CN114273328B - Double-layer megasonic cleaning system - Google Patents
Double-layer megasonic cleaning system Download PDFInfo
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- CN114273328B CN114273328B CN202111658773.5A CN202111658773A CN114273328B CN 114273328 B CN114273328 B CN 114273328B CN 202111658773 A CN202111658773 A CN 202111658773A CN 114273328 B CN114273328 B CN 114273328B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 137
- 230000033001 locomotion Effects 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000002355 dual-layer Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 3
- 239000012530 fluid Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 26
- 238000000034 method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a double-layer megasonic cleaning system, which comprises a base, an ultrasonic signal generating device, a bath tank and a cleaning tank for cleaning a wafer, wherein the ultrasonic signal generating device is arranged on the base; the bath tank is arranged at the upper end of the ultrasonic signal generating device and is filled with an acoustic wave conducting medium; the cleaning tank is arranged above the bath tank, the bottom of the cleaning tank is immersed in an acoustic wave conduction medium in the bath tank, and cleaning liquid is contained in the cleaning tank. According to the invention, the sound wave direction of the ultrasonic signal generating device is changed through the movement of the base, the projection area of the wafer in the sound wave direction is changed, so that the cleaning effect and efficiency are improved, and meanwhile, the pressure difference is generated at the bottom of the cleaning tank through the change of the sound wave direction, so that bubbles collected at the bottom of the cleaning tank are eliminated, the energy loss of ultrasonic waves is reduced, and the cleaning effect is improved.
Description
Technical Field
The invention relates to the field of semiconductor process equipment, in particular to a double-layer megasonic cleaning system and a cleaning method.
Background
The conventional ultrasonic cleaning device has long been used in cleaning semiconductor wafers, and as the line width of the process becomes smaller, the cleaning requirement is higher and higher, and the frequency of ultrasonic waves is continuously increased from kilohertz to megahertz. But as the frequency of the sound wave increases, the directivity characteristic and energy attenuation of the sound wave become more pronounced. Most of the conventional cleaning modes are to vertically place a wafer above an ultrasonic signal generator, the projection area of the wafer to ultrasonic waves is small, and the cleaning effect of the middle part and the top part of the wafer is relatively weak compared with that of the bottom part.
The existing cleaning equipment generally adopts the mode that the bottom of a cleaning tank is changed into an inclined plane from a plane, or a circulating mechanism is added at the bottom of the cleaning tank, so that the quantity of bubbles accumulated at the bottom of the cleaning tank is reduced.
The prior art, such as the patent of the invention with the application number of CN201480023016.2, discloses an ultrasonic cleaning device and a cleaning method, wherein a cleaning tank with an inclined bottom is adopted, the inclination direction of the adjacent cleaning tanks is changed, and the cleaning effect is improved.
The prior art also discloses a semiconductor cleaning device as in the invention patent with application number CN202110599855.0, comprising a bath, a cleaning tank, an acoustic wave signal generating device and a conducting medium jetting device, wherein the cleaning tank is used for accommodating wafers, the bottom of the cleaning tank is arranged in the bath, the acoustic wave signal generating device is arranged at the bottom of the bath, the conducting medium in the bath is used for conducting acoustic wave signals to the cleaning tank, the conducting medium jetting device is arranged in the bath and is used for jetting the conducting medium to the bottom of the cleaning tank, and bubbles at the bottom of the wafer cleaning tank are pushed away from the bottom of the cleaning tank through the conducting medium flowing from one side to the other side.
In the prior art, under the condition of the same power, the utilization rate of ultrasonic waves is increased, but the contact area between the ultrasonic wave transmission direction and the surface of the wafer is not changed, and the projection area of the wafer in the ultrasonic wave transmission range is not changed.
Disclosure of Invention
In order to eliminate bubbles accumulated at the bottom of a cleaning tank and increase the effect and efficiency of wafer cleaning, the invention provides a double-layer megasonic cleaning system.
The technical purpose of the invention is realized by the following technical scheme:
the double-layer megasonic cleaning system structurally comprises a base, an ultrasonic signal generating device, a bath tank and a cleaning tank for cleaning a wafer, wherein the ultrasonic signal generating device is arranged on the base, the base is a movable base, and the motion of the base changes the direction of the ultrasonic signal generating device for emitting sonic waves relative to the cleaning tank; the bath tank is arranged at the upper end of the ultrasonic signal generating device and is filled with an acoustic wave conducting medium; the cleaning tank is arranged above the bath tank, the bottom of the cleaning tank is immersed in an acoustic wave conduction medium in the bath tank, and cleaning liquid is contained in the cleaning tank.
Further, an overflow groove is arranged in the cleaning groove, the overflow groove is embedded in the cleaning groove, and the cleaning liquid is contained in the overflow groove.
Further, a cleaning liquid circulation pipeline for circulating and flowing the cleaning liquid between the cleaning tank and the overflow tank is also connected between the cleaning tank and the overflow tank.
Further, the base also comprises a driving control mechanism for controlling the movement of the base and a driving device for driving the movement of the base.
