JPH0864029A - Paste for terminal electrode - Google Patents
Paste for terminal electrodeInfo
- Publication number
- JPH0864029A JPH0864029A JP22578294A JP22578294A JPH0864029A JP H0864029 A JPH0864029 A JP H0864029A JP 22578294 A JP22578294 A JP 22578294A JP 22578294 A JP22578294 A JP 22578294A JP H0864029 A JPH0864029 A JP H0864029A
- Authority
- JP
- Japan
- Prior art keywords
- terminal electrode
- paste
- occurrence
- low
- alumina
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の端子電極を
形成するのに使用される端子電極用ペーストに関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal electrode paste used for forming terminal electrodes of electronic parts.
【０００２】[0002]
【従来の技術】電子製品の小型化に伴い、高密度実装を
可能にするため、電子部品の小型化、表面実装化が急速
に進んでいる。積層セラミックコンデンサを例にとった
場合、小型大容量を可能にするため、セラミック層の薄
膜化や、高精度積層技術の開発等さまざまな面で改良が
施されている。2. Description of the Related Art With the miniaturization of electronic products, miniaturization and surface mounting of electronic components are rapidly advancing in order to enable high-density mounting. Taking a monolithic ceramic capacitor as an example, various improvements have been made such as thinning the ceramic layer and development of high-precision multi-layer technology in order to enable small size and large capacity.
【０００３】端子電極についても、基板への実装方法が
リフロータイプの半田付けからフロータイプの半田付け
へ移行しつつあり、半田くわれ等の実装時の不良発生を
避けるため、スズ又は半田めっきを行ったものが多くな
っている。As for the terminal electrodes, the method of mounting on the substrate is shifting from reflow type soldering to flow type soldering, and tin or solder plating is used to avoid defects such as solder cracks during mounting. There are a lot of things I have done.
【０００４】従来行われている処理は、端子電極焼付後
の素子にニッケルめっき等の前処理を行った後、スズ又
は半田めっきを行うのが一般的だが、いずれも生産コス
トの面からバレル装置を使った電解めっきの方法がとら
れている。In the conventional treatment, tin or solder plating is generally carried out after pre-treatment such as nickel plating on the element after baking of the terminal electrode, but both are barrel devices from the viewpoint of production cost. The method of electrolytic plating using is adopted.
【０００５】[0005]
【発明が解決しようとする課題】電解めっきにおいて
は、酸からなる電解浴へ素子を投入するため、ショート
や絶縁抵抗の劣下等、素子への影響が少なからず発生す
る恐れがあった。そこで端子電極と素子とを固着させる
ガラス成分について耐酸性の強い材質を用いたり、端子
電極そのものの焼結性を上げ、ボイドなどの少ない緻密
な端子電極の作製を行うことで、耐めっき処理としての
対策を行いつつあるが、端子電極の焼結性を上げようと
した場合、端子電極の収縮による応力が素子へ加わり、
クラック等が発生してしまう問題があった。In electrolytic plating, since the element is placed in an electrolytic bath made of an acid, there is a possibility that the element may be adversely affected such as a short circuit or deterioration of insulation resistance. Therefore, by using a material with strong acid resistance for the glass component that fixes the terminal electrode and the element, or by increasing the sinterability of the terminal electrode itself and making a dense terminal electrode with few voids, etc. However, when trying to improve the sinterability of the terminal electrode, stress due to contraction of the terminal electrode is applied to the element,
There was a problem that cracks and the like occurred.
【０００６】本発明の課題は、端子電極焼付時の収縮を
緩和し、かつ耐酸性もある端子電極用ペーストを提供す
ることにある。[0006] An object of the present invention is to provide a terminal electrode paste that alleviates shrinkage during terminal electrode baking and is also acid resistant.
