JPH0144213B2 - - Google Patents
Info
- Publication number
- JPH0144213B2 JPH0144213B2 JP24476883A JP24476883A JPH0144213B2 JP H0144213 B2 JPH0144213 B2 JP H0144213B2 JP 24476883 A JP24476883 A JP 24476883A JP 24476883 A JP24476883 A JP 24476883A JP H0144213 B2 JPH0144213 B2 JP H0144213B2
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- resin
- diphenol
- parts
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000005011 phenolic resin Substances 0.000 claims description 37
- 229920001568 phenolic resin Polymers 0.000 claims description 30
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 29
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical group OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 15
- 150000001299 aldehydes Chemical class 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 claims description 4
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- 239000012778 molding material Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- -1 curing accelerator Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical compound C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Description
〔産業上の利用分野〕
本発明は、硬化性・耐熱性・耐湿性に優れるフ
エノール樹脂組成物に係るものであり、その特徴
は剛直なフエノール構造を骨格中に持つフエノー
ル樹脂を含む組成物に関するものである。
〔従来の技術〕
近年、金属部品やセラミツク部品類のプラスチ
ツク化は驚異的な速さで進行していることは衆知
の事実である。プラスチツクとしてはフエノール
樹脂・ポリエステル樹脂・エポキシ樹脂等が使わ
れており、用途としては家電・自動車分野で多量
に用いられている。これら分野での最近の動きと
してはVTRの小型化、自動車の軽量化といつた
動きや日本の製品は世界中で使用される確率がま
すます高まつてきたことである。このためこれら
用途で使われる部品類は小型・軽量化や環境の変
化に対する強さや低コスト化が強く要求されてい
る。
このため、プラスチツク素材そのものの耐熱
性・耐湿性の向上並びに低コスト化が必要となつ
てきている。
〔発明が解決しようとする課題〕
本発明は、これら要求を満足させる耐熱性・耐
湿性さらには速硬化性を兼ねそなえたフエノール
樹脂組成物を提供するものである。
〔課題を解決するための手段〕
本発明は、下記〔〕・〔〕・〔〕等で表わさ
れるジフエノール構造を骨格中に持つフエノール
樹脂を組成の中に含むことを特徴とするフエノー
ル樹脂組成物を提供する。
〔〕 ジフエノール類とアルデヒド類との重合
物
〔〕 ジフエノール類とフエノール類とアルデ
ヒド類との共重合物
〔〕 ジフエノール類とアルキルベンゼン類と
アルデヒド類との共重合物
ここでいうジフエノール類とは、ジオキシジフ
エニル及びジオキシジフエニル誘導体全てをい
う。又、フエノール類とはフエノール・アルキル
フエノール・レゾルシル等のこと、アルキルベン
ゼン類とはトルエン・キシレン・アセナフテン・
アントラセン等のことをいう。アルデヒド類と
は、アルデヒド基を持つもののことをいい、例え
ばホルムアルデヒド・パラホルムアルデヒド・ベ
ンズアルデヒド・アセトアルデヒド・プロピルア
ルデヒド・アクロレイン等が挙げられる。さらに
フエノール樹脂組成物はジフエノール構造を骨格
中に持つフエノール樹脂（以後ジフエノール型フ
エノール樹脂と称する）を組成に含むもの全てを
いい、一般的にはフエノール樹脂・硬化剤・硬化
促進剤・充填剤・顔料・離型剤・表面処理剤・難
燃剤等より構成される。又エポキシ樹脂の硬化剤
として使用される場合も本発明でいうフエノール
樹脂組成物の中に含む。
ここでいうフエノール樹脂とは、本発明による
ジフエノール型フエノール樹脂を必須として他の
フエノール樹脂一種もしくは二種以上と併用して
も良い。しかし、本発明のジフエノール型フエノ
ール樹脂の比率を多くするほど速硬化性や耐熱性
は向上する。又、充填材とは木粉・炭酸カルシウ
ム・クレー・アスペスト・ガラス・シリカ・積層
板くず等が一般的に使われる。硬化剤はノボラツ
ク樹脂の場合の架橋剤例えばヘキナメチレンテト
ラミン等、硬化促進剤とは水酸化カルシウム・水
酸化マグネシウム等の硬化触媒、表面処理剤とは
シランカツプリング剤等の充填材改質剤、難燃剤
とは、ホウ素化合物・リン化合物等のことをい
う。
本発明のジフエノール型フエノール樹脂をエポ
キシ樹脂の硬化剤として用いる場合には、単独で
も又他の硬化剤例えばフエノールノボラツク類・
アミン類・酸無水物類等と併用しても良い。但
し、本発明のジフエノール型フエノール樹脂の比
率を多くするほど速硬化性や耐熱性は向上する。
特に電子部品用のエポキシ樹脂組成物としては
エポキシ樹脂はクレゾールノボラツク型エポキシ
樹脂、硬化剤は本発明によるジフエノール型フエ
ノール樹脂を半分以上用い他はフエノールノボラ
ツク、充填剤はシリカとするのが望ましい。
〔作用〕
本発明は、ジフエノールを骨格中に入れること
により樹脂そのものの強度及び架橋後の強度が著
しく向上することを見い出したものである。これ
はビスフエノールがベンゼン環とベンゼン環が直
接結合した剛直な構造を持つだけでなくOH当量
が小さく高強度架橋が達成できるという理由によ
る。
この結果、硬化反応は速くなり速硬化性が得ら
れるだけでなく、硬化物の熱分解温度が高くなる
及び吸水率が小さくなるといつた耐熱性・耐湿性
での長所も得られた。速硬化性は成形工程やプレ
ス工程のハイサイクル合理化を可能にし、コスト
ダウンにつながり、又耐熱性・耐湿性向上はプラ
スチツク部品の肉薄小型化時の品質を支えるもの
である。ジフエノール型フエノール樹脂組成物の
強度はジフエノールの比率によつて左右される。
ジフエノールの比率が高いほど強度は向上するの
で目的によつて樹脂中のジフエノール量及び組成
物中のジフエノール型フエノール樹脂の使用量を
決めることが必要である。強度面からは樹脂分の
50％以上をジフエノールとするのが好ましい。
〔実施例〕
以下実施例に基づいて説明する。尚、実施例で
用いる部は全て重量部である。又、実施例で用い
たフエノール樹脂は次の通りである。
テトラメチルジフエノール・ホルムアルデヒ
ドノボラツク（本発明の樹脂）
：テトラメチルジフエノール698ｇと37％ホ
ルマリン195ｇを30％塩酸1.5ｇの存在化２時間
遠流反応を行つた後常圧加熱脱水により得た固
形樹脂（分子量600）
ジフエノール・ホルムアルデヒドノボラツク
（本発明の樹脂）
：ジフエノール558ｇと37％ホルマリン195ｇ
を同様に反応させて得られた固形樹脂（分子
量600）
フエノールノボラツク：三井東圧(株)＃2000
フエノールノボラツク：日本化薬(株)PN―
100
実施例 １
フエノール樹脂100部、ヘキサメチレンテトラ
ミン（住友化学工業(株)製）20部、木粉60部、炭酸
カルシウム30部、水酸化カルシウム２部、カーボ
ン２部、ステアリン酸２部を混合後100℃の加熱
ロールで３分間混練し成形材料を作る。この時フ
エノール樹脂として，，／＝２／１／
