JPH04268710A - Laminated ceramic capacitor - Google Patents
Laminated ceramic capacitorInfo
- Publication number
- JPH04268710A JPH04268710A JP3030298A JP3029891A JPH04268710A JP H04268710 A JPH04268710 A JP H04268710A JP 3030298 A JP3030298 A JP 3030298A JP 3029891 A JP3029891 A JP 3029891A JP H04268710 A JPH04268710 A JP H04268710A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base metal
- silver
- electrode
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 21
- 239000010953 base metal Substances 0.000 claims abstract description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 10
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 16
- 238000007747 plating Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000012360 testing method Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000005856 abnormality Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電極材料に改良を施し
た積層セラミックコンデンサに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic capacitor having improved electrode materials.
【０００２】0002
【従来の技術】この種の積層セラミックコンデンサは、
平板状をなす複数の内部電極をセラミックを介して積層
して形成された積層チップと、該積層チップの対向壁に
付設された一対の外部電極とから構成されている。チッ
プ内の内部電極は交互に逆方向の外部電極に接続されて
おり、内部電極間で得られた所定の静電容量を外部電極
から取り出せるようになっている。[Prior art] This type of multilayer ceramic capacitor is
It consists of a stacked chip formed by stacking a plurality of flat internal electrodes with ceramic interposed therebetween, and a pair of external electrodes attached to opposing walls of the stacked chip. Internal electrodes within the chip are alternately connected to external electrodes in opposite directions, so that a predetermined capacitance obtained between the internal electrodes can be taken out from the external electrodes.
【０００３】上記の内部電極及び外部電極は、耐熱性及
び耐食性の関係から一般に銀や銀−パラジウム等の銀合
金から形成されている。しかし、これら銀または銀合金
は電極として優れた特性を有する反面、材料価格が高く
、このためコンデンサ自体のコストが高価になる欠点が
あり、とりわけ全体コストの３０〜４０％が内部電極に
依存している。[0003] The above-mentioned internal electrodes and external electrodes are generally made of silver or a silver alloy such as silver-palladium in view of heat resistance and corrosion resistance. However, although these silver or silver alloys have excellent properties as electrodes, they have the disadvantage of high material costs, which makes the cost of the capacitor itself expensive.In particular, 30 to 40% of the total cost depends on the internal electrodes. ing.
【０００４】積層セラミックコンデンサに係る価格的な
問題を解消するため、内部電極を安価な卑金属から形成
する試みもなされている。しかし、内部電極をニッケル
等の卑金属で形成した場合では、外部電極に銀または銀
合金を用いると両電極の馴染みが悪く、両電極に導通不
良を生じ易くなる欠点がある。In order to solve the cost problem associated with multilayer ceramic capacitors, attempts have been made to form internal electrodes from inexpensive base metals. However, when the internal electrodes are made of a base metal such as nickel, if silver or a silver alloy is used for the external electrodes, the two electrodes do not fit well, and there is a drawback that poor conductivity is likely to occur between the two electrodes.
【０００５】電極相互の馴染みの問題を解消するものと
して、内部電極を卑金属から形成する一方、外部電極を
、内部電極と同一または合金化した金属で形成され且つ
内部電極に接続される第１層と、銀または銀合金で形成
され且つ該第１層の外面に付設される第２層とから構成
したものも提案されている（特開昭５９−１６３２３号
公報参照）。つまり、この積層セラミックコンデンサで
は、内部電極に接続される外部電極の第１層を内部電極
と同一系の金属から形成することで、両電極の馴染みを
向上させ導通及び強度の改善を図っている。In order to solve the problem of mutual familiarity between the electrodes, the inner electrodes are made of a base metal, while the outer electrodes are made of the same or alloyed metal as the inner electrodes, and a first layer is connected to the inner electrodes. and a second layer made of silver or a silver alloy and attached to the outer surface of the first layer has also been proposed (see JP-A-59-16323). In other words, in this multilayer ceramic capacitor, the first layer of the external electrode connected to the internal electrode is formed from the same metal as the internal electrode, thereby improving the familiarity of both electrodes and improving conductivity and strength. .
