrodes, and the effect of preventing a short circuit between the external electrodes can be obtained.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 井上 竜也 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 亀山 一郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Tatsuya Inoue 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Ichiro Kameyama, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (7)
の外部電極を形成する工程と、溶存酸素を除去しためっ
き液を用いた湿式めっき法により前記第１の外部電極上
に第２の外部電極を形成する工程とを含む電子部品の製
造方法。1. A first electrode is formed in an external electrode forming region of an electronic component body.
And a step of forming a second external electrode on the first external electrode by a wet plating method using a plating solution from which dissolved oxygen has been removed.
項１記載の電子部品の製造方法。2. The method of manufacturing an electronic component according to claim 1, wherein the wet plating method is an electrolytic plating method.
求項１記載の電子部品の製造方法。3. The method of manufacturing an electronic component according to claim 1, wherein the wet plating method is an electroless plating method.
前記溶存酸素の濃度が７．０mgO ／L 以下である請求項
１記載の電子部品の製造方法。4. The method for producing an electronic component according to claim 1, wherein the concentration of the dissolved oxygen remaining in the plating solution from which the dissolved oxygen has been removed is 7.0 mgO / L or less.
硫酸塩から選択された少なくとも一種類以上をめっき液
に添加することにより、前記めっき液の溶存酸素を除去
する請求項１記載の電子部品の製造方法。5. The method for producing an electronic component according to claim 1, wherein the dissolved oxygen in the plating solution is removed by adding at least one selected from hydrazine, triethanolamine and sulfite to the plating solution.
酸素を除去する請求項１記載の電子部品の製造方法。6. The method of manufacturing an electronic component according to claim 1, wherein an inert gas is passed through the plating solution to remove the dissolved oxygen.
ス、鉛、ジルコニア、カルシウムおよびニオブの酸化物
を一種以上含むセラミック電子部品である請求項１記載
の電子部品の製造方法。7. The method for manufacturing an electronic component according to claim 1, wherein the electronic component is a ceramic electronic component containing at least one oxide of titanium, bismuth, lead, zirconia, calcium and niobium.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8128275A JPH09312236A (en) | 1996-05-23 | 1996-05-23 | Manufacture of electronic component |
| KR1019970018390A KR970076925A (en) | 1996-05-23 | 1997-05-13 | Manufacturing method of electronic component |
| SG1997001666A SG65652A1 (en) | 1996-05-23 | 1997-05-15 | Production method of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8128275A JPH09312236A (en) | 1996-05-23 | 1996-05-23 | Manufacture of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09312236A true JPH09312236A (en) | 1997-12-02 |
Family
ID=14980808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8128275A Pending JPH09312236A (en) | 1996-05-23 | 1996-05-23 | Manufacture of electronic component |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH09312236A (en) |
| KR (1) | KR970076925A (en) |
| SG (1) | SG65652A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013098533A (en) * | 2011-11-04 | 2013-05-20 | Samsung Electro-Mechanics Co Ltd | Manufacturing method for multilayer ceramic electronic component |
-
1996
- 1996-05-23 JP JP8128275A patent/JPH09312236A/en active Pending
-
1997
- 1997-05-13 KR KR1019970018390A patent/KR970076925A/en not_active Application Discontinuation
- 1997-05-15 SG SG1997001666A patent/SG65652A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013098533A (en) * | 2011-11-04 | 2013-05-20 | Samsung Electro-Mechanics Co Ltd | Manufacturing method for multilayer ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970076925A (en) | 1997-12-12 |
| SG65652A1 (en) | 1999-06-22 |
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