＝１／２なる４水準を取り４種の材料を得た。
これら成形材料の硬化性、成形収縮率、煮沸絶縁
抵抗、熱変形温度、吸水率を調べた。結果は第１
表の通りで、本発明による成形材料即ちフエノー
ル樹脂として，／＝２／１／＝１／２
を用いたものは、現在の通常の成形材料（フエノ
ール樹脂としてを用いたもの）より、いずれの
特性でも優れることが判る。又、フエノール樹脂
中のの比率を高くした方がこれら特長がより強
く出てくることも判る。
実施例 ２
エポキシ樹脂「チバガイギー(株)ECN―1273〕
20部、フエノール樹脂10部、溶融シリカ〔東芝セ
ラミツクス(株)製〕70部、硬化促進剤〔四国化成(株)
2PZ〕0.2部、ミランカツプリング剤〔トーレ・
シリコーン(株)SH―6040〕0.5部、離型剤〔ヘキス
トジヤパン(株)ヘキストワツクスＣ〕0.5部を混合
後120℃の加熱ニーダーで混練し成形材料を作つ
た。この時フエノール樹脂として，，／
＝１／２，／＝２／１なる４水準の４種の材
料を得た。これら成形材料の硬化性・成形収縮
率・熱膨張特性・吸水率・耐熱性撃性を調べた。
結果は第２表の通りで本発明による成形材料即ち
フエノール樹脂として，／＝１／２，／
＝２／１を用いたものは現在の汎用成形材料
（フエノール樹脂としてを用いたもの）より硬
化性、耐熱性、耐湿性で優れることが判る。又、
ジフエノール型フエノール樹脂の比率を多くした
方が、これら特長がより強く出てくることも判
る。
[Industrial Application Field] The present invention relates to a phenolic resin composition having excellent curability, heat resistance, and moisture resistance, and its characteristics relate to a composition containing a phenolic resin having a rigid phenol structure in its skeleton. It is something. [Prior Art] It is a well-known fact that in recent years, metal parts and ceramic parts have been replaced with plastic at an astonishing speed. Phenol resin, polyester resin, epoxy resin, etc. are used as plastics, and they are used in large quantities in the fields of home appliances and automobiles. Recent developments in these fields include the miniaturization of VCRs, the lightweighting of automobiles, and the increasing probability that Japanese products will be used all over the world. For this reason, there is a strong demand for parts used in these applications to be smaller, lighter, more resistant to environmental changes, and lower in cost. For this reason, it has become necessary to improve the heat resistance and moisture resistance of the plastic material itself and to reduce its cost. [Problems to be Solved by the Invention] The present invention provides a phenolic resin composition that satisfies these requirements and has heat resistance, moisture resistance, and fast curing properties. [Means for Solving the Problems] The present invention provides a phenolic resin composition characterized in that the composition contains a phenolic resin having a diphenol structure represented by the following [], [], [], etc. in its skeleton. I will provide a. [] Polymers of diphenols and aldehydes [] Copolymers of diphenols, phenols, and aldehydes [] Copolymers of diphenols, alkylbenzenes, and aldehydes The diphenols mentioned here are Refers to all oxydiphenyl and dioxydiphenyl derivatives. In addition, phenols include phenol, alkylphenol, resorcil, etc., and alkylbenzenes include toluene, xylene, acenaphthene,
Refers to anthracene etc. Aldehydes refer to those having an aldehyde group, such as formaldehyde, paraformaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, acrolein, and the like. Furthermore, phenolic resin composition refers to anything that contains a phenolic resin having a diphenol structure in its skeleton (hereinafter referred to as diphenol type phenolic resin), and generally includes phenolic resin, curing agent, curing accelerator, filler, Composed of pigments, mold release agents, surface treatment agents, flame retardants, etc. In addition, when used as a curing agent for epoxy resin, it is also included in the phenolic resin composition referred to in the present invention. The phenolic resin mentioned here is essentially the diphenol type phenolic resin according to the present invention, and may be used in combination with one or more other phenolic resins. However, as the proportion of the diphenol type phenolic resin of the present invention increases, the faster curing properties and heat resistance improve. Also, commonly used fillers include wood flour, calcium carbonate, clay, aspest, glass, silica, and laminate board scraps. The curing agent is a crosslinking agent for novolak resin, such as hequinamethylenetetramine, the curing accelerator is a curing catalyst such as calcium hydroxide or magnesium hydroxide, and the surface treatment agent is a filler modifier such as a silane coupling agent. , Flame retardants refer to boron compounds, phosphorus compounds, etc. When the diphenol type phenolic resin of the present invention is used as a curing agent for epoxy resin, it may be used alone or with other curing agents such as phenol novolacs, etc.
It may be used in combination with amines, acid anhydrides, etc. However, as the proportion of the diphenol type phenolic resin of the present invention increases, the faster curing properties and heat resistance improve. In particular, for epoxy resin compositions for electronic parts, it is preferable that the epoxy resin is a cresol novolac type epoxy resin, the curing agent is a diphenol type phenol resin according to the present invention for at least half of the composition, the rest is phenol novolac, and the filler is silica. . [Function] The present invention is based on the discovery that the strength of the resin itself and the strength after crosslinking are significantly improved by incorporating diphenol into the skeleton. This is because bisphenol not only has a rigid structure in which benzene rings are directly bonded, but also has a small OH equivalent and can achieve high strength crosslinking. As a result, not only did the curing reaction become faster and faster curing properties were obtained, but also the cured product had advantages in terms of heat resistance and moisture resistance, such as a higher thermal decomposition temperature and lower water absorption. Rapid curing enables high-cycle rationalization of molding and pressing processes, leading to cost reductions, and improved heat resistance and moisture resistance support the quality of plastic parts when they are made thinner and more compact. The strength of a diphenol-type phenolic resin composition depends on the ratio of diphenol.
The higher the ratio of diphenol, the higher the strength, so it is necessary to determine the amount of diphenol in the resin and the amount of diphenol type phenol resin used in the composition depending on the purpose. In terms of strength, the resin content
It is preferable that 50% or more is diphenol. [Example] The following will explain based on an example. Note that all parts used in the examples are parts by weight. Further, the phenol resins used in the examples are as follows. Tetramethyldiphenol formaldehyde novolac (resin of the present invention): 698g of tetramethyldiphenol and 195g of 37% formalin were subjected to a far-flow reaction for 2 hours in the presence of 1.5g of 30% hydrochloric acid, and then dehydrated by heating under normal pressure. Solid resin (molecular weight 600) Diphenol formaldehyde novolak (resin of the present invention): 558 g of diphenol and 195 g of 37% formalin
Solid resin obtained by reacting in the same manner (molecular weight 600) Phenol novolac: Mitsui Toatsu Co., Ltd. #2000 Phenol novolac: Nippon Kayaku Co., Ltd. PN-
100 Example 1 Mix 100 parts of phenol resin, 20 parts of hexamethylenetetramine (manufactured by Sumitomo Chemical Co., Ltd.), 60 parts of wood flour, 30 parts of calcium carbonate, 2 parts of calcium hydroxide, 2 parts of carbon, and 2 parts of stearic acid. After that, knead for 3 minutes with heated rolls at 100℃ to make a molding material. At this time, as phenolic resin, /=2/1/
= 1/2, four levels were taken to obtain four types of materials.
The hardenability, molding shrinkage rate, boiling insulation resistance, heat distortion temperature, and water absorption rate of these molding materials were investigated. The result is the first
As shown in the table, the molding material according to the present invention, that is, the phenolic resin, /=2/1/=1/2
It can be seen that the molding material using phenol resin is superior to the current ordinary molding material (those using phenolic resin) in all properties. It can also be seen that these features become more pronounced when the ratio of phenolic resin in the phenolic resin is increased. Example 2 Epoxy resin “Ciba Geigy Corporation ECN-1273”
20 parts, phenolic resin 10 parts, fused silica [manufactured by Toshiba Ceramics Corporation] 70 parts, curing accelerator [Shikoku Kasei Corporation]
2PZ〕0.2 part, Milan coupling agent〔Toray・
0.5 part of Silicone Co., Ltd. SH-6040] and 0.5 part of a mold release agent [Hoechst Wax C, manufactured by Hoechst Japan Co., Ltd.] were mixed and kneaded in a heated kneader at 120°C to prepare a molding material. At this time, as phenolic resin, /
Four types of materials with four levels of =1/2 and /=2/1 were obtained. The curability, molding shrinkage rate, thermal expansion characteristics, water absorption rate, and heat impact resistance of these molding materials were investigated.
The results are shown in Table 2. As the molding material according to the present invention, that is, phenolic resin, /=1/2, /
It can be seen that the material using =2/1 is superior to the current general-purpose molding materials (those using phenolic resin) in terms of curability, heat resistance, and moisture resistance. or,
It can also be seen that these features become more pronounced as the ratio of diphenol type phenol resin increases.
【表】【table】
【表】【table】
以上実施例で示すようにジフエノール構造を骨
格中に持つフエノール樹脂を組成物中に含むもの
は、フエノール樹脂成形材料として用いる場合、
硬化性に優れ、耐熱性、耐湿性が著しく改良され
ておる。
又エポキシ樹脂の硬化剤として用いた場合にも
硬化性、耐熱性、耐湿性に非常に優れた物性を示
し、特に温度サイクルテストやプレツシヤークツ
カーテストにおいて格段に優れたものであり、半
導体封止用樹脂組成物としては非常に信頼性に優
れたものであつた。
As shown in the examples above, when a composition containing a phenolic resin having a diphenol structure in its skeleton is used as a phenolic resin molding material,
It has excellent curability and has significantly improved heat resistance and moisture resistance. Also, when used as a curing agent for epoxy resins, it exhibits excellent physical properties in terms of curing, heat resistance, and moisture resistance, and it exhibits particularly excellent properties in temperature cycle tests and pressure vacuum tests. As a sealing resin composition, it was extremely reliable.
Claims (1)
ジフエノール類とフエノール類とアルデヒド類と
の共重合物および／またはジフエノール類とアル
キルベンゼン類とアルデヒド類との共重合物とし
て表わされるジフエノール構造を骨格中に持つフ
エノール樹脂を組成の中に含むことを特徴とする
フエノール樹脂組成物。1 Polymer of diphenols and aldehydes,
The composition contains a phenolic resin having a diphenol structure in its skeleton, which is expressed as a copolymer of diphenols, phenols, and aldehydes and/or a copolymer of diphenols, alkylbenzenes, and aldehydes. A phenolic resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24476883A JPS60139749A (en) | 1983-12-27 | 1983-12-27 | Phenolic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24476883A JPS60139749A (en) | 1983-12-27 | 1983-12-27 | Phenolic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60139749A JPS60139749A (en) | 1985-07-24 |
| JPH0144213B2 true JPH0144213B2 (en) | 1989-09-26 |
Family
ID=17123612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24476883A Granted JPS60139749A (en) | 1983-12-27 | 1983-12-27 | Phenolic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60139749A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05156120A (en) * | 1991-12-04 | 1993-06-22 | Sumitomo Bakelite Co Ltd | Thermosetting molding material |
| JPH05156121A (en) * | 1991-12-04 | 1993-06-22 | Sumitomo Bakelite Co Ltd | Molding material of phenol resin |
-
1983
- 1983-12-27 JP JP24476883A patent/JPS60139749A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60139749A (en) | 1985-07-24 |
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