JPH07328572A - Ultrasonic washing method and apparatus - Google Patents
Ultrasonic washing method and apparatusInfo
- Publication number
- JPH07328572A JPH07328572A JP12606994A JP12606994A JPH07328572A JP H07328572 A JPH07328572 A JP H07328572A JP 12606994 A JP12606994 A JP 12606994A JP 12606994 A JP12606994 A JP 12606994A JP H07328572 A JPH07328572 A JP H07328572A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- ultrasonic
- cleaned
- substrate
- ultrasonic waves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、超音波を利用した洗浄
方法及び装置に係り、特に、平面基板の洗浄に際して基
板の両面に対して高い洗浄効果を安定して得ることので
きる超音波洗浄方法及び装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning method and apparatus using ultrasonic waves, and more particularly, to ultrasonic cleaning capable of stably obtaining a high cleaning effect on both surfaces of a flat substrate during cleaning. A method and apparatus.
【０００２】[0002]
【従来の技術】被洗浄物を洗浄液中に浸漬して、これに
超音波を照射して洗浄する装置としては、例えば、特開
平２−９０５２５号公報に記載のように、上部を開放型
にした洗浄槽の底部に超音波振動子を取付け、被洗浄物
の洗浄表面を該超音波振動子に垂直の方向に洗浄槽内に
浸漬して、洗浄する方法があった。2. Description of the Related Art As an apparatus for immersing an object to be cleaned in a cleaning liquid and irradiating it with ultrasonic waves to clean the object, for example, as disclosed in Japanese Patent Application Laid-Open No. 2-90525, an upper part is an open type. There is a method in which an ultrasonic vibrator is attached to the bottom of the cleaning tank, and the surface to be cleaned of the object to be cleaned is immersed in the cleaning tank in a direction perpendicular to the ultrasonic vibrator for cleaning.
【０００３】[0003]
【発明が解決しようとする課題】しかし、従来の技術で
は、被洗浄物の洗浄面と超音波振動の進行方向との位置
関係については考慮されていなかった。However, in the prior art, the positional relationship between the cleaning surface of the object to be cleaned and the traveling direction of ultrasonic vibration was not taken into consideration.
【０００４】ここで、洗浄に使用される超音波のうち、
発振周波数が４００kHz以上の超音波は直進性が強く、
振動子から発振された超音波は振動子表面に対し垂直の
方向に直線的に進行する。従って、この超音波の進行方
向範囲内に存在する物質に対しては超音波による洗浄効
果が生じるが、超音波の進行方向範囲外では洗浄効果は
著しく低下する。さらに、超音波の進行方向に対して影
になる部分には超音波が廻り込まないため、超音波の進
行方向に対して影になる部分の洗浄効果が著しく劣化す
るという問題もあった。特に平面基板の両面洗浄におい
ては、洗浄液中に被洗浄物である平面基板を浸漬する際
に、平面基板が超音波の進行方向に対して傾斜した場
合、影になる方向の基板表面には所望する洗浄効果が得
られなくなるという問題があった。Among the ultrasonic waves used for cleaning,
Ultrasonic waves with an oscillating frequency of 400 kHz or more have a strong straight line,
The ultrasonic waves oscillated from the oscillator travel linearly in a direction perpendicular to the oscillator surface. Therefore, although the cleaning effect by the ultrasonic wave is generated on the substance existing within the range of the ultrasonic wave traveling direction, the cleaning effect is remarkably reduced outside the range of the ultrasonic wave traveling direction. Further, since the ultrasonic waves do not wrap around in the shadowed direction of the ultrasonic wave, there is a problem that the cleaning effect of the shadowed area in the ultrasonic wave direction is significantly deteriorated. In particular, in double-sided cleaning of a flat substrate, when the flat substrate, which is the object to be cleaned, is immersed in the cleaning liquid, if the flat substrate is inclined with respect to the traveling direction of the ultrasonic wave, the flat surface of the substrate is desired to be shaded. There is a problem that the cleaning effect to be obtained cannot be obtained.
【０００５】[0005]
【課題を解決するための手段】本発明では、被洗浄物で
ある平面基板を超音波の進行方向に対して傾斜するよう
に回転・揺動することにより、平面基板の両面が交互に
超音波の進行方向内に入るようにする。その結果、平面
基板の一方の面が超音波の進行方向に対して影になるこ
とを防止し、平面基板の両面に交互に超音波が照射され
るようにすることにより、安定して高い超音波洗浄効果
が得られるようにする。According to the present invention, the flat substrate, which is the object to be cleaned, is rotated and oscillated so as to be inclined with respect to the traveling direction of the ultrasonic waves, so that both sides of the flat substrate are alternately subjected to ultrasonic waves. So that it is in the direction of travel. As a result, one surface of the flat substrate is prevented from being shaded with respect to the traveling direction of the ultrasonic waves, and the ultrasonic waves are alternately irradiated to both surfaces of the flat substrate, so that a high ultrasonic wave is stably generated. Ensure that a sonic cleaning effect is obtained.
【０００６】[0006]
【作用】上記した手段によれば、被洗浄物である平面基
板の表面は回転・揺動によって交互に超音波の進行方向
側に向くことになり、交互に平面基板の両面に超音波が
照射されるので、基板両面について安定した洗浄効果を
得ることができる。According to the above-mentioned means, the surface of the flat substrate, which is the object to be cleaned, is alternately turned toward the traveling direction of the ultrasonic waves by the rotation and the swing, and the ultrasonic waves are alternately applied to both surfaces of the flat substrate. Therefore, a stable cleaning effect can be obtained on both sides of the substrate.
【０００７】[0007]
【実施例】図１は本発明に基づく超音波洗浄装置の一実
施例を示す概略断面図である。また、図２は同側面の断
面図である。1 is a schematic sectional view showing an embodiment of an ultrasonic cleaning apparatus according to the present invention. 2 is a sectional view of the same side surface.
【０００８】図１より、洗浄槽１の底部には超音波振動
子２が設けられている。洗浄液３は洗浄槽１の側面底部
より洗浄槽内に供給され、洗浄槽１内を上昇して洗浄槽
１の側壁上部よりオーバフローする。被洗浄物である平
面基板４は基板ホルダ５に支持されて洗浄液中に浸漬さ
れる。該基板ホルダ５は支持棒６によって駆動モータ７
に接続されている。基板ホルダ５に支持された平面基板
４は、超音波の進行方向と平面基板４の表面とが成す角
度がθになるまで、駆動モータ７によって一方向に回転
し傾斜される。超音波の進行方向と平面基板４の表面と
が成す角度がθになった後、再び駆動モータ７によって
逆方向に回転し、超音波の進行方向と平面基板４の反対
側表面とが成す角度がθになるまで回転し、傾斜され
る。所定の洗浄時間が経過するまで、この回転運動を繰
り返すことによって、平面基板４は揺動され、基板の両
面に超音波を照射して洗浄される。超音波の進行方向と
平面基板４の表面とが成す角度がθになるまで平面基板
４及び基板ホルダ５を傾斜させた状態を図２に示す。As shown in FIG. 1, an ultrasonic vibrator 2 is provided at the bottom of the cleaning tank 1. The cleaning liquid 3 is supplied into the cleaning tank from the bottom of the side surface of the cleaning tank 1, rises in the cleaning tank 1, and overflows from the upper portion of the side wall of the cleaning tank 1. The flat substrate 4, which is the object to be cleaned, is supported by the substrate holder 5 and immersed in the cleaning liquid. The substrate holder 5 is driven by a support rod 6 to drive a motor 7
It is connected to the. The plane substrate 4 supported by the substrate holder 5 is rotated and tilted in one direction by the drive motor 7 until the angle formed by the traveling direction of ultrasonic waves and the surface of the plane substrate 4 becomes θ. After the angle formed by the traveling direction of the ultrasonic wave and the surface of the flat substrate 4 becomes θ, the drive motor 7 rotates in the opposite direction again, and the angle formed by the traveling direction of the ultrasonic wave and the surface on the opposite side of the flat substrate 4. Is rotated and tilted until becomes θ. By repeating this rotational movement until the predetermined cleaning time elapses, the flat substrate 4 is swung, and both surfaces of the substrate are irradiated with ultrasonic waves for cleaning. FIG. 2 shows a state in which the plane substrate 4 and the substrate holder 5 are tilted until the angle formed by the traveling direction of ultrasonic waves and the surface of the plane substrate 4 becomes θ.