Further, two sides of the base are provided with base brackets, and the base is movably arranged on the base brackets; the cleaning tank support frame is arranged outside the cleaning tank; the cleaning tank support frame is separated from the base support frame.
Further, the upper end edge of the overflow groove is provided with a plurality of overflow ports, and the upper end surface of the overflow groove is lower than the upper end surface of the cleaning groove.
Further, the motion mode of the base comprises circular motion, simple harmonic motion or swinging.
Further, the driving device is driven by a motor or hydraulically.
Further, the ultrasonic signal generating device is a megasonic generating device.
Compared with the prior art, the invention has the beneficial effects that:
1. the double-layer megasonic cleaning system cleans the wafer, changes the sonic direction of the ultrasonic signal generating device through the movement of the base, changes the projection area of the wafer in the sonic direction, and further improves the cleaning effect and efficiency.
2. When the double-layer megasonic cleaning system disclosed by the invention is used for cleaning a wafer, tiny bubbles accumulated at the bottom of the cleaning tank are extruded out from the bottom of the cleaning tank due to pressure difference generated by the change of sound waves, so that the energy loss of ultrasonic waves is reduced, and the cleaning effect is further improved.
3. According to the invention, through changing the incidence angle of the ultrasonic wave, the reflection angle of the acoustic wave on the surface of the wafer is changed, so that the utilization rate of the acoustic wave is further improved, and the possibility of occurrence of cleaning dead angles is reduced.
Drawings
Fig. 1 is a schematic diagram of a two-layer megasonic cleaning system according to the present invention.
Fig. 2 is a three-dimensional schematic diagram of a two-layer megasonic cleaning system of the present invention.
Fig. 3 is a prior art solution for eliminating bubbles at the bottom of a cleaning tank.
Figure 4 is a schematic view of the motion of the base of a two-layer megasonic cleaning system of the present invention.
FIG. 5 is a graph comparing the reflection of sound waves with the reflection of original sound waves.
In the figure, 1, a base; 2. an ultrasonic signal generator; 3. a bath; 4. a cleaning tank; 5. a wafer; 6. an overflow trough; 7. an overflow port; 8. a cleaning liquid circulation line; 9. a base bracket; 10. and a cleaning tank supporting frame.
Detailed Description
The technical scheme of the invention is further described below with reference to the specific embodiments:
the wafer is cleaned by the sound wave, the wafer in the cleaning tank is generally cleaned by the sound wave generating device, the lower end of the cleaning tank is immersed in the bath, the bath is filled with the sound wave conducting medium, the sound wave is transmitted to the cleaning tank by the sound wave conducting medium, but bubbles are converged at the bottom of the cleaning tank, and the refraction and reflection of the sound wave can occur when the sound wave encounters the bubbles, so that the energy of the sound wave entering the cleaning tank is affected; to solve this problem, the prior art adopts a configuration in which the bottom of the cleaning tank is set to be inclined, and as shown in fig. 3, bubbles can move away from the bottom of the cleaning tank along the inclined surface.
In order to solve the problem, the present embodiment provides a double-layer megasonic cleaning system, the structure of which is shown in fig. 1 and 2, comprising a base 1, an ultrasonic signal generating device 2, a bath 3, and a cleaning tank 4 for cleaning a wafer, wherein the ultrasonic signal generating device 2 is mounted on the base 1, the base 1 is a movable base, and the base 1 changes the direction of the ultrasonic signal generating device emitting sonic waves relative to the cleaning tank 4 by movement; the bath tank 3 is arranged at the upper end of the ultrasonic signal generating device 2, and the bath tank 3 is internally filled with an acoustic wave conducting medium such as water; the cleaning tank 4 is arranged above the bath tank 3, the bottom of the cleaning tank 4 is immersed in an acoustic wave conduction medium in the bath tank 3, and cleaning liquid is contained in the cleaning tank 4. In this embodiment, the ultrasonic signal generating device is a megasonic generating device, and can emit megasonic waves.
When the ultrasonic wave signal generating device 2 works, megasonic waves are generated, the megasonic waves are transmitted into the cleaning tank 4 through a sonic wave conduction medium in the bath tank 3, and the surface of the wafer 5 is cleaned through the sonic waves; during cleaning, the base 1 moves to change the direction of sound waves, and the movement mode of the base is such as circular movement, simple harmonic movement or swinging, but not limited to the three movement modes, and through changing the direction of the sound waves, on one hand, the pressure difference generated by the sound waves extrudes bubbles at the bottom of the cleaning tank 4 to leave, on the other hand, the projection area of the wafer 5 in the direction of the sound waves can be changed through changing the direction of the sound waves, so that the cleaning effect and efficiency are improved.