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記の
積層セラミックコンデンサでは内部電極と外部電極の第
１層との馴染みを向上できる反面、外部電極の第１層と
第２層の金属原子の結合半径が異なるために両層の境界
部分の結合強度が弱く、温度サイクル試験により接続不
良を生じて静電容量抜けやｔａｎδの悪化が起こる欠点
がある。[Problems to be Solved by the Invention] However, although the above multilayer ceramic capacitor can improve the compatibility between the internal electrode and the first layer of the external electrode, the bonding radius of the metal atoms in the first layer and the second layer of the external electrode is limited. Because of the difference in the bonding strength between the two layers, the bonding strength at the boundary between the two layers is weak, resulting in poor connection during a temperature cycle test, resulting in loss of capacitance and deterioration of tan δ.
【０００７】本発明は上記問題点に鑑みてなされたもの
で、その目的とするところは、コンデンサ自体を安価に
形成できることは勿論のこと、外部電極の各層間に高い
導通性を確保でき、温度サイクル試験で静電容量抜けや
ｔａｎδの悪化が起こらない積層セラミックコンデンサ
を提供することにある。The present invention has been made in view of the above-mentioned problems, and its purpose is to not only make it possible to form a capacitor itself at low cost, but also to ensure high conductivity between each layer of the external electrode, and to maintain temperature control. An object of the present invention is to provide a multilayer ceramic capacitor that does not suffer from loss of capacitance or deterioration of tan δ during cycle tests.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
、本発明では、セラミックを介して積層された複数の内
部電極と、内部電極と所定の接続関係をもって導通する
一対の外部電極とを具備した積層セラミックコンデンサ
において、上記内部電極を卑金属または卑金属合金の焼
成物から形成すると共に、上記外部電極を、卑金属また
は卑金属合金の焼成物から成り内部電極に接続された第
１層と、金属皮膜から成り第１層の外面に付設された第
２層と、銀または銀合金の焼成物から成り第２層の外面
に付設された第３層とから構成している。[Means for Solving the Problems] In order to achieve the above object, the present invention includes a plurality of internal electrodes laminated with ceramic interposed therebetween, and a pair of external electrodes that are electrically connected to the internal electrodes in a predetermined connection relationship. In the multilayer ceramic capacitor, the internal electrode is formed of a fired product of a base metal or a base metal alloy, and the external electrode is made of a first layer made of a fired product of a base metal or a base metal alloy and connected to the internal electrode, and a metal film. The third layer is made of a fired product of silver or a silver alloy and is attached to the outer surface of the second layer.
【０００９】[0009]
【作用】本発明に係る積層セラミックコンデンサでは、
外部電極の第１層が内部電極と同じ卑金属または卑金属
合金の焼成物から成るので、両者の馴染みがよくその境
界部分に高い導通性と強度を確保できる。[Operation] In the multilayer ceramic capacitor according to the present invention,
Since the first layer of the external electrode is made of the same fired material of the base metal or base metal alloy as the internal electrode, the two are well compatible and high conductivity and strength can be ensured at the boundary portion.
【００１０】また、外部電極の第２層である金属皮膜は
各種めっき法により形成され結晶性の不完全な原子団毎
に第１層及び第３層に付着し、原子の結合半径の違いを
吸収した結晶性の不完全な相を多く含んだ膜となる。こ
のため原子の結合半径の違いに拘らず第１層及び第３層
との馴染みがよく、第１層と第３層との間に高い導通性
と強度を得ることができる。[0010] Furthermore, the metal film, which is the second layer of the external electrode, is formed by various plating methods, and is attached to the first and third layers for each atomic group with incomplete crystallinity, to compensate for the difference in the bond radius of atoms. The resulting film contains many absorbed crystalline incomplete phases. Therefore, it is compatible with the first layer and the third layer regardless of the difference in bond radius of atoms, and high conductivity and strength can be obtained between the first layer and the third layer.
【００１１】[0011]
【実施例】図１は本発明を適用した積層セラミックコン
デンサの断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view of a multilayer ceramic capacitor to which the present invention is applied.
