JPH0859985A - Phenolic resin composition - Google Patents

Phenolic resin composition

Info

Publication number
JPH0859985A
JPH0859985A JP19879794A JP19879794A JPH0859985A JP H0859985 A JPH0859985 A JP H0859985A JP 19879794 A JP19879794 A JP 19879794A JP 19879794 A JP19879794 A JP 19879794A JP H0859985 A JPH0859985 A JP H0859985A
Authority
JP
Japan
Prior art keywords
cured product
phenol resin
phenolic resin
parts
resin cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19879794A
Other languages
Japanese (ja)
Inventor
Shunsuke Otani
俊介 大谷
Tomonori Kenmochi
友規 剱持
Yukio Tokunaga
幸雄 徳永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Durez Co Ltd filed Critical Sumitomo Durez Co Ltd
Priority to JP19879794A priority Critical patent/JPH0859985A/en
Publication of JPH0859985A publication Critical patent/JPH0859985A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain the subject composition retaining the excellent characteristics of polyamides as one of its component, also excellent in flame retardancy, heat resistance and water resistance, useful for fibers, etc., by melt mixing a powdered phenolic resin cured product with a polyamide in specific proportions. CONSTITUTION: This resin composition is obtained by melt mixing (A) 100 pts.wt. of a polyamide with (B) 5-50 pts.wt. of a powdered phenolic resin cured product (pref. with an acetone extraction rate of <=10% and a particle diameter of 1-100μm). It is preferable that the component B be obtained by blending a novolak-type phenolic resin with a curing agent followed by curing under heating, or by curing a resol-type phenolic resin under heating or using an acid.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ポリアミドの持ってい
る熱可塑性樹脂としての特性を損う事なく、かつフェノ
ール樹脂の優れた特長を活かして、良好な難燃性、耐水
性、耐熱性および耐衝撃性などを与えるフェノール樹脂
組成物に関するもので、射出成形等により得られる各種
成形品、押出し成形等により得られる用途に対して有用
である。
[Field of Industrial Application] The present invention does not impair the properties of polyamide as a thermoplastic resin, and makes good use of the excellent characteristics of phenol resin, and has good flame resistance, water resistance, and heat resistance. The present invention also relates to a phenol resin composition that gives impact resistance and the like, and is useful for various molded articles obtained by injection molding and the like, and applications obtained by extrusion molding and the like.

【0002】[0002]

【従来の技術】一般にポリアミドは、他の熱可塑性樹脂
に比べて機械的性質、熱的性質および化学的性質に優れ
ており、繊維を始め、自動車関連部品、電気・通信機器
部品、一般機械部品および雑貨・スポーツ用品など広範
な分野に使用されている。特に耐衝撃強度は他の熱可塑
性樹脂と比較して非常に大きく、また耐摩耗性について
はフェノール樹脂や軟鋼などと比較しても優れている。
しかし、ポリアミドは結晶性樹脂であるため成形収縮率
が大きく、また吸水性が大きいため電気的性質は特に優
れているとは言えないし、難燃性や耐熱性などにも問題
がある。
2. Description of the Related Art Generally, polyamide is superior to other thermoplastic resins in mechanical properties, thermal properties and chemical properties, and is used for fibers, automobile parts, electric / communication equipment parts, general mechanical parts. It is also used in a wide range of fields such as sundries and sporting goods. In particular, it has a very high impact resistance as compared with other thermoplastic resins, and has excellent abrasion resistance as compared with phenolic resins and mild steel.
However, since polyamide is a crystalline resin, it has a large molding shrinkage, and since it has a large water absorption, it cannot be said that it has particularly excellent electrical properties, and there are problems in flame retardancy and heat resistance.

【0003】そこで、例えば難燃性、耐熱性および成形
収縮性の改良としてガラス繊維を配合したり、特に難燃
性改良を目的として塩素化パラフィン、三酸化アンチモ
ンおよび芳香族系ハロゲン化合物などによる検討も行わ
れている。しかし、難燃化剤の価格が高い事および安全
衛生上などに問題が残されている。
Therefore, for example, glass fibers are blended to improve flame retardancy, heat resistance and molding shrinkage, and studies are conducted with chlorinated paraffins, antimony trioxide, aromatic halogen compounds, etc. for the purpose of improving flame retardancy. Has also been done. However, there are still problems such as high price of flame retardant and safety and health.