In addition, when an included angle exists between the ultrasonic wave and the surface of the wafer 5, the ultrasonic wave is reflected along the surface of the wafer 5, the direction of the transmission of the ultrasonic wave and the reflection of the ultrasonic wave do not interfere, the energy is further overlapped with each other along with the further transmission of the subsequent ultrasonic wave, multiple reflections are formed on the surface of the wafer, the reflection angle is changed along with the change of the incidence angle of the ultrasonic wave, multiple reflection points are formed on the surface of the wafer, the utilization rate of the ultrasonic wave is further improved, the cleaning dead angle is reduced, the left side in fig. 5 is the state of the reflection of the acoustic wave after the incidence direction of the acoustic wave is changed, the right side in fig. 5 is the state of the reflection of the acoustic wave under the condition that the incidence direction is unchanged, and the cleaning dead angle exists between the wafers 5 if the incidence angle of the acoustic wave is unchanged from fig. 5.
Preferably, an overflow groove 6 is further arranged in the cleaning groove 4, the overflow groove 6 is embedded in the cleaning groove 4, cleaning liquid is contained in the overflow groove 6, and the wafer 5 is immersed in the cleaning liquid in the overflow groove 6 during cleaning; the upper end of the overflow groove 6 is lower than the upper end of the cleaning groove 4, the edge of the upper end of the overflow groove 6 is provided with an overflow port 7, and cleaning liquid flows between the overflow groove 6 and the cleaning groove 4 from the overflow port 7 in the cleaning process; a cleaning liquid circulation pipeline 8 for circulating the cleaning liquid between the cleaning tank 4 and the overflow tank 6 is also connected between the cleaning tank 4 and the overflow tank 6, and the cleaning liquid flowing into the cleaning tank 4 is circulated and returned into the overflow tank 6 through the cleaning liquid circulation pipeline 8.
The base 1 comprises a driving control mechanism for controlling the movement of the base, a driving device for driving the movement of the base, the driving device is used for driving the movement of the base, the angle and the position of the base and the time under the corresponding angle positions are controlled by the driving control mechanism, and the driving control mechanism is a PLC control system.
In the embodiment, base brackets 9 are arranged on two sides of a base 1, and the base 1 is movably arranged on the base brackets 9; the cleaning tank support frame 10 is arranged outside the cleaning tank 4; the cleaning tank support frame 10 is separated from the base support frame 9. Taking the swing as an example, the driving device drives the base 1 to swing relative to the base support 9, the driving device such as a motor is matched with a speed reducer to drive the base to move, or the motor is matched with a worm to drive the base to move, or the hydraulic device is also used for driving the base to move, and when the base swings, the ultrasonic signal generating device 2 and the bath tank 3 on the base 1 move together with the base 1, as shown in fig. 4.
The present embodiment is further illustrative of the present invention and is not to be construed as limiting the invention, and those skilled in the art can make no inventive modifications to the present embodiment as required after reading the present specification, but only as long as they are within the scope of the claims of the present invention.
Claims (7)
1. The double-layer megasonic cleaning system is characterized by comprising a base, an ultrasonic signal generating device, a bath tank and a cleaning tank for cleaning a wafer, wherein the ultrasonic signal generating device is arranged on the base, the base is a movable base, and the motion of the base changes the direction of the ultrasonic signal generating device for emitting sound waves relative to the cleaning tank; the bath tank is arranged at the upper end of the ultrasonic signal generating device, and is filled with an acoustic wave conducting medium; the cleaning tank is arranged above the bath tank, the bottom of the cleaning tank is immersed in an acoustic wave conduction medium in the bath tank, and cleaning liquid is contained in the cleaning tank; when the base swings, the ultrasonic signal generating device on the base and the bath tank move together with the base; the base also comprises a driving control mechanism for controlling the movement of the base and a driving device for driving the movement of the base; base brackets are arranged on two sides of the base, and the base is movably arranged on the base brackets; the cleaning tank support frame is arranged outside the cleaning tank; the cleaning tank support frame is separated from the base support frame; the driving device drives the base to swing relative to the base support.
2. The dual layer megasonic cleaning system of claim 1 wherein the cleaning tank is further provided with an overflow tank, the overflow tank is embedded in the cleaning tank, and the cleaning solution is contained in the overflow tank.
3. The double-layer megasonic cleaning system of claim 2 wherein a cleaning fluid circulation line for circulating cleaning fluid between the cleaning tank and the overflow tank is further connected between the cleaning tank and the overflow tank.
4. The double-layer megasonic cleaning system according to claim 2, wherein the upper edge of the overflow tank is provided with a plurality of overflow ports, and the upper end surface of the overflow tank is lower than the upper end surface of the cleaning tank.
5. The dual layer megasonic cleaning system of claim 1 wherein the motion of the base comprises a circular motion or a swinging motion.
6. The dual layer megasonic cleaning system of claim 1 wherein the drive means is a motor drive or a hydraulic drive.
7. The dual layer megasonic cleaning system of claim 1 wherein the ultrasonic signal generating means is a megasonic generating means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111658773.5A CN114273328B (en) | 2021-12-30 | 2021-12-30 | Double-layer megasonic cleaning system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111658773.5A CN114273328B (en) | 2021-12-30 | 2021-12-30 | Double-layer megasonic cleaning system |
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| CN114273328A CN114273328A (en) | 2022-04-05 |
| CN114273328B true CN114273328B (en) | 2024-04-12 |
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| CN202111658773.5A Active CN114273328B (en) | 2021-12-30 | 2021-12-30 | