JPH0793226B2 - Monolithic ceramic capacitors - Google Patents

Monolithic ceramic capacitors

Info

Publication number
JPH0793226B2
JPH0793226B2 JP3030298A JP3029891A JPH0793226B2 JP H0793226 B2 JPH0793226 B2 JP H0793226B2 JP 3030298 A JP3030298 A JP 3030298A JP 3029891 A JP3029891 A JP 3029891A JP H0793226 B2 JPH0793226 B2 JP H0793226B2
Authority
JP
Japan
Prior art keywords
layer
electrode
base metal
silver
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3030298A
Other languages
Japanese (ja)
Other versions
JPH04268710A (en
Inventor
俊二 村井
欣男 秋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP3030298A priority Critical patent/JPH0793226B2/en
Publication of JPH04268710A publication Critical patent/JPH04268710A/en
Publication of JPH0793226B2 publication Critical patent/JPH0793226B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電極材料に改良を施し
た積層セラミックコンデンサに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated ceramic capacitor having an improved electrode material.

【0002】[0002]

【従来の技術】この種の積層セラミックコンデンサは、
平板状をなす複数の内部電極をセラミックを介して積層
して形成された積層チップと、該積層チップの対向壁に
付設された一対の外部電極とから構成されている。チッ
プ内の内部電極は交互に逆方向の外部電極に接続されて
おり、内部電極間で得られた所定の静電容量を外部電極
から取り出せるようになっている。
2. Description of the Related Art A monolithic ceramic capacitor of this type is
It is composed of a laminated chip formed by laminating a plurality of flat plate-shaped internal electrodes via ceramics, and a pair of external electrodes attached to opposing walls of the laminated chip. The internal electrodes in the chip are alternately connected to the external electrodes in opposite directions so that a predetermined capacitance obtained between the internal electrodes can be taken out from the external electrodes.

【0003】上記の内部電極及び外部電極は、耐熱性及
び耐食性の関係から一般に銀や銀−パラジウム等の銀合
金から形成されている。しかし、これら銀または銀合金
は電極として優れた特性を有する反面、材料価格が高
く、このためコンデンサ自体のコストが高価になる欠点
があり、とりわけ全体コストの30〜40%が内部電極
に依存している。
The internal electrodes and the external electrodes are generally formed of silver or a silver alloy such as silver-palladium in view of heat resistance and corrosion resistance. However, while these silver or silver alloys have excellent characteristics as electrodes, they have a drawback that the material cost is high and the cost of the capacitor itself is high, and 30-40% of the total cost depends on the internal electrodes. ing.

【0004】積層セラミックコンデンサに係る価格的な
問題を解消するため、内部電極を安価な卑金属から形成
する試みもなされている。しかし、内部電極をニッケル
等の卑金属で形成した場合では、外部電極に銀または銀
合金を用いると両電極の馴染みが悪く、両電極に導通不
良を生じ易くなる欠点がある。
In order to solve the price problem associated with the monolithic ceramic capacitor, attempts have been made to form the internal electrodes from an inexpensive base metal. However, when the internal electrodes are formed of a base metal such as nickel, if silver or a silver alloy is used for the external electrodes, there is a drawback that the two electrodes are not well-adapted to each other and a conduction failure easily occurs in both electrodes.

【0005】電極相互の馴染みの問題を解消するものと
して、内部電極を卑金属から形成する一方、外部電極
を、内部電極と同一または合金化した金属で形成され且
つ内部電極に接続される第1層と、銀または銀合金で形
成され且つ該第1層の外面に付設される第2層とから構
成したものも提案されている(特開昭59−16323
号公報参照)。つまり、この積層セラミックコンデンサ
では、内部電極に接続される外部電極の第1層を内部電
極と同一系の金属から形成することで、両電極の馴染み
を向上させ導通及び強度の改善を図っている。
In order to solve the problem of mutual familiarity between the electrodes, the first electrode is formed of a base metal while the external electrode is formed of the same or alloyed metal as the internal electrode and is connected to the internal electrode. And a second layer formed of silver or a silver alloy and attached to the outer surface of the first layer have also been proposed (JP-A-59-16323).
(See Japanese Patent Publication). That is, in this monolithic ceramic capacitor, the first layer of the external electrode connected to the internal electrode is formed of a metal of the same system as the internal electrode, so that the familiarity of both electrodes is improved and conduction and strength are improved. .

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記の
積層セラミックコンデンサでは内部電極と外部電極の第
1層との馴染みを向上できる反面、外部電極の第1層と
第2層の金属原子の結合半径が異なるために両層の境界
部分の結合強度が弱く、温度サイクル試験により接続不
良を生じて静電容量抜けやtanδの悪化が起こる欠点
がある。
However, in the above-mentioned multilayer ceramic capacitor, the familiarity between the internal electrode and the first layer of the external electrode can be improved, but on the other hand, the bonding radius of the metal atom of the first layer and the second layer of the external electrode can be improved. However, there is a drawback in that the bonding strength at the boundary between the two layers is weak, and a connection failure is caused by a temperature cycle test, resulting in capacitance loss and deterioration of tan δ.

【0007】本発明は上記問題点に鑑みてなされたもの
で、その目的とするところは、コンデンサ自体を安価に
形成できることは勿論のこと、外部電極の各層間に高い
導通性を確保でき、温度サイクル試験で静電容量抜けや
tanδの悪化が起こらない積層セラミックコンデンサ
を提供することにある。
The present invention has been made in view of the above problems, and it is an object of the present invention that the capacitor itself can be formed at low cost, high conductivity can be ensured between the respective layers of the external electrode, and the temperature can be improved. An object of the present invention is to provide a monolithic ceramic capacitor that does not cause capacitance omission or deterioration of tan δ in a cycle test.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するた
め、本発明では、セラミックを介して積層された複数の
内部電極と、内部電極と所定の接続関係をもって導通す
る一対の外部電極とを具備した積層セラミックコンデン
サにおいて、上記内部電極を卑金属または卑金属合金の
焼成物から形成すると共に、上記外部電極を、卑金属ま
たは卑金属合金の焼成物から成り内部電極に接続された
第1層と、金属皮膜から成り第1層の外面に付設された
第2層と、銀または銀合金の焼成物から成り第2層の外
面に付設された第3層とから構成している。
In order to achieve the above object, the present invention comprises a plurality of internal electrodes laminated via ceramics, and a pair of external electrodes which are electrically connected to the internal electrodes in a predetermined connection relationship. In the laminated ceramic capacitor described above, the internal electrode is formed from a fired product of a base metal or a base metal alloy, and the external electrode is formed of a first layer made of a fired product of a base metal or a base metal alloy and connected to the internal electrode, and a metal film. The second layer is attached to the outer surface of the first layer, and the third layer is attached to the outer surface of the second layer and is made of a fired product of silver or a silver alloy.

【0009】[0009]

【作用】本発明に係る積層セラミックコンデンサでは、
外部電極の第1層が内部電極と同じ卑金属または卑金属
合金の焼成物から成るので、両者の馴染みがよくその境
界部分に高い導通性と強度を確保できる。
In the laminated ceramic capacitor according to the present invention,
Since the first layer of the external electrode is made of a fired product of the same base metal or base metal alloy as that of the internal electrode, the two are well familiar to each other and high conductivity and strength can be secured at the boundary portion.

【0010】また、外部電極の第2層である金属皮膜は
各種めっき法により形成され結晶性の不完全な原子団毎
に第1層及び第3層に付着し、原子の結合半径の違いを
吸収した結晶性の不完全な相を多く含んだ膜となる。こ
のため原子の結合半径の違いに拘らず第1層及び第3層
との馴染みがよく、第1層と第3層との間に高い導通性
と強度を得ることができる。
The metal film, which is the second layer of the external electrode, is formed by various plating methods and adheres to the first layer and the third layer for each atomic group having imperfect crystallinity, which causes a difference in bond radius of atoms. The film contains a large amount of imperfect crystalline phases absorbed. Therefore, it is well compatible with the first and third layers regardless of the difference in atomic bond radius, and high conductivity and strength can be obtained between the first layer and the third layer.

【0011】[0011]

【実施例】図1は本発明を適用した積層セラミックコン
デンサの断面図である。
1 is a sectional view of a monolithic ceramic capacitor to which the present invention is applied.

【0012】この積層セラミックコンデンサは、平板状
をなす複数(図中は5枚)の内部電極1をセラミック2
を介して積層して形成された角形の積層チップ3と、該
積層チップ3の内部電極方向の対向壁に付設された一対
の外部電極4とから構成されている。
This monolithic ceramic capacitor comprises a plurality of (five in the figure) internal electrodes 1 in the form of a flat plate and a ceramic 2
It is composed of a rectangular multilayer chip 3 formed by stacking via a via, and a pair of external electrodes 4 attached to opposing walls in the internal electrode direction of the multilayer chip 3.

【0013】上記内部電極1は間隔をおいて交互に位置
をずらせて平行に配置されており、その内の3枚の端縁
を図中右側の対向壁から露出し、また2枚の端縁を図中
左側の対向壁から露出している。
The internal electrodes 1 are arranged parallel to each other with an interval therebetween, and the three edges thereof are exposed from the facing wall on the right side in the drawing, and the two edges are also exposed. Is exposed from the opposing wall on the left side in the figure.

【0014】この内部電極1は、ニッケル,銅等の卑金
属から選択される1種またはその合金の焼成物から成
る。
The internal electrode 1 is made of a fired product of one kind selected from base metals such as nickel and copper or an alloy thereof.

【0015】上記各外部電極4は、積層チップ3の壁面
にその周縁に及んで付設された第1層4aと、該第1層
4aの外面を覆うようにして付設された第2層4bと、
該第2層の外面を覆うようにして付設された第3層4c
とから構成されている。各外部電極4の第1層4aは夫
々の対向壁から露出する内部電極1の端縁に接合してい
る。
Each of the external electrodes 4 has a first layer 4a attached to the wall surface of the laminated chip 3 so as to extend to the periphery thereof, and a second layer 4b attached so as to cover the outer surface of the first layer 4a. ,
Third layer 4c attached so as to cover the outer surface of the second layer
It consists of and. The first layer 4a of each outer electrode 4 is joined to the edge of the inner electrode 1 exposed from the respective opposing wall.

【0016】この外部電極4の第1層4aは、内部電極
1と同様に卑金属または卑金属の合金から選択された焼
成物から成るが、必ずしも内部電極1と同一金属である
必要はない。また、外部電極4の第2層4bは、銅,ニ
ッケル,銀,金,パラジウム等から選択される金属皮膜
から成り、無電解めっき,溶射,蒸着等の各種めっき法
を用いて形成されている。更に、外部電極4の第3層4
cは、銀または銀合金の焼成物から成る。
The first layer 4a of the external electrode 4 is made of a fired material selected from a base metal or an alloy of a base metal like the internal electrode 1, but is not necessarily the same metal as the internal electrode 1. The second layer 4b of the external electrode 4 is made of a metal film selected from copper, nickel, silver, gold, palladium and the like, and is formed by using various plating methods such as electroless plating, thermal spraying and vapor deposition. . Furthermore, the third layer 4 of the external electrode 4
c is made of a fired product of silver or a silver alloy.

【0017】上記の積層セラミックコンデンサでは、内
部電極1に接続される外部電極4の第1層4aが内部電
極1と同じ卑金属または卑金属合金の焼成物から成るの
で、両者の馴染みがよくその境界部分に高い導通性と強
度を確保できる。また、外部電極4の第2層4bがめっ
き法による金属皮膜から成るので、第1層4a(卑金属
または卑金属合金の焼成物)と馴染みのよく両者の境界
部分に高い導通性と強度を確保できる。更に、外部電極
4の第3層4cが銀または銀合金の焼成物から成るの
で、第2層4b(めっき法による金属皮膜)と馴染みの
よく両者の境界部分に高い導通性と強度を確保できる。
In the above-mentioned laminated ceramic capacitor, since the first layer 4a of the external electrode 4 connected to the internal electrode 1 is made of a fired product of the same base metal or base metal alloy as the internal electrode 1, the two are well familiar and the boundary portion thereof. Very high conductivity and strength can be secured. Further, since the second layer 4b of the external electrode 4 is made of a metal film formed by a plating method, it is possible to ensure high conductivity and strength at the boundary between the first layer 4a and the first layer 4a (fired product of base metal or base metal alloy). . Furthermore, since the third layer 4c of the external electrode 4 is made of a fired product of silver or a silver alloy, it is well compatible with the second layer 4b (a metal film formed by a plating method), and high conductivity and strength can be secured at the boundary between the two. .

【0018】以下に、上記積層セラミックコンデンサの
好適な具体例をその製造方法を交えて説明する。
A preferred specific example of the above-mentioned multilayer ceramic capacitor will be described below together with its manufacturing method.

【0019】[具体例1]まず、非還元性のセラミック
組成物から成る厚さ10〜60μmのセラミックシ−ト
の一面に、内部電極となるニッケル粉末のペ−ストを数
μmの厚みで、しかも多数の長方形が規則的に並ぶよう
にして印刷する。そして印刷後のセラミックシ−トを1
枚宛平面方向に位置をずらして20〜100枚積層し、
これを積層方向に所定の大きさで切断してチップ材を形
成する。切断されたチップ材の対向壁には内部電極とな
るニッケル層が露出する。
[Specific Example 1] First, a surface of a ceramic sheet made of a non-reducing ceramic composition and having a thickness of 10 to 60 μm is coated with a paste of nickel powder as an internal electrode in a thickness of several μm. In addition, many rectangles are regularly arranged and printed. And 1 piece of ceramic sheet after printing
20 to 100 sheets are stacked by shifting the position in the plane direction to the sheet,
This is cut in a predetermined size in the stacking direction to form a chip material. A nickel layer which will be an internal electrode is exposed on the opposing wall of the cut chip material.

【0020】次に、このチップ材のニッケル層が露出す
る対向壁夫々に、外部電極の第1層となるニッケル粉末
のペ−ストを数μm〜数十μmの厚みをもって塗布す
る。そしてペ−スト塗布後のチップ材を、中性または還
元性雰囲気中で1300℃程度の温度で焼成する。この
焼成によってセラミック焼成体が得られると同時にペ−
ストの焼付けが行なわれる。
Next, a paste of nickel powder, which is the first layer of the external electrode, is applied to each of the facing walls where the nickel layer of the chip material is exposed with a thickness of several μm to several tens of μm. Then, the chip material after applying the paste is fired at a temperature of about 1300 ° C. in a neutral or reducing atmosphere. By this firing, a ceramic fired body is obtained and at the same time,
The strike is baked.

【0021】次に、外部電極の第1層となるニッケル層
の外面に、外部電極の第2層となる銅の皮膜を無電解め
っきによって形成する。ここで形成される銅皮膜の厚み
は数μm〜数十μmである。
Next, a copper film to be the second layer of the external electrode is formed on the outer surface of the nickel layer to be the first layer of the external electrode by electroless plating. The thickness of the copper film formed here is several μm to several tens μm.

【0022】次に、外部電極の第2層となる銅皮膜の外
面に、外部電極の第3層となる銀粉末のペ−ストを数μ
m〜数十μmの厚みをもって塗布する。そしてペ−スト
塗布後のチップ材を上記と同様に焼成してペ−ストの焼
付けを行なう。
Next, on the outer surface of the copper coating which is the second layer of the external electrode, a paste of silver powder which is the third layer of the external electrode is applied in a few μm.
It is applied with a thickness of m to several tens of μm. Then, the chip material after applying the paste is fired in the same manner as above to bake the paste.

【0023】以上で、内部電極1及び外部電極4の第1
層4aがニッケルの焼成物から成り、第2層4bが銅皮
膜から成り、第3層4cが銀の焼成物から成る、図1に
示すような積層セラミックコンデンサが製造される。
As described above, the first of the inner electrode 1 and the outer electrode 4 is
A monolithic ceramic capacitor as shown in FIG. 1 is manufactured in which the layer 4a is made of a fired product of nickel, the second layer 4b is made of a copper film, and the third layer 4c is made of a fired product of silver.

【0024】[具体例2]外部電極の第1層となるニッ
ケル層の外面に、外部電極の第2層となるニッケルの皮
膜をめっき法によって数μm〜数十μmの厚みで形成し
た他は、具体例1と同様にして積層セラミックコンデン
サを製造した。
[Specific Example 2] A nickel film, which is the second layer of the external electrode, is formed on the outer surface of the nickel layer, which is the first layer of the external electrode, by a plating method to a thickness of several μm to several tens of μm. A monolithic ceramic capacitor was manufactured in the same manner as in Example 1.

【0025】[具体例3]焼付けられた外部電極の第1
層となるニッケル層の外面に、外部電極の第2層となる
銀の皮膜をめっき法によって数μm〜数十μmの厚みで
形成した他は、具体例1と同様にして積層セラミックコ
ンデンサを製造した。
[Specific Example 3] First of baked external electrodes
A multilayer ceramic capacitor was manufactured in the same manner as in Example 1 except that a silver film to be the second layer of the external electrode was formed on the outer surface of the nickel layer to be the second layer by plating to a thickness of several μm to several tens of μm. did.

【0026】[具体例4]焼付けられた外部電極の第1
層となるニッケル層の外面に、外部電極の第2層となる
金の皮膜をめっき法によって数μm〜数十μmの厚みで
形成した他は、具体例1と同様にして積層セラミックコ
ンデンサを製造した。
[Example 4] First of baked external electrodes
A multilayer ceramic capacitor was manufactured in the same manner as in Example 1 except that a gold film to be the second layer of the external electrode was formed on the outer surface of the nickel layer to be the second layer by plating to a thickness of several μm to several tens of μm. did.

【0027】[比較例]第2層に相当する構成を除外
し、内部電極1及び外部電極4の第1層4aがニッケル
の焼成物から成り、第3層4cが銀の焼成物から成る積
層セラミックコンデンサを製造した。
Comparative Example Excluding the structure corresponding to the second layer, the first layer 4a of the internal electrode 1 and the external electrode 4 is made of a fired product of nickel, and the third layer 4c is made of a fired product of silver. A ceramic capacitor was manufactured.

【0028】図2には、上記の各製品を400個宛製造
し、JIS C5102で定められる温度サイクル試験
の前後で静電容量とtanδを夫々検査した結果を示し
てある。静電容量抜けは設定値よりも10%以上静電容
量が低下した個数を示してあり、またtanδ異常はt
anδが5%を越えた個数を示してある。
FIG. 2 shows the results of inspecting the electrostatic capacitance and tan δ before and after the temperature cycle test defined by JIS C5102 by manufacturing 400 of each of the above products. Capacitance loss indicates the number of capacitors whose capacitance has decreased by 10% or more from the set value, and tan δ abnormality indicates t
The number shows that an δ exceeds 5%.

【0029】図から理解されるように、比較例の製品で
は温度サイクル試験の後に静電容量抜けが10個発生
し、またtanδ異常が23個発生した。これに対し本
発明に係る具体例1乃至4の製品では、温度サイクル試
験の後でも静電容量抜けとtanδ異常が全く発生しな
かった。
As can be seen from the figure, in the product of the comparative example, 10 capacitance dropouts and 23 tan δ abnormalities occurred after the temperature cycle test. On the other hand, in the products of Examples 1 to 4 according to the present invention, no capacitance was lost and no tan δ abnormality occurred even after the temperature cycle test.

【0030】尚、内部電極及び外部電極の第1層として
ニッケル以外の卑金属または卑金属の合金を用いる場合
や、外部電極の第3層として銀以外の銀合金を用いる場
合でも同様の効果を得ることができる。
The same effect can be obtained when a base metal other than nickel or an alloy of a base metal is used as the first layer of the internal electrode and the external electrode, or when a silver alloy other than silver is used as the third layer of the external electrode. You can

【0031】[0031]

【発明の効果】以上詳述したように本発明によれば、内
部電極に材料価格の低い卑金属または卑金属の合金を用
いているのでコンデンサ自体を安価に形成できることに
加え、外部電極と内部電極の相互並びに外部電極を構成
する各層間に高い導通性を確保でき、温度サイクル試験
で静電容量抜けやtanδの悪化が起こらない利点があ
る。
As described above in detail, according to the present invention, since the internal electrode is formed of the base metal or the alloy of the base metal having a low material cost, the capacitor itself can be formed at a low cost, and the external electrode and the internal electrode can be formed. There is an advantage that high conductivity can be ensured between each other and between the respective layers forming the external electrode, and no capacitance omission or deterioration of tan δ occurs in the temperature cycle test.

【図面の簡単な説明】[Brief description of drawings]

【図1】積層セラミックコンデンサの断面図FIG. 1 is a sectional view of a monolithic ceramic capacitor.

【図2】検査結果を示す図FIG. 2 is a diagram showing inspection results.

【符号の説明】[Explanation of symbols]

1…内部電極、2…セラミック、3…積層チップ、4…
外部電極、4a…第1層、4b…第2層、4c…第3
層。
1 ... Internal electrode, 2 ... Ceramic, 3 ... Layered chip, 4 ...
External electrodes, 4a ... 1st layer, 4b ... 2nd layer, 4c ... 3rd
layer.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】セラミックを介して積層された複数の内部
電極と、内部電極と所定の接続関係をもって導通する一
対の外部電極とを具備した積層セラミックコンデンサに
おいて、上記内部電極を卑金属または卑金属合金の焼成
物から形成すると共に、上記外部電極を、卑金属または
卑金属合金の焼成物から成り内部電極に接続された第1
層と、金属皮膜から成り第1層の外面に付設された第2
層と、銀または銀合金の焼成物から成り第2層の外面に
付設された第3層とから構成した、ことを特徴とする積
層セラミックコンデンサ。
1. A monolithic ceramic capacitor comprising a plurality of internal electrodes laminated via ceramics, and a pair of external electrodes conducting with a predetermined connection relationship with the internal electrodes, wherein the internal electrodes are made of a base metal or a base metal alloy. A first electrode which is formed from a fired product and is connected to an internal electrode made of a fired product of a base metal or a base metal alloy.
A second layer attached to the outer surface of the first layer, which consists of a layer and a metal film
A multilayer ceramic capacitor comprising a layer and a third layer made of a fired product of silver or a silver alloy and attached to the outer surface of the second layer.
JP3030298A 1991-02-25 1991-02-25 Monolithic ceramic capacitors Expired - Lifetime JPH0793226B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3030298A JPH0793226B2 (en) 1991-02-25 1991-02-25 Monolithic ceramic capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3030298A JPH0793226B2 (en) 1991-02-25 1991-02-25 Monolithic ceramic capacitors

Publications (2)

Publication Number Publication Date
JPH04268710A JPH04268710A (en) 1992-09-24
JPH0793226B2 true JPH0793226B2 (en) 1995-10-09

Family

ID=12299838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3030298A Expired - Lifetime JPH0793226B2 (en) 1991-02-25 1991-02-25 Monolithic ceramic capacitors

Country Status (1)

Country Link
JP (1) JPH0793226B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
JP2011192968A (en) * 2010-02-19 2011-09-29 Murata Mfg Co Ltd Capacitor and method of manufacturing the same
JP7000779B2 (en) * 2017-09-28 2022-01-19 Tdk株式会社 Multilayer ceramic electronic components

Also Published As

Publication number Publication date
JPH04268710A (en) 1992-09-24

Similar Documents

Publication Publication Date Title
JP2567046B2 (en) Stacked displacement element
US5914556A (en) Piezoelectric element and method of manufacturing the same
JPH047574B2 (en)
JP2000124007A (en) Chip thermistor and method of producing the same
JPH0793226B2 (en) Monolithic ceramic capacitors
JP2000340448A (en) Laminated ceramic capacitor
JPH1140460A (en) Laminate ceramic electronic component
JP4302054B2 (en) PTC component and manufacturing method thereof
JP2680480B2 (en) Monolithic ceramic capacitors
JPS62211974A (en) Laminated piezoelectric element and manufacture thereof
JPH04312908A (en) Laminated ceramic capacitor
JP2000106322A (en) Laminated ceramic capacitor
JPH088192B2 (en) Monolithic ceramic capacitors
JPH01152712A (en) Formation of external electrode of laminated ceramic capacitor
JPH088193B2 (en) Monolithic ceramic capacitors
JP2892672B2 (en) Stacked displacement element
JPH08115844A (en) Monolithic ceramic capacitor
JP2626329B2 (en) Electronic components
JPH088194B2 (en) Monolithic ceramic capacitors
JPH08306576A (en) Electronic part and its manufacture
JP2678393B2 (en) Chip capacitor manufacturing method
JP3254927B2 (en) Ceramic electronic components
CN216773068U (en) Multilayer ceramic capacitor
WO2024075402A1 (en) Multilayer ceramic electronic component
JPS6311703Y2 (en)

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19960402