JP4463046B2 - Ceramic electronic components and capacitors - Google Patents

Ceramic electronic components and capacitors Download PDF

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JP4463046B2
JP4463046B2 JP2004242976A JP2004242976A JP4463046B2 JP 4463046 B2 JP4463046 B2 JP 4463046B2 JP 2004242976 A JP2004242976 A JP 2004242976A JP 2004242976 A JP2004242976 A JP 2004242976A JP 4463046 B2 JP4463046 B2 JP 4463046B2
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dummy wiring
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JP2006060148A (en
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恒 佐藤
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Kyocera Corp
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本発明は、セラミック電子部品及びコンデンサに関するものである。   The present invention relates to a ceramic electronic component and a capacitor.

代表的なセラミック電子部品として、セラミックコンデンサを用いて説明する。   A typical ceramic electronic component will be described using a ceramic capacitor.

図４は、従来のセラミックコンデンサを示す横断面図である。   FIG. 4 is a cross-sectional view showing a conventional ceramic capacitor.

図において、セラミックコンデンサ３０は、複数個の誘電体層（セラミック層）３２を積層した積層体３１の内部で、隣接する誘電体層３２間に内部電極（配線導体）３３、３４を介在させるとともに、積層体３１の側面に内部電極３３、３４の端部に電気的に接続される外部電極３５、３６を形成し、外部電極３５、３６の一端を積層体３１の４つの主面に延在させている。   In the figure, a ceramic capacitor 30 includes internal electrodes (wiring conductors) 33 and 34 interposed between adjacent dielectric layers 32 in a laminated body 31 in which a plurality of dielectric layers (ceramic layers) 32 are laminated. The external electrodes 35 and 36 electrically connected to the end portions of the internal electrodes 33 and 34 are formed on the side surfaces of the multilayer body 31, and one ends of the external electrodes 35 and 36 are extended to the four main surfaces of the multilayer body 31. I am letting.

上記セラミックコンデンサ１０によれば、外部電極３５、３６は、金属成分とガラス成分を含有する。そして、焼付時に、ガラス成分が外部電極３５、３６の金属成分と、積層体３１の側面及び４つの主面との界面に集まることにより、外部電極３５、３６と積層体３１は接続される（例えば、特許文献１参照）。
特開２００２−２７０４５７号公報 According to the ceramic capacitor 10, the external electrodes 35 and 36 contain a metal component and a glass component. At the time of baking, the glass components gather at the interfaces between the metal components of the external electrodes 35 and 36 and the side surfaces and the four main surfaces of the multilayer body 31, thereby connecting the external electrodes 35 and 36 and the multilayer body 31 ( For example, see Patent Document 1).
JP 2002-270457 A

しかしながら、上記セラミックコンデンサ３０によれば、外部電極３５、３６の内、積層体３１の側面に形成された部分は、内部電極３３、３４と金属−金属結合により強固に接続しているが、積層体３１の４つの主面に形成された部分は、積層体３１との接続強度が弱いため、図５に示すように、外部からの衝撃により、剥離３７が生じやすいという問題点があった。   However, according to the ceramic capacitor 30, the portion formed on the side surface of the multilayer body 31 among the external electrodes 35 and 36 is firmly connected to the internal electrodes 33 and 34 by a metal-metal bond. The portions formed on the four main surfaces of the body 31 have a problem that peeling 37 is likely to occur due to an external impact as shown in FIG. 5 because the connection strength with the laminated body 31 is weak.

本発明は、上述の問題点に鑑みて案出されたものであり、その目的は、簡単且つ安価な方法で、外部電極の剥離を効果的に防止できるセラミック電子部品及びコンデンサを提供することにある。   The present invention has been devised in view of the above-mentioned problems, and an object of the present invention is to provide a ceramic electronic component and a capacitor that can effectively prevent peeling of external electrodes by a simple and inexpensive method. is there.

本発明は、複数個のセラミック層を積層した積層体の表面及び／又は内部に配線導体を配設するとともに、前記積層体の主面に前記配線導体と電気的に接続される外部電極を形成してなるセラミック電子部品において、前記積層体の内部に、前記外部電極に対して１層のセラミック層を隔ててダミー配線を配設するとともに、該ダミー配線及び前記外部電極間のセラミック層内に、前記ダミー配線中の金属成分と焼結によって接続され、且つ、一部が前記外部電極側に露出された複数個の金属粒子を埋設し、これら金属粒子の露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により前記外部電極を形成したことを特徴とするものである。   In the present invention, a wiring conductor is disposed on the surface and / or inside a laminated body in which a plurality of ceramic layers are laminated, and an external electrode electrically connected to the wiring conductor is formed on the main surface of the laminated body. In this ceramic electronic component, a dummy wiring is disposed inside the multilayer body with a ceramic layer separated from the external electrode, and in the ceramic layer between the dummy wiring and the external electrode. A metal which is connected to the metal component in the dummy wiring by sintering, and a plurality of metal particles partially exposed to the external electrode side are embedded, and deposited from the exposed portion of the metal particles The external electrode is formed of a metal plating film in which materials are connected to each other.

また、前記セラミック層内に存在する金属粒子の平均粒径Ａが、前記ダミー配線と前記外部電極との間に位置するセラミック層の厚みＢに対し１００％〜２００％に設定されていることを特徴とするものである。   The average particle size A of the metal particles present in the ceramic layer is set to 100% to 200% with respect to the thickness B of the ceramic layer located between the dummy wiring and the external electrode. It is a feature.