【０００９】ここで、図２に示した点線は超音波の進行
方向を表す。即ち、４００kHz以上の超音波は直進性が
強く、振動子から発振された超音波は振動子表面に対し
垂直の方向に直線的に進行する。従って、この超音波の
進行方向範囲内に存在する物質に対しては超音波による
洗浄効果が生じるが、超音波の進行方向範囲外では洗浄
効果は著しく低下する。さらに、超音波の進行方向に対
して影になる部分には超音波が廻り込まないため、超音
波の進行方向に対して影になる部分の洗浄効果が著しく
劣化する。したがって、複数枚の平面基板を洗浄液３中
に浸漬するならば、平面基板が互いの平面基板の影にな
らないように基板の間隔をとることが必要である。たと
えば、一辺が１００mmで厚さ１mmの平面基板を洗浄する
場合、超音波の進行方向と平面基板４の表面とが成す角
度を５度とすれば、基板が互いの基板の影にならないた
めには基板の間隔を１０mm程度とることが必要である。
超音波の進行方向と平面基板４の表面とが成す角度が大
きくなれば超音波の進行方向に対して影になる部分も広
くなるため、基板同士の間隔をより大きくとる必要があ
る。The dotted line shown in FIG. 2 represents the traveling direction of ultrasonic waves. That is, an ultrasonic wave of 400 kHz or more has a strong straight traveling property, and an ultrasonic wave oscillated from the oscillator travels linearly in a direction perpendicular to the oscillator surface. Therefore, although the cleaning effect by the ultrasonic wave is generated on the substance existing within the range of the ultrasonic wave traveling direction, the cleaning effect is remarkably reduced outside the range of the ultrasonic wave traveling direction. Furthermore, since the ultrasonic waves do not wrap around in the shadow of the direction of travel of the ultrasonic waves, the effect of cleaning the areas shadowed in the direction of travel of the ultrasonic waves is significantly degraded. Therefore, if a plurality of flat substrates are immersed in the cleaning liquid 3, it is necessary to space the flat substrates so that they do not shade each other. For example, when cleaning a flat substrate having a side of 100 mm and a thickness of 1 mm, if the angle between the traveling direction of ultrasonic waves and the surface of the flat substrate 4 is set to 5 degrees, the substrates do not shade each other. It is necessary to set the distance between the substrates to about 10 mm.
If the angle formed by the traveling direction of ultrasonic waves and the surface of the flat substrate 4 increases, the shadowed portion also widens with respect to the traveling direction of ultrasonic waves, so it is necessary to increase the distance between the substrates.
【００１０】超音波の進行方向と平面基板の洗浄面とが
成す角度は大きいほど基板表面への超音波の照射には有
利であるが、基板間隔を広くとらなければならないた
め、洗浄槽の大型化などの問題がある。実用上有効な角
度は１度から１５度程度である。洗浄槽の大きさに十分
余裕がある場合もしくは基板を１枚ずつ洗浄する場合に
は傾斜角度をこれより大きくとっても実用上何ら問題は
無い。The larger the angle between the traveling direction of ultrasonic waves and the cleaning surface of the flat substrate, the more advantageous it is to irradiate ultrasonic waves to the substrate surface. However, since the substrate interval must be wide, a large cleaning tank is required. There is a problem such as commutation. The practically effective angle is about 1 to 15 degrees. When the size of the cleaning tank is sufficiently large, or when the substrates are cleaned one by one, there is no practical problem even if the inclination angle is set larger than this.
【００１１】図１に示す洗浄装置を用い、一辺１００mm
で厚さ１mmの平面ガラス基板を２枚ずつを洗浄したとき
の洗浄結果を以下に示す。Using the cleaning apparatus shown in FIG. 1, a side of 100 mm
The following shows the cleaning results when two flat glass substrates each having a thickness of 1 mm were cleaned.
【００１２】超音波発振周波数は５００kHz、洗浄時間
３分間、基板間隔２０mmである。The ultrasonic oscillation frequency is 500 kHz, the cleaning time is 3 minutes, and the substrate interval is 20 mm.
【００１３】＜洗浄条件１＞平面基板の揺動なし、角度
０度（被洗浄面が超音波発振子に概略垂直のまま） ＜洗浄条件２＞平面基板の揺動３回、角度５度（基板表
面が交互に３回超音波発振子側を向くように回転） 被洗浄物である平面ガラス基板４枚の表面には、あらか
じめ同数程度のＳｉ粒子を付着させておく。洗浄前のＳ
ｉ粒子の付着数と洗浄後のＳｉ粒子の付着数から次式に
よってＳｉ粒子の除去率を求め、洗浄効果を比較した。<Cleaning condition 1> No swing of the flat substrate, angle 0 ° (the surface to be cleaned remains substantially perpendicular to the ultrasonic oscillator) <Cleaning condition 2> Swing of the flat substrate 3 times, angle 5 ° ( The surface of the substrate is alternately rotated three times so as to face the ultrasonic oscillator side. About the same number of Si particles are previously attached to the surfaces of the four flat glass substrates that are the objects to be cleaned. S before washing
The removal rate of Si particles was calculated by the following equation from the number of attached i particles and the number of attached Si particles after cleaning, and the cleaning effects were compared.