【０００７】[0007]
【課題を解決するための手段】端子電極用ペースト中
に、耐酸性が強く、かつ端子電極を形成する低抵抗金属
や誘電セラミックやフェライト等の素子を形成する材料
と反応の少ない、ジルコニア、マグネシアおよびアルミ
ナのうちの少なくとも１種類を０.１〜２０.０重量％含
有させることで、端子電極を構成する低抵抗金属の焼結
時の収縮が緩和され、緻密な端子電極が得られる。[Means for Solving the Problems] Zirconia, magnesia, which has strong acid resistance and is less likely to react with a material forming an element such as a low resistance metal or a dielectric ceramic or ferrite forming a terminal electrode, in a paste for a terminal electrode. By containing at least one of alumina and alumina in an amount of 0.1 to 20.0% by weight, shrinkage of the low resistance metal forming the terminal electrode during sintering is relaxed, and a dense terminal electrode can be obtained.
【０００８】[0008]
【作用】ジルコニア、マグネシア、アルミナ等の無機材
料は、耐酸性が良好であり、また端子電極中の低抵抗金
属との反応が少ないので、均一に分散して添加すると、
端子電極の耐酸性が向上し、又、端子電極を構成する低
抵抗金属の急激な焼結反応を抑えて、急激な収縮を緩和
することができ、焼付け処理での収縮によるクラックの
発生が抑えられる。[Function] Inorganic materials such as zirconia, magnesia, and alumina have good acid resistance and little reaction with the low-resistance metal in the terminal electrode.
The acid resistance of the terminal electrode is improved, and the rapid shrinkage reaction of the low-resistance metal that composes the terminal electrode can be suppressed, and the rapid shrinkage can be mitigated, and the occurrence of cracks due to shrinkage during baking processing can be suppressed. To be
【０００９】[0009]
【実施例】以下に、本発明の実施例を説明する。実験に
は、チタン酸ジルコン酸鉛系のセラミックを用いた積層
セラミックコンデンサを使用した。形状は、長さ３.２
ｍｍ、幅４.５ｍｍ、厚さ２.３ｍｍで、定格電圧は２５
０Ｖ、静電容量が３.３μＦである。EXAMPLES Examples of the present invention will be described below. In the experiment, a laminated ceramic capacitor using a lead zirconate titanate-based ceramic was used. The shape is 3.2 in length
mm, width 4.5 mm, thickness 2.3 mm, rated voltage is 25
The voltage is 0 V and the capacitance is 3.3 μF.
【００１０】端子電極用ペーストは、銀７５重量％、ガ
ラス成分としてホウケイ酸鉛が３重量％、有機ビヒクル
２２重量％のペーストを調整し、ジルコニア粉末、マグ
ネシア粉末、アルミナ粉末をそれぞれペーストに対して
重量比で０.１％、１０％、２０％添加後、３本ロール
で分散させた。For the terminal electrode paste, a paste containing 75% by weight of silver, 3% by weight of lead borosilicate as a glass component and 22% by weight of an organic vehicle was prepared, and zirconia powder, magnesia powder and alumina powder were respectively added to the paste. After adding 0.1%, 10%, and 20% in weight ratio, the mixture was dispersed with three rolls.
【００１１】前記積層セラミックコンデンサを、乾燥後
の厚みで最小１００μｍを確保できるように前記のペー
ストにディップした後、７００℃×１時間で焼付を行っ
た。The monolithic ceramic capacitor was dipped in the above paste so as to ensure a minimum thickness after drying of 100 μm, and then baked at 700 ° C. for 1 hour.
【００１２】クラックの発生状況を添加材なしの場合と
比較して表１に示す。また、同試料をめっき処理を行っ
た場合のショート発生率についても、表１に示す。Table 1 shows the occurrence of cracks in comparison with the case without the additive. Table 1 also shows the short-circuit occurrence rate when the same sample was plated.