【0004】[0004]

【発明が解決しようとする課題】本発明はポリアミドの
持つ優れた特性をほとんど低下させることなく、難燃
性、耐熱性および耐水性の優れたフェノール樹脂組成物
を提供することにある。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a phenol resin composition having excellent flame retardancy, heat resistance and water resistance, with almost no deterioration of the excellent characteristics of polyamide.

【0005】[0005]

【課題を解決するための手段】本発明者らは、長年フェ
ノール樹脂の研究に携わる中、検討した結果耐熱性、難
燃性、帯電性、耐摩耗性などのフェノール樹脂の特長を
付与した、ポリアミドと粉末状フェノール樹脂硬化物を
溶融混練してなるフェノール樹脂組成物を得る事ができ
た。さらに鋭意検討した結果、粉末状フェノール樹脂硬
化物の内そのアセトン抽出率が10%未満であり、かつ
粉末の粒径が1〜100μmの粉末状フェノール樹脂硬
化物を使用する事で、上記の特性に加えて耐衝撃性、引
張強度、曲げ強度などが向上する事を見出し、本発明を
完成させるに至った。
[Means for Solving the Problems] The present inventors have been engaged in research on phenolic resins for many years, and as a result of examination, they have added the characteristics of phenolic resins such as heat resistance, flame retardancy, electrostatic properties and abrasion resistance, A phenol resin composition obtained by melt-kneading a polyamide and a powdered phenol resin cured product could be obtained. As a result of further intensive study, the above-mentioned characteristics were obtained by using a powdery phenolic resin cured product having an acetone extraction rate of less than 10% in the powdery phenolic resin cured product and a powder particle size of 1 to 100 μm. In addition to this, they have found that impact resistance, tensile strength, bending strength and the like are improved, and have completed the present invention.

【0006】即ち本発明は、ポリアミド100重量部と
粉末状フェノール樹脂硬化物5〜50重量部を溶融混練
してなるフェノール樹脂組成物に関するものであり、好
ましくはポリアミド100重量部と粉末状フェノール樹
脂硬化物5〜30重量部を溶融混練してなるフェノール
樹脂組成物、さらに好ましくはポリアミド100重量部
と粉末状フェノール樹脂硬化物10〜25重量部を溶融
混練してなるフェノール樹脂組成物に関するものであ
る。ここで、ポリアミド100重量部に対する粉末状フ
ェノール樹脂硬化物の配合量が5重量部未満の場合、フ
ェノール樹脂の持つ優れた特長が発現しない。また、ポ
リアミド100重量部に対する粉末状フェノール樹脂硬
化物の配合量が50重量部を越えた場合には、ポリアミ
ドの持つ成形性や成形品の外観などが損われる。
That is, the present invention relates to a phenol resin composition obtained by melt-kneading 100 parts by weight of polyamide and 5 to 50 parts by weight of a powdered phenol resin cured product, preferably 100 parts by weight of polyamide and powdered phenol resin. A phenol resin composition obtained by melt-kneading 5 to 30 parts by weight of a cured product, and more preferably a phenol resin composition obtained by melt-kneading 100 parts by weight of polyamide and 10 to 25 parts by weight of a powdery phenol resin cured product. is there. Here, when the compounding amount of the powdery phenolic resin cured product with respect to 100 parts by weight of polyamide is less than 5 parts by weight, the excellent characteristics of the phenolic resin are not exhibited. Further, when the amount of the powdered phenolic resin cured product blended exceeds 50 parts by weight with respect to 100 parts by weight of polyamide, the moldability of the polyamide and the appearance of the molded product are impaired.

【0007】また、本発明に使用するフェノール樹脂硬
化物は、粉砕、粉末化し、その粉末の粒径が1〜100
μmである事を特徴のひとつとする。ここで、粉末の粒
径が1μm未満の場合、極めて微粒のため溶融混練時の
作業性が落ち、粉末の粒径が100μmを越えた場合に
は、成形品の外観などが損われる。
The phenol resin cured product used in the present invention is pulverized and powdered, and the particle size of the powder is 1 to 100.
One of the features is that it is μm. Here, if the particle size of the powder is less than 1 μm, the workability at the time of melt-kneading is deteriorated because it is extremely fine, and if the particle size of the powder exceeds 100 μm, the appearance of the molded product is impaired.

【0008】[0008]

【作用】本発明で用いられるアミドは特に限定される物
でなく一般に市販されているものであり、6ナイロン、
66ナイロン、610ナイロンなど各種のポリアミドが
使用できる。
The amide used in the present invention is not particularly limited and is commercially available.
Various polyamides such as 66 nylon and 610 nylon can be used.

【0009】本発明に用いられる粉末状フェノ−ル樹脂
硬化物を作製する時に使用するフェノール樹脂として
は、ノボラック型フェノール樹脂、レゾール型フェノー
ル樹脂、ベンジリックエーテル型フェノール樹脂などが
挙げられる。これらは、単独および2種以上を混合して
用いることもできる。また、ゴム変性、アルキルベンゼ
ン変性などの各種変性フェノール樹脂も使用する事が出
来る。好ましくは、ノボラック型フェノール樹脂と硬化
剤とを配合し、加熱により硬化させてなる粉末状フェノ
ール樹脂硬化物および/またはレゾール型フェノール樹
脂を加熱または酸により硬化させてなる硬化物である。
Examples of the phenol resin used for producing the powdery phenol resin cured product used in the present invention include novolac type phenol resin, resol type phenol resin and benzylic ether type phenol resin. These may be used alone or in combination of two or more. Further, various modified phenolic resins such as rubber modified and alkylbenzene modified can also be used. Preferably, a powdered phenol resin cured product obtained by mixing a novolac type phenol resin and a curing agent and curing by heating and / or a cured product obtained by curing a resol type phenol resin by heating or an acid.

【0010】本発明に用いられる、ノボラック型フェノ
ール樹脂は、フェノ−ル類(P)とアルデヒド類(F)
を配合モル比(F/P)が0.5〜1.0となる様な配
合比率で反応釜に仕込み、更に樹脂化触媒として塩酸、
硫酸、燐酸、パラトルエンスルフォン酸、ベンゼンスル
フォン酸、蓚酸、マレイン酸、蟻酸、酢酸などから選ば
れた1種または2種以上を添加し、変性樹脂を得る場合
は変性剤を添加した後加熱し、適当な時間還流反応を行
った後、反応によって生成した縮合水を除去するため真
空脱水或いは常圧脱水し、更に残っている水と未反応の
フェノール類を除去する方法によって得る事が出来る。
The novolak type phenolic resin used in the present invention includes phenols (P) and aldehydes (F).
Was charged into a reaction kettle at a blending ratio such that the blending molar ratio (F / P) was 0.5 to 1.0, and hydrochloric acid was used as a resinification catalyst.
Add one or more selected from sulfuric acid, phosphoric acid, p-toluenesulfonic acid, benzenesulfonic acid, oxalic acid, maleic acid, formic acid, acetic acid, etc., and if a modified resin is to be obtained, add a modifier and then heat. After carrying out a reflux reaction for an appropriate time, vacuum dehydration or atmospheric pressure dehydration for removing the condensed water produced by the reaction, and further removing remaining water and unreacted phenols can be obtained.

【0011】本発明に用いられる、レゾール型フェノー
ル樹脂は、フェノ−ル類(P)とアルデヒド類(F)を
配合モル比(F/P)が1.0〜2.0となる様な配合
比率で反応釜に仕込み、更に樹脂化触媒として水酸化ナ
トリウム、水酸化カリウム、水酸化バリウム、水酸化カ
ルシウムなどのアルカリ金属類およびアルカリ土類金属
類の水酸化物あるいは酸化物やアンモニア、トリエチル
アミン等のアミン類の中から選ばれた1種または2種以
上を添加し、変性樹脂を得る場合は変性剤を添加した後
加熱し、適当な時間還流反応を行った後、反応によって
生成した縮合水を除去するため真空脱水或いは常圧脱水
する方法によって得る事が出来る。
The resol type phenolic resin used in the present invention is a mixture of phenols (P) and aldehydes (F) in a molar ratio (F / P) of 1.0 to 2.0. Proportionately charged into a reaction kettle, and as a resinification catalyst, hydroxides or oxides of alkali metals and alkaline earth metals such as sodium hydroxide, potassium hydroxide, barium hydroxide and calcium hydroxide, ammonia, triethylamine, etc. 1 or 2 or more selected from the amines mentioned above are added, and when a modified resin is obtained, a modifier is added and then heated and refluxed for an appropriate time, and then condensed water produced by the reaction It can be obtained by vacuum dehydration or atmospheric dehydration.

【0012】本発明で使用するフェノール樹脂の原料と
なるフェノール類としては、フェノ−ル、オルソクレゾ
−ル、メタクレゾ−ル、パラクレゾ−ル、ビスフェノ−
ルA、ビスフェノ−ルF、カテコ−ル、レゾルシン、ハ
イドロキノン、プロピルフェノ−ル、ブチルフェノ−
ル、オクチルフェノ−ル、ノニルフェノ−ルなどから選
ばれた1種または2種以上である。アルデヒド類として
は、ホルムアルデヒド、パラホルムアルデヒド、トリオ
キサン、アセトアルデヒドなどが挙げられ、これらの中
から適宜選択して1種または2種以上が用いられる。ま
た、変性剤種としてはアルキルベンゼン(キシレン系樹
脂)、カシューオイル、ロジンなどのテルペン類および
ホウ酸が用いられる。
The phenols used as raw materials for the phenolic resin used in the present invention include phenol, orthocresol, metacresol, paracresol and bisphenol.
A, bisphenol F, catechol, resorcin, hydroquinone, propylphenol, butylphenol
And one or more selected from nonylphenol, octylphenol, nonylphenol and the like. Examples of the aldehydes include formaldehyde, paraformaldehyde, trioxane, acetaldehyde and the like, and one or two or more kinds are appropriately selected from these. As the modifier species, alkylbenzene (xylene-based resin), cashew oil, terpenes such as rosin, and boric acid are used.

【0013】本発明に用いられる粉末状フェノール樹脂
硬化物を作製する際の硬化方法としては、代表的には熱
および酸により硬化させる方法が挙げられるが、特に熱
による硬化方法が好ましい。ノボラック型フェノール樹
脂の場合、ヘキサメチレンテトラミン等の硬化剤を目標
とする架橋構造の程度に合せて、ノボラック型フェノー
ル樹脂100重量部に対して、1〜20重量部添加混合
して硬化させる。
As a curing method for producing the powdery phenolic resin cured product used in the present invention, a method of curing with heat and an acid is typically mentioned, and a curing method with heat is particularly preferable. In the case of a novolac type phenol resin, 1 to 20 parts by weight of a curing agent such as hexamethylenetetramine is added and mixed with 100 parts by weight of the novolac type phenol resin in accordance with the target degree of the cross-linking structure to cure.

【0014】本発明において、粉末状フェノ−ル樹脂硬
化物の硬化の程度は、アセトン抽出試験法により測定さ
れるアセトン抽出率の数値で示した。アセトン抽出試験
とは、フェノール樹脂の未硬化分をソックスレー抽出器
を用い、アセトンを溶媒として抽出する方法である。通
常、未硬化のフェノール樹脂はアセトンに溶解するが、
硬化が進むにつれて溶解しなくなる。完全に硬化した粉
末状フェノール樹脂硬化物はアセトンに対して全く溶解
しない。即ち、フェノール樹脂はアセトン抽出率100
%となり、完全に硬化したフェノール樹脂硬化物はアセ
トン抽出率0%となる。
In the present invention, the degree of curing of the powdery phenolic resin cured product is indicated by the numerical value of the acetone extraction rate measured by the acetone extraction test method. The acetone extraction test is a method of extracting the uncured portion of the phenol resin with a Soxhlet extractor using acetone as a solvent. Normally, uncured phenolic resin dissolves in acetone,
It does not dissolve as the curing progresses. A completely cured powdery phenol resin cured product does not dissolve in acetone at all. That is, the phenol resin has an acetone extraction rate of 100.
%, The completely cured phenol resin cured product has an acetone extraction rate of 0%.