さらに、複数個の誘電体層を積層した積層体の内部で、隣接する誘電体層間に内部電極を介在させるとともに、前記積層体の側面に前記内部電極の端部に電気的に接続される外部電極を形成し、該外部電極の一端を前記積層体の主面に延在させてなるコンデンサにおいて、前記積層体の内部に、前記外部電極に対して１層の誘電体層を隔ててダミー配線を配設するとともに、該ダミー配線及び前記外部電極間の誘電体層内に、前記ダミー配線中の金属成分と焼結によって接続され、且つ、一部が前記外部電極側に露出された複数個の金属粒子を埋設し、これら金属粒子の露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により前記外部電極を形成したことを特徴とするものである。   Further, an internal electrode is interposed between adjacent dielectric layers in a multilayer body in which a plurality of dielectric layers are stacked, and an external part electrically connected to an end portion of the internal electrode on the side surface of the multilayer body In a capacitor in which an electrode is formed and one end of the external electrode extends to the main surface of the multilayer body, a dummy wiring is provided inside the multilayer body with a dielectric layer separated from the external electrode by one layer. In the dielectric layer between the dummy wiring and the external electrode, a plurality of metal components in the dummy wiring are connected by sintering and a part thereof is exposed to the external electrode side. The external electrode is formed by a metal plating film in which metal particles are embedded and metal materials deposited from the exposed portions of the metal particles are interconnected.

そして、前記誘電体層内に存在する金属粒子の平均粒径Ａが、前記ダミー配線と前記外部電極の間に位置する誘電体層の厚みＢに対し１００％〜２００％に設定されていることを特徴とするものである。   The average particle diameter A of the metal particles existing in the dielectric layer is set to 100% to 200% with respect to the thickness B of the dielectric layer located between the dummy wiring and the external electrode. It is characterized by.

本発明によれば、積層体の内部に、外部電極に対して１層のセラミック層を隔ててダミー配線を配設するとともに、ダミー配線及び外部電極間のセラミック層内に、ダミー配線中の金属成分と焼結によって接続され、且つ、一部が外部電極側に露出された複数個の金属粒子を埋設し、これら金属粒子の露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により外部電極を形成してなる。   According to the present invention, the dummy wiring is disposed inside the laminated body with the ceramic layer being separated from the external electrode, and the metal in the dummy wiring is disposed in the ceramic layer between the dummy wiring and the external electrode. Metal plating that embeds a plurality of metal particles that are connected to the components by sintering and that are partially exposed to the external electrode side, and that interconnects metal materials deposited from the exposed portions of these metal particles An external electrode is formed by a film.

すなわち、外部電極は、積層体主面において、一部が積層体内に埋設した金属粒子の露出部と強固な金属−金属結合により接合しているため、外部電極と積層体主面間の接続強度を増大させることができ、外部電極の剥離を防止できる。   That is, since the external electrode is joined to the exposed portion of the metal particles partially embedded in the laminate by a strong metal-metal bond on the main surface of the laminate, the connection strength between the external electrode and the laminate main surface is Can be increased, and peeling of the external electrode can be prevented.

また、金属粒子とダミー配線中の金属成分の接続は、焼結によってなされているため、通常の製造ラインを変更することなく、上記外部電極の剥離を防止できるとともに、金属粒子とダミー配線は一体化しており、これによっても、外部電極の剥離を効果的に防止できる。   In addition, since the metal particles and the metal components in the dummy wiring are connected by sintering, the external electrodes can be prevented from being peeled off without changing the normal production line, and the metal particles and the dummy wiring are integrated. This also effectively prevents the external electrode from peeling off.

また、金属粒子の一部がダミー配線と接合しているため、金属粒子自体が積層体内で確実に固定され、これによっても、外部電極の剥離を効果的に防止できる。さらに、外部電極とダミー配線間に配設された誘電体層と、ダミー配線間の剥離も防止できる。   Further, since some of the metal particles are bonded to the dummy wiring, the metal particles themselves are securely fixed in the laminated body, and this can also effectively prevent the external electrodes from peeling off. Furthermore, it is possible to prevent peeling between the dielectric layer disposed between the external electrode and the dummy wiring and the dummy wiring.

またさらに、外部電極が複数の金属粒子の露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により形成されているため、外部電極の厚み精度が向上するとともに、積層体を無電解メッキ用のメッキ液に所定時間浸漬しておくだけの簡単且つ安価な方法によって、外部電極を形成することができる。   Furthermore, since the external electrode is formed of a metal plating film in which metal materials deposited from the exposed portions of a plurality of metal particles are connected to each other, the thickness accuracy of the external electrode is improved and the laminate is not required. The external electrode can be formed by a simple and inexpensive method in which the electrode is immersed in a plating solution for electrolytic plating for a predetermined time.

さらにまた、セラミック層内に存在する金属粒子の平均粒径Ａが、ダミー配線と外部電極との間に位置するセラミック層の厚みＢに対し１００％〜２００％に設定されていることが望ましい。すなわち、上記金属粒子の平均粒径Ａが、セラミック層の厚みＢに対し１００％以上であるため、金属粒子がセラミック層を貫通し、ダミー配線と外部電極を確実に接合することができる。一方、上記金属粒子の平均粒径Ａが、セラミック層の厚みＢに対し２００％以下であるため、製造時に、スクリーン印刷等によりダミー配線を精度良く形成することができるとともに、積層体となるセラミック層及び配線導体を加圧加熱する際に、セラミック層間の密着性の低下が問題になることがない。   Furthermore, it is desirable that the average particle diameter A of the metal particles present in the ceramic layer is set to 100% to 200% with respect to the thickness B of the ceramic layer located between the dummy wiring and the external electrode. That is, since the average particle diameter A of the metal particles is 100% or more with respect to the thickness B of the ceramic layer, the metal particles penetrate the ceramic layer, and the dummy wiring and the external electrode can be reliably bonded. On the other hand, since the average particle diameter A of the metal particles is 200% or less with respect to the thickness B of the ceramic layer, the dummy wiring can be formed with high precision by screen printing or the like at the time of manufacture, and the ceramic that becomes the laminate When pressurizing and heating the layers and the wiring conductor, there is no problem that the adhesion between the ceramic layers is lowered.