【００１２】この積層セラミックコンデンサは、平板状
をなす複数（図中は５枚）の内部電極１をセラミック２
を介して積層して形成された角形の積層チップ３と、該
積層チップ３の内部電極方向の対向壁に付設された一対
の外部電極４とから構成されている。This multilayer ceramic capacitor has a plurality of flat plate-shaped internal electrodes 1 (five in the figure) made of ceramic 2.
It is composed of a rectangular multilayer chip 3 formed by stacking the multilayer chip 3 with the multilayer chip 3 interposed therebetween, and a pair of external electrodes 4 attached to opposing walls of the multilayer chip 3 in the direction of the internal electrodes.
【００１３】上記内部電極１は間隔をおいて交互に位置
をずらせて平行に配置されており、その内の３枚の端縁
を図中右側の対向壁から露出し、また２枚の端縁を図中
左側の対向壁から露出している。The internal electrodes 1 are arranged parallel to each other at intervals, with three edges exposed from the opposing wall on the right side in the figure, and two edges exposed from the opposing wall on the right side of the figure. is exposed from the opposite wall on the left side of the figure.
【００１４】この内部電極１は、ニッケル，銅等の卑金
属から選択される１種またはその合金の焼成物から成る
。The internal electrode 1 is made of a fired product of one selected from base metals such as nickel and copper or an alloy thereof.
【００１５】上記各外部電極４は、積層チップ３の壁面
にその周縁に及んで付設された第１層４ａと、該第１層
４ａの外面を覆うようにして付設された第２層４ｂと、
該第２層の外面を覆うようにして付設された第３層４ｃ
とから構成されている。各外部電極４の第１層４ａは夫
々の対向壁から露出する内部電極１の端縁に接合してい
る。Each of the external electrodes 4 includes a first layer 4a attached to the wall surface of the multilayer chip 3 extending to its periphery, and a second layer 4b attached so as to cover the outer surface of the first layer 4a. ,
A third layer 4c attached to cover the outer surface of the second layer
It is composed of. The first layer 4a of each external electrode 4 is joined to the edge of the internal electrode 1 exposed from the respective opposing wall.
【００１６】この外部電極４の第１層４ａは、内部電極
１と同様に卑金属または卑金属の合金から選択された焼
成物から成るが、必ずしも内部電極１と同一金属である
必要はない。また、外部電極４の第２層４ｂは、銅，ニ
ッケル，銀，金，パラジウム等から選択される金属皮膜
から成り、無電解めっき，溶射，蒸着等の各種めっき法
を用いて形成されている。更に、外部電極４の第３層４
ｃは、銀または銀合金の焼成物から成る。Like the internal electrode 1, the first layer 4a of the external electrode 4 is made of a fired material selected from a base metal or an alloy of base metals, but does not necessarily have to be made of the same metal as the internal electrode 1. The second layer 4b of the external electrode 4 is made of a metal film selected from copper, nickel, silver, gold, palladium, etc., and is formed using various plating methods such as electroless plating, thermal spraying, and vapor deposition. . Furthermore, the third layer 4 of the external electrode 4
c consists of a fired product of silver or a silver alloy.
【００１７】上記の積層セラミックコンデンサでは、内
部電極１に接続される外部電極４の第１層４ａが内部電
極１と同じ卑金属または卑金属合金の焼成物から成るの
で、両者の馴染みがよくその境界部分に高い導通性と強
度を確保できる。また、外部電極４の第２層４ｂがめっ
き法による金属皮膜から成るので、第１層４ａ（卑金属
または卑金属合金の焼成物）と馴染みのよく両者の境界
部分に高い導通性と強度を確保できる。更に、外部電極
４の第３層４ｃが銀または銀合金の焼成物から成るので
、第２層４ｂ（めっき法による金属皮膜）と馴染みのよ
く両者の境界部分に高い導通性と強度を確保できる。In the above-mentioned multilayer ceramic capacitor, the first layer 4a of the external electrode 4 connected to the internal electrode 1 is made of the same fired material of the base metal or base metal alloy as the internal electrode 1, so that the two are compatible with each other, and the boundary portion between the two is good. High conductivity and strength can be ensured. In addition, since the second layer 4b of the external electrode 4 is made of a metal film formed by plating, it is compatible with the first layer 4a (baked metal or base metal alloy), and high conductivity and strength can be ensured at the boundary between the two. . Furthermore, since the third layer 4c of the external electrode 4 is made of a fired product of silver or silver alloy, it is compatible with the second layer 4b (metal film formed by plating) and can ensure high conductivity and strength at the boundary between the two. .