【００１３】[0013]
【表１】 [Table 1]
【００１４】表１は、ジルコニア、マグネシア、あるい
はアルミナの粉末を添加したペーストによって、積層セ
ラミックコンデンサの端子電極を形成すると、添加なし
の場合に比較して、クラック発生率、めっき後のショー
ト発生率のいずれにおいても、著しい効果のあることを
示している。Table 1 shows that when a terminal electrode of a monolithic ceramic capacitor is formed from a paste containing powder of zirconia, magnesia, or alumina, the crack generation rate and the short-circuit generation rate after plating are higher than those without the addition. In both cases, it is shown that there is a remarkable effect.
【００１５】[0015]
【発明の効果】以上、説明したとおり、ジルコニア、マ
グネシア、アルミナ等の無機材料を添加することで、端
子電極焼付時の応力発生が緩和され、クラック等の発生
がない。その結果、めっき後のショート発生率の少ない
電子部品の作製が可能となった。As described above, the addition of an inorganic material such as zirconia, magnesia, or alumina alleviates the stress generation at the time of baking a terminal electrode and does not generate cracks. As a result, it has become possible to manufacture electronic parts with a low short-circuit occurrence rate after plating.
【図１】本発明による端子電極の断面図。1 is a cross-sectional view of a terminal electrode according to the present invention.
【図２】従来の端子電極の断面図。FIG. 2 is a sectional view of a conventional terminal electrode.
１ 端子電極（添加物を含む） ２ 内部電極 １１ 端子電極 1 terminal electrode (including additives) 2 internal electrode 11 terminal electrode
Claims (2)
分等が分散した端子電極用ペーストにおいて、前記ペー
ストは添加物としてジルコニア、マグネシアおよびアル
ミナのうちの少なくとも一種類を含有していることを特
徴とする端子電極用ペースト。1. A terminal electrode paste in which a low resistance metal, a glass component and the like are dispersed in an organic vehicle, wherein the paste contains at least one of zirconia, magnesia and alumina as an additive. And the terminal electrode paste.
いて、前記添加物の含有量は、重量比で０.１〜２０.０
％であることを特徴とする端子電極用ペースト。2. The terminal electrode paste according to claim 1, wherein the content of the additive is 0.1 to 20.0 by weight.
% For terminal electrode paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22578294A JPH0864029A (en) | 1994-08-25 | 1994-08-25 | Paste for terminal electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22578294A JPH0864029A (en) | 1994-08-25 | 1994-08-25 | Paste for terminal electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0864029A true JPH0864029A (en) | 1996-03-08 |
Family
ID=16834705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22578294A Pending JPH0864029A (en) | 1994-08-25 | 1994-08-25 | Paste for terminal electrode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0864029A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086398A (en) * | 2012-10-26 | 2014-05-12 | Kyocera Corp | Electroconductive paste and circuit board as well as electronic device |
| US9039940B2 (en) | 2011-03-25 | 2015-05-26 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device, and solar cell including an electrode formed using the conductive paste |
| US9218898B2 (en) | 2011-12-09 | 2015-12-22 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste |
| US9947809B2 (en) | 2009-11-11 | 2018-04-17 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste |
| CN111096090A (en) * | 2017-09-20 | 2020-05-01 | 株式会社村田制作所 | Method for manufacturing ceramic substrate, and module |
-
1994
- 1994-08-25 JP JP22578294A patent/JPH0864029A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9947809B2 (en) | 2009-11-11 | 2018-04-17 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste |
| US9039940B2 (en) | 2011-03-25 | 2015-05-26 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device, and solar cell including an electrode formed using the conductive paste |
| US9218898B2 (en) | 2011-12-09 | 2015-12-22 | Samsung Electronics Co., Ltd. | Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste |
| JP2014086398A (en) * | 2012-10-26 | 2014-05-12 | Kyocera Corp | Electroconductive paste and circuit board as well as electronic device |
| CN111096090A (en) * | 2017-09-20 | 2020-05-01 | 株式会社村田制作所 | Method for manufacturing ceramic substrate, and module |
| US10854385B2 (en) | 2017-09-20 | 2020-12-01 | Murata Manufacturing Co., Ltd. | Method for producing ceramic substrate, ceramic substrate, and module |
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