そして、上記理由から、本発明は、複数個の誘電体層を積層した積層体の内部で、隣接する誘電体層間に内部電極を介在させるとともに、積層体の側面に内部電極の端部に電気的に接続される外部電極を形成し、外部電極の一端を前記積層体の主面に延在させてなるコンデンサに特に好適である。   For the reasons described above, the present invention interposes an internal electrode between adjacent dielectric layers in a laminated body in which a plurality of dielectric layers are laminated, and electrically connects the end of the internal electrode to the side surface of the laminated body. It is particularly suitable for a capacitor in which external electrodes to be connected are formed, and one end of the external electrode is extended to the main surface of the laminate.

以下、本発明を添付図面に基づいて詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

図１は、本発明の一実施形態に係るセラミックコンデンサを示す図であり、（ａ）は外観斜視図、（ｂ）は横断面図である。図２は、図１のセラミックコンデンサの製造方法を示す断面図である。   1A and 1B are diagrams showing a ceramic capacitor according to an embodiment of the present invention, in which FIG. 1A is an external perspective view, and FIG. 1B is a cross-sectional view. FIG. 2 is a cross-sectional view showing a method for manufacturing the ceramic capacitor of FIG.

図において、セラミックコンデンサ１０は、複数個の誘電体層（セラミック層）２を積層した積層体１の内部で、隣接する誘電体層２間に内部電極（配線導体）３、４を介在させるとともに、積層体１の側面に内部電極３、４の端部に電気的に接続される外部電極５、６を形成し、外部電極５、６の一端を積層体１の４つの主面に延在させている。   In the figure, a ceramic capacitor 10 includes internal electrodes (wiring conductors) 3 and 4 interposed between adjacent dielectric layers 2 in a laminated body 1 in which a plurality of dielectric layers (ceramic layers) 2 are laminated. The external electrodes 5 and 6 electrically connected to the end portions of the internal electrodes 3 and 4 are formed on the side surfaces of the multilayer body 1, and one ends of the external electrodes 5 and 6 are extended to the four main surfaces of the multilayer body 1. I am letting.

誘電体層２は、例えば、ＢａＴｉＯ３、ＣａＴｉＯ３、ＳｒＴｉＯ３等を主成分とする誘電体材料によって１層あたり０．５μｍ〜２μｍの厚みに形成されており、かかる誘電体層２を、セラミックコンデンサ１０の実装面に垂直な方向に、例えば２０層〜２０００層だけ積層することによって積層体１が形成される。 The dielectric layer 2 is formed to a thickness of 0.5 μm to 2 μm per layer by a dielectric material mainly composed of, for example, BaTiO 3 , CaTiO 3 , SrTiO 3, and the like. The stacked body 1 is formed by stacking, for example, 20 to 2000 layers in a direction perpendicular to the mounting surface of the capacitor 10.

内部電極３ａ、４ａは、Ｎｉ、Ｃｕ、Ｃｕ−Ｎｉ、Ａｇ−Ｐｄ等の金属を主成分とする導体材料によって、例えば０．５μｍ〜２．０μｍの厚みに形成されている。   The internal electrodes 3a and 4a are formed to a thickness of, for example, 0.5 μm to 2.0 μm by using a conductive material whose main component is a metal such as Ni, Cu, Cu—Ni, or Ag—Pd.

本発明において重要なことは、積層体１の内部に、外部電極５、６に対して１層の誘電体層２を隔ててダミー配線３ｂ、４ｂ（配線導体）を配設するとともに、ダミー配線３ｂ、４ｂ及び外部電極５、６間の誘電体層２内に、ダミー配線３ｂ、４ｂ中の金属成分と焼結によって接続され、且つ、一部が外部電極５、６側に露出された複数個の金属粒子Ｍを埋設する点である。図中、内部電極３ａ、４ａとダミー電極３ｂ、４ｂを合わせて配線導体３、４としている。ダミー電極３ｂ、４ｂは、内部電極３ａ、４ａと同じ導体材料であっても良く、異なる導体材料であっても良い。また、金属粒子Ｍは、ダミー電極３ｂ、４ｂ中の他の小さな金属粒子（金属微粒子）ｍと同じ金属でも良く、異なる金属でも良い。さらに図中、ダミー電極３ｂ、４ｂは積層体１の一方の主面側に２層配設されているが、１層以上であれば何層でも良い。ダミー電極３ｂ、４ｂの数が多い程、外部電極５、６と積層体１主面間の接続強度を増大させることができ、外部電極５、６の剥離を防止できる。また図中、隣接するダミー電極（３ｂ−３ｂ、４ｂ−４ｂ）間に跨るように複数個の金属粒子Ｍを埋設しているが、このような金属粒子Ｍは特に埋設しなくても良い。   What is important in the present invention is that the dummy wirings 3b and 4b (wiring conductors) are disposed inside the multilayer body 1 with the dielectric layer 2 being separated from the external electrodes 5 and 6, and the dummy wirings. In the dielectric layer 2 between 3b and 4b and the external electrodes 5 and 6, a plurality of metal components in the dummy wirings 3b and 4b are connected by sintering and a part is exposed to the external electrodes 5 and 6 side. This is a point in which individual metal particles M are embedded. In the figure, the internal electrodes 3a, 4a and the dummy electrodes 3b, 4b are combined to form the wiring conductors 3, 4. The dummy electrodes 3b and 4b may be the same conductive material as the internal electrodes 3a and 4a, or may be different conductive materials. The metal particles M may be the same metal as other small metal particles (metal fine particles) m in the dummy electrodes 3b and 4b, or may be different metals. Further, in the drawing, two layers of the dummy electrodes 3b and 4b are arranged on one main surface side of the laminate 1, but any number of layers may be used as long as it is one or more layers. As the number of dummy electrodes 3b and 4b increases, the connection strength between the external electrodes 5 and 6 and the main surface of the multilayer body 1 can be increased, and peeling of the external electrodes 5 and 6 can be prevented. Further, in the drawing, a plurality of metal particles M are embedded so as to straddle between adjacent dummy electrodes (3b-3b, 4b-4b). However, such metal particles M may not be embedded.

さらに、外部電極５、６は、これら金属粒子Ｍの露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により形成されている。   Further, the external electrodes 5 and 6 are formed of a metal plating film in which metal materials deposited from the exposed portions of the metal particles M are connected to each other.

そして、誘電体層２内に存在する金属粒子Mの粒径Ａが、ダミー配線３ｂ、４ｂと外部電極５、６の延在部の間に位置する誘電体層２の厚みＢに対し１００％〜２００％に設定されている。ここで、金属粒子Mの粒径Ａは、焼成後の積層体１の破断面をケミカルエッチングした後、金属顕微鏡により確認できる。   The particle size A of the metal particles M existing in the dielectric layer 2 is 100% of the thickness B of the dielectric layer 2 located between the dummy wirings 3b and 4b and the extended portions of the external electrodes 5 and 6. It is set to ~ 200%. Here, the particle size A of the metal particles M can be confirmed with a metal microscope after the fracture surface of the fired laminate 1 is chemically etched.

このとき、ダミー配線３ｂ、４ｂ及び外部電極５、６間の誘電体層２内、あるいはダミー配線３ｂ、４ｂ間の誘電体層２内に、１個または２個の金属粒子Ｍが存在することとなる。これにより、金属粒子全体として不定形状となり、外部衝撃などにより誘電体層２から抜け落ちることはない。   At this time, one or two metal particles M exist in the dielectric layer 2 between the dummy wirings 3b and 4b and the external electrodes 5 and 6 or in the dielectric layer 2 between the dummy wirings 3b and 4b. It becomes. As a result, the entire metal particle has an indefinite shape and does not fall off the dielectric layer 2 due to external impact or the like.

以下、上述したセラミックコンデンサ１０の製造方法について説明する。なお、図中の各符号は焼成の前後で区別しないこととする。   Hereinafter, a method for manufacturing the above-described ceramic capacitor 10 will be described. In addition, each code | symbol in a figure shall not distinguish before and after baking.

まず、ＢａＴｉＯ３、ＣａＴｉＯ３、ＳｒＴｉＯ３等を主成分とする誘電体材料の粉末に適当な有機溶剤、ガラスフリット、有機バインダ等を添加・混合して泥漿状のセラミックスラリを作製するとともに、得られたセラミックスラリを従来周知のドクターブレード法等による、所定形状、所定厚みの誘電体層となるセラミックグリーンシート２を形成する。 First, an appropriate organic solvent, glass frit, organic binder, and the like are added to and mixed with a dielectric material powder mainly composed of BaTiO 3 , CaTiO 3 , SrTiO 3, etc. to produce a slurry ceramic slurry. A ceramic green sheet 2 to be a dielectric layer having a predetermined shape and a predetermined thickness is formed from the ceramic slurry thus obtained by a conventionally known doctor blade method or the like.

次に、セラミックグリーンシート２上に、Ｎｉ、Ｃｕ、Ｃｕ−Ｎｉ、Ａｇ−Ｐｄ等の金属材料の粉末に適当な有機溶剤、有機バインダ等を添加・混合して得た導体ペーストを従来周知のスクリーン印刷等によって所定パターンに塗布し、配線導体となる導体パターン３、４を形成する。このとき、図２（ａ）に示すように、ダミー電極となる導体ペースト３ｂ、４ｂ中に、粒径の大きな金属粒子Ｍを混合しておく。具体的には、セラミックグリーンシート２の厚みが０．５μｍ〜１μｍである場合、金属粒子Ｍの平均粒径は０．５μｍ〜２μｍ、その他の金属粒子ｍの平均粒径は０．１μｍ〜０．３μｍの範囲にあることが望ましい。一方、セラミックグリーンシート２の厚みが１μｍ〜２μｍである場合、金属粒子Ｍの平均粒径は１〜４μｍ、その他の金属微粒子ｍの平均粒径は０．３μｍ〜０．５μｍの範囲にあることが望ましい。また、セラミックグリーンシート２の厚みが２μｍ〜３μｍである場合、金属粒子Ｍの平均粒径は２〜６μｍ、金属微粒子ｍの平均粒径は０．４μｍ〜０．６μｍの範囲にあることが望ましい。そして、セラミックグリーンシート２の厚みが３μｍ〜４μｍである場合、金属粒子Ｍの平均粒径は３μｍ〜８μｍ、金属微粒子ｍの平均粒径は０．５μｍ〜０．１μｍの範囲にあることが望ましい。   Next, a conductive paste obtained by adding and mixing an appropriate organic solvent, an organic binder, etc. to a powder of a metal material such as Ni, Cu, Cu—Ni, Ag—Pd, etc. on the ceramic green sheet 2 is conventionally known. A predetermined pattern is applied by screen printing or the like to form conductor patterns 3 and 4 to be wiring conductors. At this time, as shown in FIG. 2A, metal particles M having a large particle diameter are mixed in the conductor pastes 3b and 4b serving as dummy electrodes. Specifically, when the thickness of the ceramic green sheet 2 is 0.5 μm to 1 μm, the average particle size of the metal particles M is 0.5 μm to 2 μm, and the average particle size of the other metal particles m is 0.1 μm to 0 μm. Desirably, it is in the range of 3 μm. On the other hand, when the thickness of the ceramic green sheet 2 is 1 μm to 2 μm, the average particle size of the metal particles M is in the range of 1 to 4 μm, and the average particle size of the other metal fine particles m is in the range of 0.3 μm to 0.5 μm. Is desirable. Further, when the thickness of the ceramic green sheet 2 is 2 μm to 3 μm, it is desirable that the average particle diameter of the metal particles M is 2 to 6 μm and the average particle diameter of the metal fine particles m is in the range of 0.4 μm to 0.6 μm. . When the thickness of the ceramic green sheet 2 is 3 μm to 4 μm, the average particle size of the metal particles M is preferably 3 μm to 8 μm, and the average particle size of the metal fine particles m is preferably in the range of 0.5 μm to 0.1 μm. .

次に、図２（ｂ）に示すように、導体パターン３、４が形成されたセラミックグリーンシート２を所定の枚数だけ積層する。   Next, as shown in FIG. 2B, a predetermined number of ceramic green sheets 2 on which conductor patterns 3 and 4 are formed are stacked.

次に、積層された導体パターン３、４及びセラミックグリーンシート２を加圧加熱することにより、大型積層体１１が得られる。このとき、図２（ｃ）に示すように、ダミー配線となる導体パターン３ｂ、４ｂ中に、金属粒子となる金属粒子Ｍが含有されるため、金属粒子Ｍがセラミックグリーンシート２を突き破って、大型積層体１１表面に露出する。また、金属粒子Ｍにより突き破られるセラミックグリーンシート２は、その他のセラミックグリーンシート２に比べ、やわらかいことが望ましい。   Next, the large laminated body 11 is obtained by pressurizing and heating the laminated conductor patterns 3 and 4 and the ceramic green sheet 2. At this time, as shown in FIG. 2 (c), since the metal particles M serving as metal particles are contained in the conductor patterns 3b and 4b serving as dummy wirings, the metal particles M break through the ceramic green sheet 2, It is exposed on the surface of the large laminate 11. Moreover, it is desirable that the ceramic green sheet 2 pierced by the metal particles M is softer than the other ceramic green sheets 2.

次に、図２（ｂ）に示すように、導体パターン３、４が形成されたセラミックグリーンシート２を所定の枚数だけ積層する。   Next, as shown in FIG. 2B, a predetermined number of ceramic green sheets 2 on which conductor patterns 3 and 4 are formed are stacked.

次に、積層された導体パターン３、４及びセラミックグリーンシート２を加圧加熱することにより、大型積層体１１が得られる。このとき、図２（ｃ）に示すように、ダミー電極となる導体パターン３ｂ、４ｂ中に、粒径の大きな金属粒子Ｍが含有されるため、金属粒子Ｍがセラミックグリーンシート２を突き破って、大型積層体１１表面に露出したり、隣接するダミー電極となる導体パターン（３ｂ−３ｂ、４ｂ−４ｂ）に跨る。また、金属粒子Ｍにより突き破られるセラミックグリーンシート２は、その他のセラミックグリーンシート２に比べ、圧力変形が容易でやわらかいこと、あるいは熱可塑性のセラミックグリーンシート２であることが望ましい。   Next, the large laminated body 11 is obtained by pressurizing and heating the laminated conductor patterns 3 and 4 and the ceramic green sheet 2. At this time, as shown in FIG. 2 (c), since the metal particles M having a large particle diameter are contained in the conductor patterns 3b and 4b serving as dummy electrodes, the metal particles M break through the ceramic green sheet 2, It is exposed on the surface of the large laminate 11 or straddles a conductor pattern (3b-3b, 4b-4b) that becomes an adjacent dummy electrode. In addition, the ceramic green sheet 2 to be pierced by the metal particles M is desirably easier to be pressure-deformed and softer than the other ceramic green sheets 2 or is a thermoplastic ceramic green sheet 2.

次に、大型積層体１１を所定の寸法で切断することにより、未焼成状態の積層体１が得られる。   Next, the large-sized laminated body 11 is cut | disconnected by a predetermined dimension, and the laminated body 1 of an unbaking state is obtained.

次に、得られた未焼成状態の積層体１を例えば１１００℃〜１４００℃の温度で焼成することにより、積層体１が得られる。このとき、焼成後の積層体１をバレル研磨することにより、積層体１内に埋設した複数の金属粒子Ｍの一部を積層体１の表面に露出させることができる。   Next, the laminated body 1 is obtained by firing the obtained unfired laminated body 1 at a temperature of 1100 ° C. to 1400 ° C., for example. At this time, a part of the plurality of metal particles M embedded in the laminate 1 can be exposed on the surface of the laminate 1 by barrel polishing the laminate 1 after firing.

次に、積層体１の一対の端面に、無電解メッキ法により、外部電極５、６を形成する。具体的には、積層体１の端面における内部電極３ａ、４ａの露出部、及び図２（ｄ）に示すように、積層体１の主面における金属粒子Ｍの露出部を起点として、Ｃｕ、Ｎｉ、Ａｇ、Ａｕなどの金属メッキ膜５、６を析出させるとともに、これらの析出物同士を相互に連結させることによって一体的に形成される。この場合、外部電極５、６の厚み精度が向上するとともに、積層体１を無電解メッキ用のメッキ液に所定時間浸漬しておくだけの簡単な加工によって外部電極５、６を所望するパターンに形成することができ、セラミックコンデンサ１０の生産性向上に供することが可能である。このとき、上記無電解メッキ法による金属メッキ膜５、６を析出させた積層体１に熱処理(アニール)を施すことにより、金属粒子Ｍと金属メッキ膜５、６の境界に合金層を形成させ、金属粒子Ｍと金属メッキ膜５、６の接合強度をさらに向上させるようにしても良い。具体的には、金属粒子ＭがＮｉ、金属メッキ膜５、６がＣｕである場合は、約６００℃で熱処理することが望ましい。また、必要に応じて、Ｃｕ、Ｎｉ、Ａｇ、Ａｕなどの金属メッキ膜の表面に、Ｎｉメッキ膜、Ｓｎメッキ膜など（図示せず）を電解メッキ法により形成しても良い。このとき、上記熱処理は、これらのＮｉメッキ膜、Ｓｎメッキ膜などを形成する前に施す必要がある。   Next, external electrodes 5 and 6 are formed on the pair of end faces of the laminate 1 by electroless plating. Specifically, as shown in FIG. 2D, the exposed portions of the internal electrodes 3a, 4a on the end face of the multilayer body 1 and the exposed portions of the metal particles M on the main surface of the multilayer body 1, Cu, The metal plating films 5 and 6 such as Ni, Ag, and Au are deposited, and these precipitates are connected to each other to be integrally formed. In this case, the thickness accuracy of the external electrodes 5 and 6 is improved, and the external electrodes 5 and 6 are formed into a desired pattern by simple processing by simply immersing the laminate 1 in a plating solution for electroless plating for a predetermined time. Therefore, it is possible to improve the productivity of the ceramic capacitor 10. At this time, a heat treatment (annealing) is performed on the laminate 1 on which the metal plating films 5 and 6 are deposited by the electroless plating method, thereby forming an alloy layer at the boundary between the metal particles M and the metal plating films 5 and 6. The bonding strength between the metal particles M and the metal plating films 5 and 6 may be further improved. Specifically, when the metal particles M are Ni and the metal plating films 5 and 6 are Cu, it is desirable to perform heat treatment at about 600 ° C. If necessary, a Ni plating film, a Sn plating film, or the like (not shown) may be formed on the surface of a metal plating film such as Cu, Ni, Ag, or Au by an electrolytic plating method. At this time, it is necessary to perform the heat treatment before forming these Ni plating film, Sn plating film and the like.

このようにして、図１に示すようなセラミックコンデンサ１０が得られる。   In this way, a ceramic capacitor 10 as shown in FIG. 1 is obtained.

かくして、本発明によれば、積層体１の内部に、外部電極５、６に対して１層の誘電体層２を隔ててダミー配線３ｂ、４ｂを配設するとともに、ダミー配線３ｂ、４ｂ及び外部電極５、６間の誘電体層２内に、ダミー配線３ａ、４ａ中の金属成分と焼結によって接続され、且つ、一部が外部電極５、６側に露出された複数個の金属粒子Ｍを埋設し、これら金属粒子Ｍの露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により外部電極５、６を形成してなるため、外部電極５、６は、積層体１の主面において、一部が積層体１内に埋設された金属粒子Ｍの露出部と強固な金属−金属結合により接合していることから、外部電極５、６と積層体１主面間の接続強度を増大させることができ、外部電極５、６の剥離３７を防止できる。   Thus, according to the present invention, the dummy wirings 3b and 4b are disposed inside the multilayer body 1 with the dielectric layer 2 being separated from the external electrodes 5 and 6, and the dummy wirings 3b and 4b. In the dielectric layer 2 between the external electrodes 5 and 6, a plurality of metal particles are connected to the metal components in the dummy wirings 3a and 4a by sintering, and a part thereof is exposed to the external electrodes 5 and 6 side. Since the external electrodes 5 and 6 are formed by metal plating films in which M is embedded and the metal materials deposited from the exposed portions of the metal particles M are connected to each other, the external electrodes 5 and 6 are laminated bodies. 1 is partially bonded to the exposed portion of the metal particles M embedded in the laminate 1 by a strong metal-metal bond, so that the space between the external electrodes 5 and 6 and the laminate 1 main surface is The connection strength of the external electrodes 5 and 6 can be increased and the peeling 37 of the external electrodes 5 and 6 can be prevented. .

また、金属粒子Ｍとダミー配線３ｂ、４ｂ中の金属成分の接続は、焼結によってなされているため、通常の製造ラインを変更することなく、上記外部電極５、６の剥離３７を防止することができ、金属粒子Ｍとダミー配線３ｂ、４ｂは一体化しており、これによっても、外部電極５、６の剥離３７を有効に防止することができる。   Further, since the metal particles M and the metal components in the dummy wirings 3b and 4b are connected by sintering, the separation 37 of the external electrodes 5 and 6 can be prevented without changing the normal production line. The metal particles M and the dummy wirings 3b and 4b are integrated, and this also effectively prevents the separation 37 of the external electrodes 5 and 6.

また、金属粒子Ｍの一部がダミー配線３ｂ、４ｂと接合しているため、金属粒子Ｍ自体が積層体１内で確実に固定され、これによっても、外部電極５、６の剥離３７を効果的に防止できる。さらに、外部電極５、６とダミー配線３ｂ、４ｂ間に配設された誘電体層２と、ダミー配線３ｂ、４ｂ間の剥離も有効に防止することができる。   In addition, since a part of the metal particles M are bonded to the dummy wirings 3b and 4b, the metal particles M themselves are securely fixed in the laminated body 1, and this also effectively removes the external electrodes 5 and 6. Can be prevented. Further, the separation between the dielectric layers 2 disposed between the external electrodes 5 and 6 and the dummy wirings 3b and 4b and the dummy wirings 3b and 4b can be effectively prevented.

そして、誘電体層２内に存在する金属粒子Ｍの平均粒径Ａが、ダミー配線３ｂ、４ｂと外部電極５、６との間に位置する誘電体層２の厚みＢに対し１００％〜２００％に設定されていることが望ましい。すなわち、上記金属粒子Ｍの平均粒径Ａが、誘電体層２の厚みＢに対し１００％以上であるため、金属粒子Ｍが誘電体層２を貫通し、ダミー配線３ｂ、４ｂと外部電極５、６を確実に接合することができる。一方、上記金属粒子Ｍの平均粒径Ａが、誘電体層２の厚みＢに対し２００％以下であるため、製造時に、スクリーン印刷等によりダミー配線となる導体パターン３ｂ、４ｂを精度良く形成することができるとともに、大型積層体１１となるセラミックグリーンシート２及び導体パターン３、４を加圧・加熱する際に、セラミックグリーンシート２間の密着性が低下するのを有効に防止することができる。   The average particle size A of the metal particles M present in the dielectric layer 2 is 100% to 200% with respect to the thickness B of the dielectric layer 2 located between the dummy wirings 3b and 4b and the external electrodes 5 and 6. % Is desirable. That is, since the average particle diameter A of the metal particles M is 100% or more with respect to the thickness B of the dielectric layer 2, the metal particles M penetrate the dielectric layer 2, and the dummy wirings 3b and 4b and the external electrode 5 , 6 can be reliably joined. On the other hand, since the average particle diameter A of the metal particles M is 200% or less with respect to the thickness B of the dielectric layer 2, the conductor patterns 3b and 4b serving as dummy wirings are accurately formed by screen printing or the like at the time of manufacture. In addition, it is possible to effectively prevent the adhesion between the ceramic green sheets 2 from being lowered when the ceramic green sheet 2 and the conductor patterns 3 and 4 to be the large laminate 11 are pressed and heated. .

なお、本発明は上述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。   Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the scope of the present invention.

例えば、上記実施の形態では、セラミック電子部品としてセラミックコンデンサを用いて説明したが、本発明は、積層圧電部品、回路基板、半導体部品等、あらゆるセラミック電子部品に用いることができる。   For example, in the above embodiment, the ceramic capacitor is used as the ceramic electronic component. However, the present invention can be used for any ceramic electronic component such as a laminated piezoelectric component, a circuit board, and a semiconductor component.

また図３は、本発明の他の実施形態に係るセラミック電子部品を示す横断面図である。同図に示すように、本発明のセラミック電子部品１０は、回路基板１０にも適用できる。また、外部電極５は、積層体１の側面から離間させても良い。さらに、外部電極５やダミー配線３ｂより寸法の大きいダミー配線４ｂを埋設するとともに、ダミー配線３ｂとダミー配線４ｂとを両者間のセラミック層２内に存在する金属粒子Ｍを介して接続するようにしても良い。これにより、外部電極５と積層体１の主面との間の接続強度をさらに増大させることができ、外部電極５の剥離をさらに効果的に防止できる。なおこのとき、ダミー配線４ｂとなる導体ペースト中に金属粒子Ｍを含有すると、ダミー配線３ｂの外側に金属粒子Ｍがはみ出てしまうため、ダミー配線３ｂとダミー配線４ｂは、ダミー配線３ｂとなる導体ペースト中に含有される金属粒子Ｍにより接続されるようにする。また図中、３ａは内部配線導体、７はビアホール導体、８は他の電子部品である。   FIG. 3 is a cross-sectional view showing a ceramic electronic component according to another embodiment of the present invention. As shown in the figure, the ceramic electronic component 10 of the present invention can also be applied to a circuit board 10. Further, the external electrode 5 may be separated from the side surface of the multilayer body 1. Further, the dummy wiring 4b having a size larger than that of the external electrode 5 and the dummy wiring 3b is embedded, and the dummy wiring 3b and the dummy wiring 4b are connected via the metal particles M existing in the ceramic layer 2 therebetween. May be. Thereby, the connection intensity | strength between the external electrode 5 and the main surface of the laminated body 1 can further be increased, and peeling of the external electrode 5 can be prevented further effectively. At this time, if the metal paste M is contained in the conductor paste that becomes the dummy wiring 4b, the metal particles M protrude outside the dummy wiring 3b. Therefore, the dummy wiring 3b and the dummy wiring 4b are conductors that become the dummy wiring 3b. The metal particles M contained in the paste are connected. In the figure, 3a is an internal wiring conductor, 7 is a via-hole conductor, and 8 is another electronic component.