【００１８】以下に、上記積層セラミックコンデンサの
好適な具体例をその製造方法を交えて説明する。[0018] Preferred specific examples of the above-mentioned multilayer ceramic capacitor will be explained below, along with a manufacturing method thereof.
【００１９】［具体例１］まず、非還元性のセラミック
組成物から成る厚さ１０〜６０μｍのセラミックシ−ト
の一面に、内部電極となるニッケル粉末のペ−ストを数
μｍの厚みで、しかも多数の長方形が規則的に並ぶよう
にして印刷する。そして印刷後のセラミックシ−トを１
枚宛平面方向に位置をずらして２０〜１００枚積層し、
これを積層方向に所定の大きさで切断してチップ材を形
成する。切断されたチップ材の対向壁には内部電極とな
るニッケル層が露出する。[Specific Example 1] First, a paste of nickel powder, which will become an internal electrode, is applied to a thickness of several μm on one side of a ceramic sheet made of a non-reducible ceramic composition and having a thickness of 10 to 60 μm. Furthermore, the printing is performed so that a large number of rectangles are arranged regularly. Then, 1 ceramic sheet after printing.
Stack 20 to 100 sheets with their positions shifted in the direction of the sheet plane,
This is cut into a predetermined size in the stacking direction to form a chip material. A nickel layer serving as an internal electrode is exposed on the opposite wall of the cut chip material.
【００２０】次に、このチップ材のニッケル層が露出す
る対向壁夫々に、外部電極の第１層となるニッケル粉末
のペ−ストを数μｍ〜数十μｍの厚みをもって塗布する
。そしてペ−スト塗布後のチップ材を、中性または還元
性雰囲気中で１３００℃程度の温度で焼成する。この焼
成によってセラミック焼成体が得られると同時にペ−ス
トの焼付けが行なわれる。Next, a paste of nickel powder, which will become the first layer of the external electrode, is applied to each of the opposing walls of the chip material where the nickel layer is exposed to a thickness of several μm to several tens of μm. After applying the paste, the chip material is fired at a temperature of about 1300 DEG C. in a neutral or reducing atmosphere. By this firing, a fired ceramic body is obtained and at the same time the paste is fired.
【００２１】次に、外部電極の第１層となるニッケル層
の外面に、外部電極の第２層となる銅の皮膜を無電解め
っきによって形成する。ここで形成される銅皮膜の厚み
は数μｍ〜数十μｍである。Next, a copper film, which will become the second layer of the external electrode, is formed on the outer surface of the nickel layer, which will become the first layer of the external electrode, by electroless plating. The thickness of the copper film formed here is several μm to several tens of μm.
【００２２】次に、外部電極の第２層となる銅皮膜の外
面に、外部電極の第３層となる銀粉末のペ−ストを数μ
ｍ〜数十μｍの厚みをもって塗布する。そしてペ−スト
塗布後のチップ材を上記と同様に焼成してペ−ストの焼
付けを行なう。Next, several μm of silver powder paste, which will become the third layer of the external electrode, is applied to the outer surface of the copper film, which will become the second layer of the external electrode.
Coat with a thickness of m to several tens of μm. After applying the paste, the chip material is fired in the same manner as described above to bake the paste.
【００２３】以上で、内部電極１及び外部電極４の第１
層４ａがニッケルの焼成物から成り、第２層４ｂが銅皮
膜から成り、第３層４ｃが銀の焼成物から成る、図１に
示すような積層セラミックコンデンサが製造される。[0023] In the above, the first
A multilayer ceramic capacitor as shown in FIG. 1 is manufactured in which the layer 4a is made of a fired product of nickel, the second layer 4b is made of a copper film, and the third layer 4c is made of a fired product of silver.