【0015】ノボラック型フェノール樹脂とヘキサメチ
レンテトラミンの混合物およびレゾール型フェノール樹
脂を熱硬化させる際の温度は、目標とする硬化程度によ
り設定する。即ち、アセトン抽出率10%未満の硬化構
造を有する粉末状フェノール樹脂硬化物を製造する場
合、加熱温度としては、100〜180℃が好ましい。
The temperature at which the mixture of the novolac type phenol resin and hexamethylenetetramine and the resol type phenol resin are heat-cured is set according to the target degree of curing. That is, when a powdery phenolic resin cured product having a cured structure with an acetone extraction rate of less than 10% is produced, the heating temperature is preferably 100 to 180 ° C.

【0016】粉末状フェノール樹脂硬化物の粉砕方法と
しては、ハンマーミル、自由ミル、パルペライザー、タ
ーボミル、ジェットミル等を用いる事が出来る。粉末の
粒径は使用する粉砕機により調整する事が出来る。特定
の範囲の粒径の樹脂粉末を得るためには粉砕後、ふるい
を掛けることにより容易に得る事が出来る。この際、粉
砕機への原料の供給速度、粉砕機の回転速度、粉砕機の
スクリーンのメッシュにより得られる粒径が異なってく
る。
A hammer mill, a free mill, a pulverizer, a turbo mill, a jet mill or the like can be used for pulverizing the powdery phenol resin cured product. The particle size of the powder can be adjusted by the crusher used. In order to obtain a resin powder having a particle size in a specific range, it can be easily obtained by pulverizing and then sieving. At this time, the feed rate of the raw material to the crusher, the rotation speed of the crusher, and the particle size obtained depend on the mesh of the screen of the crusher.

【0017】[0017]

【実施例】以下本発明を実施例により詳細に説明する
が、本発明は実施例によって限定されるものではない。
なお、実施例、比較例に記載されている「部」および
「%」は「重量部」および「重量%」を示す。
EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to the examples.
In addition, "parts" and "%" described in Examples and Comparative Examples indicate "parts by weight" and "% by weight".

【0018】《フェノ−ル樹脂の合成》 〔合成例1〕撹拌機、熱交換器、温度計の付いた反応装
置にフェノ−ル1,000部および蓚酸10.0部を仕
込んだ。その後混合液を90±2℃に昇温させた後、同
温度に保持して、かつ真空度を440Torrに制御し
ながら、アルデヒドタンク内にいれておいた37%ホル
ムアルデヒド水溶液690部を2.5時間を要して混合
液に添加し、また添加後は同条件下で3.0時間保って
前段のアルデヒド類接触反応を行った。つづいて前段の
反応液を常圧下で150℃まで昇温させた後、真空度を
60Torrに保ちながら、液温が250℃になるまで
昇温して、残留水分と遊離モノマーを除去する事によ
り、融点95℃、遊離モノマー量0.5%のノボラック
型フェノール樹脂(B1)を得た。
<< Synthesis of phenol resin >> [Synthesis example 1] 1,000 parts of phenol and 10.0 parts of oxalic acid were charged into a reactor equipped with a stirrer, a heat exchanger and a thermometer. Thereafter, the temperature of the mixed solution was raised to 90 ± 2 ° C., and while maintaining the same temperature and controlling the vacuum degree to 440 Torr, 690 parts of the 37% aqueous formaldehyde solution placed in the aldehyde tank was added to 2.5%. It was added to the mixed solution over a period of time, and after the addition, the former aldehyde-catalyzed reaction was carried out for 3.0 hours under the same conditions. Then, after raising the temperature of the reaction solution in the previous stage to 150 ° C under normal pressure, the temperature of the solution was raised to 250 ° C while maintaining the vacuum degree at 60 Torr to remove residual water and free monomers. A novolac type phenol resin (B1) having a melting point of 95 ° C. and a free monomer amount of 0.5% was obtained.

【0019】〔合成例2〕合成例1と同型の反応装置に
フェノール1,000部、37%ホルムアルデヒド水溶
液1,380部および28%アンモニア水120部を仕
込んだ。その後混合液を徐々に昇温し、内温80℃にお
いて15分間減圧還流を行った。内温50℃まで冷却後
静置し、分離水を除去した後、60℃で減圧脱水し、融
点70℃、遊離モノマー量2.5%のレゾール型フェノ
ール樹脂(B2)を得た。
[Synthesis Example 2] 1,000 parts of phenol, 1,380 parts of 37% aqueous formaldehyde solution and 120 parts of 28% ammonia water were charged in the same reactor as in Synthesis Example 1. After that, the temperature of the mixed solution was gradually raised, and the mixture was refluxed under reduced pressure at 80 ° C. for 15 minutes. After cooling to an internal temperature of 50 ° C., the mixture was allowed to stand, the separated water was removed, and the mixture was dehydrated under reduced pressure at 60 ° C. to obtain a resol-type phenol resin (B2) having a melting point of 70 ° C. and a free monomer amount of 2.5%.