さらに、ダミー配線３ｂ、４ｂ中に、誘電体層２と略同一のセラミック粒子が含有されるようにしても良い。すなわち、セラミック粒子が、ダミー配線３ｂ、４ｂを挟んでいる誘電体層２間の架橋となるため、これによっても、誘電体層２とダミー配線３ｂ、４ｂ間の剥離を防止できる。   Furthermore, the dummy wirings 3b and 4b may contain ceramic particles substantially the same as those of the dielectric layer 2. That is, since the ceramic particles serve as a bridge between the dielectric layers 2 sandwiching the dummy wirings 3b and 4b, it is possible to prevent peeling between the dielectric layer 2 and the dummy wirings 3b and 4b.

本発明の一実施形態に係るセラミックコンデンサを示す図であり、（ａ）は外観斜視図、（ｂ）は横断面図である。It is a figure which shows the ceramic capacitor which concerns on one Embodiment of this invention, (a) is an external appearance perspective view, (b) is a cross-sectional view. 図１のセラミックコンデンサの製造方法を説明するための断面図である。It is sectional drawing for demonstrating the manufacturing method of the ceramic capacitor of FIG. 本発明の他の実施形態に係るセラミック電子部品を示す横断面図である。It is a cross-sectional view showing a ceramic electronic component according to another embodiment of the present invention. 従来のセラミックコンデンサを示す横断面図である。It is a cross-sectional view showing a conventional ceramic capacitor.

符号の説明Explanation of symbols

１０・・・セラミック電子部品（コンデンサ）
１・・・積層体
２・・・誘電体層（セラミック層）
３、４・・・配線導体
３ａ、４ａ・・・内部電極
３ｂ、４ｂ・・・ダミー配線（ダミー電極）
５、６・・・外部電極（外部端子電極）
Ｍ・・・金属粒子 10 ... Ceramic electronic components (capacitors)
DESCRIPTION OF SYMBOLS 1 ... Laminated body 2 ... Dielectric layer (ceramic layer)
3, 4 ... wiring conductor 3a, 4a ... internal electrode 3b, 4b ... dummy wiring (dummy electrode)
5, 6 ... External electrode (external terminal electrode)
M ... Metal particles

Claims (4)

複数個のセラミック層を積層した積層体の表面及び／又は内部に配線導体を配設するとともに、前記積層体の主面に前記配線導体と電気的に接続される外部電極を形成してなるセラミック電子部品において、
前記積層体の内部に、前記外部電極に対して１層のセラミック層を隔ててダミー配線を配設するとともに、該ダミー配線及び前記外部電極間のセラミック層内に、前記ダミー配線中の金属成分と焼結によって接続され、且つ、一部が前記外部電極側に露出された複数個の金属粒子を埋設し、これら金属粒子の露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により前記外部電極を形成したことを特徴とするセラミック電子部品。 A ceramic in which a wiring conductor is disposed on the surface and / or inside of a laminate in which a plurality of ceramic layers are laminated, and an external electrode electrically connected to the wiring conductor is formed on the main surface of the laminate. In electronic components,
Inside the laminate, a dummy wiring is disposed with a ceramic layer separated from the external electrode, and a metal component in the dummy wiring is formed in the ceramic layer between the dummy wiring and the external electrode. A metal plating in which a plurality of metal particles, which are connected by sintering and are partially exposed to the external electrode side, are embedded, and metal materials deposited from the exposed portions of the metal particles are interconnected. A ceramic electronic component, wherein the external electrode is formed of a film. 前記セラミック層内に存在する金属粒子の平均粒径Ａが、前記ダミー配線と前記外部電極との間に位置するセラミック層の厚みＢに対し１００％〜２００％に設定されていることを特徴とする請求項１に記載のセラミック電子部品。 The average particle diameter A of the metal particles existing in the ceramic layer is set to 100% to 200% with respect to the thickness B of the ceramic layer located between the dummy wiring and the external electrode. The ceramic electronic component according to claim 1. 複数個の誘電体層を積層した積層体の内部で、隣接する誘電体層間に内部電極を介在させるとともに、前記積層体の側面に前記内部電極の端部に電気的に接続される外部電極を形成し、該外部電極の一端を前記積層体の主面に延在させてなるコンデンサにおいて、
前記積層体の内部に、前記外部電極に対して１層の誘電体層を隔ててダミー配線を配設するとともに、該ダミー配線及び前記外部電極間の誘電体層内に、前記ダミー配線中の金属成分と焼結によって接続され、且つ、一部が前記外部電極側に露出された複数個の金属粒子を埋設し、これら金属粒子の露出部を起点に析出させた金属材料を相互に連結した金属メッキ膜により前記外部電極を形成したことを特徴とするコンデンサ。 An internal electrode is interposed between adjacent dielectric layers in a multilayer body in which a plurality of dielectric layers are stacked, and an external electrode electrically connected to an end portion of the internal electrode is provided on a side surface of the multilayer body. In a capacitor formed and extending one end of the external electrode to the main surface of the laminate,
A dummy wiring is disposed inside the stacked body with a dielectric layer separated from the external electrode by a single dielectric layer, and in the dielectric layer between the dummy wiring and the external electrode, A plurality of metal particles that are connected to the metal component by sintering and that are partly exposed to the external electrode side are embedded, and the metal materials deposited from the exposed portions of the metal particles are interconnected. A capacitor characterized in that the external electrode is formed of a metal plating film. 前記誘電体層内に存在する金属粒子の平均粒径Ａが、前記ダミー配線と前記外部電極の間に位置する誘電体層の厚みＢに対し１００％〜２００％に設定されていることを特徴とする請求項３に記載のコンデンサ。 The average particle diameter A of the metal particles existing in the dielectric layer is set to 100% to 200% with respect to the thickness B of the dielectric layer located between the dummy wiring and the external electrode. The capacitor according to claim 3.
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