【００２４】［具体例２］外部電極の第１層となるニッ
ケル層の外面に、外部電極の第２層となるニッケルの皮
膜をめっき法によって数μｍ〜数十μｍの厚みで形成し
た他は、具体例１と同様にして積層セラミックコンデン
サを製造した。[Specific Example 2] A nickel film, which will become the second layer of the external electrode, is formed by plating on the outer surface of the nickel layer, which will become the first layer of the external electrode, to a thickness of several μm to several tens of μm. A multilayer ceramic capacitor was manufactured in the same manner as in Example 1.
【００２５】［具体例３］焼付けられた外部電極の第１
層となるニッケル層の外面に、外部電極の第２層となる
銀の皮膜をめっき法によって数μｍ〜数十μｍの厚みで
形成した他は、具体例１と同様にして積層セラミックコ
ンデンサを製造した。[Specific Example 3] First baked external electrode
A multilayer ceramic capacitor was manufactured in the same manner as in Example 1, except that a silver film, which would become the second layer of the external electrode, was formed with a thickness of several μm to several tens of μm on the outer surface of the nickel layer, which would be the second layer of the external electrode. did.
【００２６】［具体例４］焼付けられた外部電極の第１
層となるニッケル層の外面に、外部電極の第２層となる
金の皮膜をめっき法によって数μｍ〜数十μｍの厚みで
形成した他は、具体例１と同様にして積層セラミックコ
ンデンサを製造した。[Specific Example 4] First baked external electrode
A multilayer ceramic capacitor was manufactured in the same manner as in Example 1, except that a gold film, which would become the second layer of the external electrode, was formed on the outer surface of the nickel layer to a thickness of several μm to several tens of μm by plating. did.
【００２７】［比較例］第２層に相当する構成を除外し
、内部電極１及び外部電極４の第１層４ａがニッケルの
焼成物から成り、第３層４ｃが銀の焼成物から成る積層
セラミックコンデンサを製造した。[Comparative Example] Excluding the structure corresponding to the second layer, the first layer 4a of the internal electrode 1 and the external electrode 4 is made of a fired product of nickel, and the third layer 4c is made of a fired product of silver. Manufactured ceramic capacitors.
【００２８】図２には、上記の各製品を４００個宛製造
し、ＪＩＳ Ｃ５１０２で定められる温度サイクル試
験の前後で静電容量とｔａｎδを夫々検査した結果を示
してある。静電容量抜けは設定値よりも１０％以上静電
容量が低下した個数を示してあり、またｔａｎδ異常は
ｔａｎδが５％を越えた個数を示してある。FIG. 2 shows the results of manufacturing 400 units of each of the above products and testing the capacitance and tan δ before and after the temperature cycle test specified in JIS C5102. Capacitance loss indicates the number of capacitances that have decreased by 10% or more from the set value, and tan δ abnormality indicates the number of capacitances that have tan δ exceeding 5%.
【００２９】図から理解されるように、比較例の製品で
は温度サイクル試験の後に静電容量抜けが１０個発生し
、またｔａｎδ異常が２３個発生した。これに対し本発
明に係る具体例１乃至４の製品では、温度サイクル試験
の後でも静電容量抜けとｔａｎδ異常が全く発生しなか
った。As can be seen from the figure, in the product of the comparative example, 10 capacitance losses occurred after the temperature cycle test, and 23 tan δ abnormalities occurred. On the other hand, in the products of Examples 1 to 4 according to the present invention, capacitance loss and tan δ abnormality did not occur at all even after the temperature cycle test.
【００３０】尚、内部電極及び外部電極の第１層として
ニッケル以外の卑金属または卑金属の合金を用いる場合
や、外部電極の第３層として銀以外の銀合金を用いる場
合でも同様の効果を得ることができる。[0030] The same effect can be obtained even when a base metal or an alloy of a base metal other than nickel is used as the first layer of the internal electrode and the external electrode, or when a silver alloy other than silver is used as the third layer of the external electrode. Can be done.