【００１４】除去率(％)＝１００×(洗浄前の付着数−
洗浄後の付着数)/洗浄前の付着数なお、基板は両面の洗
浄効果を比較するため、便宜上一方を表、他方を裏と表
記した。Removal rate (%) = 100 × (number of adhesion before cleaning−
(Number of adhesion after cleaning) / Number of adhesion before cleaning In order to compare the cleaning effects on both surfaces of the substrate, one is represented as the front and the other as the back.
【００１５】 表１ 洗浄効果の比較結果 角度 基板面 洗浄前付着数 洗浄後付着数 除去率(%) ０度 表 ６７５ ８０ ８８ 裏 ７７２ １８５ ７６ 表 ７２１ １５２ ７９ 裏 ７０５ １０２ ８６ ５度 表 ７８９ ７４ ９１ 裏 ６２５ ７０ ８９ 表 ７５５ ７１ ９１ 裏 ７３４ ６８ ９１ 表１より、揺動を行わないで洗浄した場合には、Ｓｉ粒
子の除去率は７６％から８８％とばらつきが大きい。ま
た、一枚の基板の表面と裏面では除去率の差が７から１
２％程度ある。一方、超音波の進行方向と基板表面とが
成す角度が５度になるように揺動して洗浄した場合には
除去率は８９から９１％とほぼ一定になっており、さら
に表面と裏面の除去率の差は０から２％であり、基板両
面に安定した洗浄効果が得られていることがわかる。更
に、揺動を行って洗浄した方が揺動を行わないで洗浄し
た場合よりも５から１０％以上も高い除去率を示してお
り、本発明に基づいた洗浄装置をもちいれば、安定して
かつ高い洗浄効果を得られることがわかる。Table 1 Results of Comparison of Cleaning Effects Angle Substrate Surface Number of Adhesions Before Cleaning Number of Adhesions After Cleaning Removal Rate (%) 0 Degree Table 675 80 88 Back 772 185 76 76 Table 721 152 79 Back 705 102 86 5 Degree Table 789 74 91 Back 625 70 89 Table 755 71 91 Back 734 68 91 Table 1 shows that when cleaning is performed without rocking, the removal rate of Si particles varies widely from 76% to 88%. Moreover, the difference in removal rate between the front surface and the back surface of one substrate is 7 to 1
There is about 2%. On the other hand, when the cleaning is performed by rocking so that the angle formed by the traveling direction of the ultrasonic wave and the front surface of the substrate becomes 5 degrees, the removal rate is almost constant from 89 to 91%. The difference in the removal rate is 0 to 2%, which shows that a stable cleaning effect is obtained on both surfaces of the substrate. Further, the cleaning with rocking shows a higher removal rate of 5 to 10% or more than the cleaning without rocking, and if the cleaning device according to the present invention is used, it is stable. It can be seen that a high cleaning effect can be obtained.
【００１６】[0016]
【発明の効果】本発明によれば、被洗浄物の洗浄面を交
互に超音波の進行方向に向けることができるため、一方
の表面が他方の影になることが無いので、基板の両面に
交互に超音波が照射されることにより、基板の両面で高
い洗浄効果を安定して得ることができる。According to the present invention, since the cleaning surface of the object to be cleaned can be alternately directed in the traveling direction of the ultrasonic waves, one surface does not become a shadow of the other, so that both surfaces of the substrate can be covered. By alternately applying ultrasonic waves, a high cleaning effect can be stably obtained on both surfaces of the substrate.
【図１】本発明である超音波洗浄方法の一実施例を示す
ための超音波洗浄装置の概略断面図である。FIG. 1 is a schematic sectional view of an ultrasonic cleaning apparatus for showing an embodiment of the ultrasonic cleaning method of the present invention.
【図２】図１に示した本発明に基づく超音波洗浄装置の
側面の概略断面図である。FIG. 2 is a schematic side sectional view of the ultrasonic cleaning apparatus according to the present invention shown in FIG.
１…洗浄槽、 ２…超音波振動子、 ３…洗浄液、 ４…平面基板、 ５…基板ホルダ、 ６…支持棒、 ７…駆動モータ。 DESCRIPTION OF SYMBOLS 1 ... Cleaning tank, 2 ... Ultrasonic vibrator, 3 ... Cleaning liquid, 4 ... Flat substrate, 5 ... Substrate holder, 6 ... Support rod, 7 ... Drive motor.