【0020】《フェノール樹脂硬化物の作製》 〔作製例1〕合成例1で合成したノボラック型フェノー
ル樹脂(B1)1,000部とヘキサメチレンテトラミ
ン100部とを混合粉砕した後、120℃で60分さら
に160℃で60分加熱した。得られたノボラック樹脂
硬化物をハンマーミルで粗粉砕した後、パルペライザー
を用いて微粉砕した。得られた粉末状ノボラック樹脂硬
化物(D1)の平均粒径は40μmであり、アセトン抽
出率は7%であった。
<Preparation of Phenolic Resin Cured Product> [Preparation Example 1] 1,000 parts of the novolac-type phenol resin (B1) prepared in Synthesis Example 1 and 100 parts of hexamethylenetetramine were mixed and pulverized, and then the mixture was crushed at 120 ° C. for 60 minutes. Minutes Further heated at 160 ° C. for 60 minutes. The obtained cured novolak resin was roughly pulverized with a hammer mill and then finely pulverized with a palpelizer. The obtained powdery novolac resin cured product (D1) had an average particle size of 40 μm and an acetone extraction rate of 7%.

【0021】〔作製例2〕合成例1で合成したノボラッ
ク型フェノール樹脂(B1)1,000部とヘキサメチ
レンテトラミン100部とを混合粉砕した後、110℃
で2時間さらに140℃で90分加熱した。得られたノ
ボラック樹脂硬化物をハンマーミルで粗粉砕した後、パ
ルペライザーを用いて微粉砕した。得られた粉末状ノボ
ラック樹脂硬化物(D2)の平均粒径は60μmであ
り、アセトン抽出率は9%であった。
[Production Example 2] 1,000 parts of the novolac type phenol resin (B1) synthesized in Synthesis Example 1 and 100 parts of hexamethylenetetramine were mixed and pulverized, and then 110 ° C.
Heated for 2 hours at 140 ° C. for 90 minutes. The obtained cured novolak resin was roughly pulverized with a hammer mill and then finely pulverized with a palpelizer. The obtained powdery novolac resin cured product (D2) had an average particle size of 60 μm and an acetone extraction rate of 9%.

【0022】〔作製例3〕合成例2で合成したレゾール
型フェノール樹脂(B2)を150℃で1時間加熱し
た。得られたレゾール樹脂硬化物をハンマーミルで粗粉
砕した後、パルペライザーを用いて微粉砕した。得られ
た粉末状レゾール樹脂硬化物(D3)の平均粒径は45
μmであり、アセトン抽出率は0.6%であった。
[Production Example 3] The resol-type phenol resin (B2) synthesized in Synthesis Example 2 was heated at 150 ° C for 1 hour. The obtained resole resin cured product was roughly pulverized with a hammer mill and then finely pulverized with a palpelizer. The average particle size of the obtained powdery resol resin cured product (D3) is 45.
μm, and the acetone extraction rate was 0.6%.

【0023】〔作製例4〕合成例2で合成したレゾール
型フェノール樹脂(B2)を130℃で90分加熱し
た。得られたレゾール樹脂硬化物をハンマーミルで粗粉
砕した後、ジェットミルを用いて微粉砕した。得られた
粉末状レゾール樹脂硬化物(D4)の平均粒径は15μ
mであり、アセトン抽出率は1.5%であった。
[Production Example 4] The resol-type phenol resin (B2) synthesized in Synthesis Example 2 was heated at 130 ° C for 90 minutes. The obtained resol resin cured product was roughly pulverized with a hammer mill and then finely pulverized with a jet mill. The average particle diameter of the obtained powdery resol resin cured product (D4) is 15μ.
m, and the acetone extraction rate was 1.5%.