【００３１】[0031]
【発明の効果】以上詳述したように本発明によれば、内
部電極に材料価格の低い卑金属または卑金属の合金を用
いているのでコンデンサ自体を安価に形成できることに
加え、外部電極と内部電極の相互並びに外部電極を構成
する各層間に高い導通性を確保でき、温度サイクル試験
で静電容量抜けやｔａｎδの悪化が起こらない利点があ
る。Effects of the Invention As described in detail above, according to the present invention, since a base metal or a base metal alloy with low material cost is used for the internal electrode, the capacitor itself can be formed at low cost. It has the advantage that high conductivity can be ensured between each other and between the layers constituting the external electrodes, and capacitance loss and tan δ deterioration do not occur in temperature cycle tests.
【図１】積層セラミックコンデンサの断面図[Figure 1] Cross-sectional view of a multilayer ceramic capacitor
【図２】検
査結果を示す図[Figure 2] Diagram showing test results
１…内部電極、２…セラミック、３…積層チップ、４…
外部電極、４ａ…第１層、４ｂ…第２層、４ｃ…第３層
。1... Internal electrode, 2... Ceramic, 3... Laminated chip, 4...
External electrode, 4a...first layer, 4b...second layer, 4c...third layer.
Claims (1)
電極と、内部電極と所定の接続関係をもって導通する一
対の外部電極とを具備した積層セラミックコンデンサに
おいて、上記内部電極を卑金属または卑金属合金の焼成
物から形成すると共に、上記外部電極を、卑金属または
卑金属合金の焼成物から成り内部電極に接続された第１
層と、金属皮膜から成り第１層の外面に付設された第２
層と、銀または銀合金の焼成物から成り第２層の外面に
付設された第３層とから構成した、ことを特徴とする積
層セラミックコンデンサ。1. A multilayer ceramic capacitor comprising a plurality of internal electrodes laminated with ceramic interposed therebetween and a pair of external electrodes that are electrically connected to the internal electrodes in a predetermined connection relationship, wherein the internal electrodes are made of a base metal or a base metal alloy. The outer electrode is formed from a fired product, and the outer electrode is made of a fired product of a base metal or a base metal alloy, and is connected to the inner electrode.
a second layer made of a metal coating and attached to the outer surface of the first layer;
1. A multilayer ceramic capacitor comprising a third layer made of a fired product of silver or a silver alloy and attached to the outer surface of the second layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030298A JPH0793226B2 (en) | 1991-02-25 | 1991-02-25 | Monolithic ceramic capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3030298A JPH0793226B2 (en) | 1991-02-25 | 1991-02-25 | Monolithic ceramic capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04268710A true JPH04268710A (en) | 1992-09-24 |
| JPH0793226B2 JPH0793226B2 (en) | 1995-10-09 |
Family
ID=12299838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3030298A Expired - Lifetime JPH0793226B2 (en) | 1991-02-25 | 1991-02-25 | Monolithic ceramic capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793226B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110205684A1 (en) * | 2010-02-19 | 2011-08-25 | Murata Manufacturing Co., Ltd. | Capacitor and method for manufacturing the same |
| US9666366B2 (en) | 2002-04-15 | 2017-05-30 | Avx Corporation | Method of making multi-layer electronic components with plated terminations |
| JP2019067829A (en) * | 2017-09-28 | 2019-04-25 | Tdk株式会社 | Multilayer ceramic electronic component |
-
1991
- 1991-02-25 JP JP3030298A patent/JPH0793226B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9666366B2 (en) | 2002-04-15 | 2017-05-30 | Avx Corporation | Method of making multi-layer electronic components with plated terminations |
| US10020116B2 (en) | 2002-04-15 | 2018-07-10 | Avx Corporation | Plated terminations |
| US10366835B2 (en) | 2002-04-15 | 2019-07-30 | Avx Corporation | Plated terminations |
| US11195659B2 (en) | 2002-04-15 | 2021-12-07 | Avx Corporation | Plated terminations |
| US20110205684A1 (en) * | 2010-02-19 | 2011-08-25 | Murata Manufacturing Co., Ltd. | Capacitor and method for manufacturing the same |
| US8508912B2 (en) * | 2010-02-19 | 2013-08-13 | Murata Manufacturing Co., Ltd. | Capacitor and method for manufacturing the same |
| JP2019067829A (en) * | 2017-09-28 | 2019-04-25 | Tdk株式会社 | Multilayer ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0793226B2 (en) | 1995-10-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960402 |