Claims (4)
に超音波を照射して洗浄する洗浄方法において、超音波
振動の進行方向に対して該被洗浄物の洗浄面が傾斜して
位置するよう該被洗浄物を回転・揺動させながら洗浄す
ることを特徴とする超音波洗浄方法。1. A cleaning method in which an object to be cleaned is immersed in a cleaning liquid, and the object to be cleaned is irradiated with ultrasonic waves to be cleaned, and the cleaning surface of the object to be cleaned is inclined with respect to the traveling direction of ultrasonic vibrations. An ultrasonic cleaning method, characterized in that the object to be cleaned is rotated and rocked so as to be positioned at a predetermined position.
に超音波を発振するための振動子とを備え、該洗浄液中
に被洗浄物を浸漬して超音波振動子から発振された超音
波を洗浄液を媒介として被洗浄物表面に照射して洗浄を
行う超音波洗浄装置において、該被洗浄物の洗浄面を超
音波振動の進行方向に対して傾斜して位置するよう該被
洗浄物を回転・揺動できる駆動装置を備えたことを特徴
とする超音波洗浄装置。2. A cleaning tank filled with a cleaning liquid, and a vibrator for oscillating ultrasonic waves at the bottom of the cleaning tank, wherein an object to be cleaned is immersed in the cleaning liquid and oscillated from the ultrasonic vibrator. In an ultrasonic cleaning device for irradiating ultrasonic waves to a surface of an object to be cleaned through a cleaning liquid, the object to be cleaned is positioned so that a surface to be cleaned of the object to be cleaned is inclined with respect to a traveling direction of ultrasonic vibration. An ultrasonic cleaning device having a drive device capable of rotating and rocking an object.
ることを特徴とする請求項１に記載の超音波洗浄方法及
び請求項２に記載の超音波洗浄装置。3. The ultrasonic cleaning method according to claim 1 and the ultrasonic cleaning device according to claim 2, wherein the oscillation frequency of ultrasonic waves is 400 kHz or more.
なす角度が１度以上１５度以下であることを特徴とする
請求項１に記載の超音波洗浄方法及び請求項２に記載の
超音波洗浄装置。4. The ultrasonic cleaning method according to claim 1, wherein the angle formed by the cleaning surface of the object to be cleaned and the traveling direction of ultrasonic waves is 1 degree or more and 15 degrees or less. The ultrasonic cleaning device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12606994A JPH07328572A (en) | 1994-06-08 | 1994-06-08 | Ultrasonic washing method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12606994A JPH07328572A (en) | 1994-06-08 | 1994-06-08 | Ultrasonic washing method and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07328572A true JPH07328572A (en) | 1995-12-19 |
Family
ID=14925851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12606994A Pending JPH07328572A (en) | 1994-06-08 | 1994-06-08 | Ultrasonic washing method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07328572A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7581551B2 (en) * | 2004-09-01 | 2009-09-01 | Sanyo Electric Co., Ltd. | Cleaning apparatus |
| US7980255B2 (en) | 2001-11-02 | 2011-07-19 | Applied Materials, Inc. | Single wafer dryer and drying methods |
| CN102626701A (en) * | 2012-05-07 | 2012-08-08 | 舟山市金秋机械有限公司 | Ultrasonic cleaning device |
| JP2012223760A (en) * | 2011-04-21 | 2012-11-15 | Imec | Method and apparatus for cleaning semiconductor substrate |
| CN114273328A (en) * | 2021-12-30 | 2022-04-05 | 上海至纯洁净***科技股份有限公司 | Double-layer megawave cleaning system |
-
1994
- 1994-06-08 JP JP12606994A patent/JPH07328572A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7980255B2 (en) | 2001-11-02 | 2011-07-19 | Applied Materials, Inc. | Single wafer dryer and drying methods |
| US7581551B2 (en) * | 2004-09-01 | 2009-09-01 | Sanyo Electric Co., Ltd. | Cleaning apparatus |
| JP2012223760A (en) * | 2011-04-21 | 2012-11-15 | Imec | Method and apparatus for cleaning semiconductor substrate |
| CN102626701A (en) * | 2012-05-07 | 2012-08-08 | 舟山市金秋机械有限公司 | Ultrasonic cleaning device |
| CN114273328A (en) * | 2021-12-30 | 2022-04-05 | 上海至纯洁净***科技股份有限公司 | Double-layer megawave cleaning system |
| CN114273328B (en) * | 2021-12-30 | 2024-04-12 | 上海至纯洁净***科技股份有限公司 | Double-layer megasonic cleaning system |
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