【0024】〔作製例5〕合成例1で合成したノボラッ
ク型フェノール樹脂(B1)1,000部とヘキサメチ
レンテトラミン100部とを混合粉砕した後、120℃
で30分さらに160℃で60分加熱した。得られたノ
ボラック樹脂硬化物をハンマーミルで粗粉砕した後、パ
ルペライザーおよびジェットミルを用いて微粉砕した。
得られた粉末状ノボラック樹脂硬化物(D5)の平均粒
径は0.8μmであり、アセトン抽出率は9%であっ
た。
[Production Example 5] 1,000 parts of the novolac type phenol resin (B1) synthesized in Synthesis Example 1 and 100 parts of hexamethylenetetramine were mixed and pulverized, and then 120 ° C.
It was heated for 30 minutes at 160 ° C. for 60 minutes. The obtained novolak resin cured product was roughly pulverized with a hammer mill and then finely pulverized with a pulverizer and a jet mill.
The obtained powdery novolac resin cured product (D5) had an average particle size of 0.8 μm and an acetone extraction rate of 9%.

【0025】〔作製例6〕合成例2で合成したレゾール
型フェノール樹脂(B2)を140℃で60分加熱し
た。得られたレゾール樹脂硬化物をハンマーミルで粗粉
砕した後、パルペライザーを用いて微粉砕した。得られ
た粉末状レゾール樹脂硬化物(D6)の平均粒径は15
0μmであり、アセトン抽出率は6%であった。
[Production Example 6] The resol-type phenol resin (B2) synthesized in Synthesis Example 2 was heated at 140 ° C for 60 minutes. The obtained resole resin cured product was roughly pulverized with a hammer mill and then finely pulverized with a palpelizer. The average particle diameter of the obtained powdery resol resin cured product (D6) is 15
It was 0 μm, and the acetone extraction rate was 6%.

【0026】〔実施例1〜4〕ポリアミドと作製例1〜
4で得られた粉末状ノボラック樹脂硬化物(D1〜D
4)を表1に示す配合で二軸押出機にて280℃、1分
間溶融混練し、得られたフェノール樹脂組成物をインジ
ェクション成形により成形し、各試験片を作製した。
[Examples 1 to 4] Polyamide and Preparation Example 1
4 powdered novolac resin cured product (D1 to D
4) was blended as shown in Table 1 with a twin-screw extruder and melt-kneaded at 280 ° C. for 1 minute, and the obtained phenol resin composition was molded by injection molding to prepare each test piece.

【0027】〔比較例1〜4〕ポリアミドと作製例1、
3、5、6で得られた粉末状ノボラック樹脂硬化物(D
1、D3、D5、D6)を表1に示す配合で二軸押出機
にて280℃、1分間溶融混練し、得られたフェノール
樹脂組成物をインジェクション成形により成形し、各試
験片を作製した。
Comparative Examples 1 to 4 Polyamide and Preparation Example 1,
Powdery novolac resin cured product (D) obtained in 3, 5, and 6
1, D3, D5, D6) were melt-kneaded in a twin-screw extruder at 280 ° C. for 1 minute with the composition shown in Table 1, and the obtained phenol resin composition was molded by injection molding to prepare each test piece. .

【0028】〔比較例5〕ポリアミド100重量部をイ
ンジェクション成形により成形し、各試験片を作製し
た。
[Comparative Example 5] 100 parts by weight of polyamide were molded by injection molding to prepare test pieces.

【0029】〔比較例6〕ポリアミド100重量部とガ
ラス繊維20重量部を二軸押出機にて280℃、1分間
溶融混練する。得られた組成物をインジェクション成形
により成形し、各試験片を作製した。
Comparative Example 6 100 parts by weight of polyamide and 20 parts by weight of glass fiber are melt-kneaded for 1 minute at 280 ° C. in a twin-screw extruder. The obtained composition was molded by injection molding to prepare each test piece.

【0030】(試験片の評価方法)引張強度はASTM
D638、曲げ強度はASTM D790、アイゾッ
ト衝撃強度はASTM D256、熱変形温度はAST
M D648、熱変形温度はASTM D648、燃焼
試験は Underwriters Laborato
ries社の安全標準UL94(○:燃焼時間10秒以
内、△:10秒以上燃焼、×:全焼)によって測定し
た。これらの配合及び評価結果は表1に示した。
(Evaluation method of test piece) Tensile strength is ASTM
D638, flexural strength ASTM D790, Izod impact strength ASTM D256, heat distortion temperature AST
M D648, heat distortion temperature is ASTM D648, combustion test is Underwriters Laborato
It was measured according to safety standard UL94 (○: burning time within 10 seconds, Δ: burning for 10 seconds or more, x: burnt down) manufactured by ries. The formulations and the evaluation results are shown in Table 1.

【0031】[0031]

【表1】 [Table 1]

【0032】実施例1〜4で得られたポリアミドと粉末
状フェノール樹脂硬化物を溶融混練してなるフェノール
樹脂組成物物は比較例1〜6で得られたものに比べて、
吸水率、熱変形温度、曲げ強度、難燃性などの機械的、
物理的特性が向上する事が確認された。
The phenol resin compositions obtained by melt-kneading the polyamides obtained in Examples 1 to 4 and the powdery phenolic resin cured products were compared with those obtained in Comparative Examples 1 to 6,
Mechanical properties such as water absorption, heat distortion temperature, bending strength, flame retardancy, etc.
It was confirmed that the physical properties were improved.

【0033】[0033]

【発明の効果】本発明によれば、従来からポリアミドの
持っている耐衝撃性、耐摩耗性などの優れた特長を損う
事なく、難燃性、耐熱性、耐水性などのフェノール樹脂
の持つ特長も付与出来る。このため、従来からポリアミ
ドが使用されている分野は勿論の事、難燃性、耐熱性が
要求される分野においても適応が可能である。
EFFECTS OF THE INVENTION According to the present invention, a phenol resin having flame resistance, heat resistance, water resistance, etc., can be used without impairing the excellent characteristics such as impact resistance and abrasion resistance of conventional polyamides. You can also add the features you have. Therefore, it can be applied not only in the fields where polyamides have been conventionally used but also in the fields where flame retardancy and heat resistance are required.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 ポリアミド100重量部と粉末状フェノ
ール樹脂硬化物5〜50重量部を溶融混練してなるフェ
ノール樹脂組成物。
1. A phenol resin composition obtained by melt-kneading 100 parts by weight of polyamide and 5 to 50 parts by weight of a powdered phenol resin cured product.
【請求項2】 粉末状フェノール樹脂硬化物が、ノボラ
ック型フェノール樹脂と硬化剤とを配合し、加熱により
硬化させてなる粉末状フェノール樹脂硬化物および/ま
たはレゾール型フェノール樹脂を加熱または酸により硬
化させてなる粉末状フェノール樹脂硬化物である請求項
1記載のフェノール樹脂組成物。
2. A powdery phenolic resin cured product is obtained by mixing a novolac type phenolic resin and a curing agent and curing the powdery phenolic resin cured product and / or a resol type phenolic resin by heating or acid. The phenol resin composition according to claim 1, which is a powdered phenol resin cured product obtained by the above.
【請求項3】 粉末状フェノール樹脂硬化物のアセトン
抽出率が10%未満である請求項1又は2記載のフェノ
ール樹脂組成物。
3. The phenol resin composition according to claim 1, wherein the powdery phenolic resin cured product has an acetone extraction rate of less than 10%.
【請求項4】 粉末状フェノール樹脂硬化物の粉末の粒
径が1〜100μmである請求項1、2又は3記載のフ
ェノール樹脂組成物。
4. The phenol resin composition according to claim 1, 2 or 3, wherein the powder of the powdered phenol resin cured product has a particle size of 1 to 100 μm.
JP19879794A 1994-08-23 1994-08-23 Phenolic resin composition Pending JPH0859985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19879794A JPH0859985A (en) 1994-08-23 1994-08-23 Phenolic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19879794A JPH0859985A (en) 1994-08-23 1994-08-23 Phenolic resin composition

Publications (1)

Publication Number Publication Date
JPH0859985A true JPH0859985A (en) 1996-03-05

Family

ID=16397071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19879794A Pending JPH0859985A (en) 1994-08-23 1994-08-23 Phenolic resin composition

Country Status (1)

Country Link
JP (1) JPH0859985A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017175589A1 (en) * 2016-04-06 2018-04-12 Dic株式会社 Novolac resin and resist material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017175589A1 (en) * 2016-04-06 2018-04-12 Dic株式会社 Novolac resin and resist material

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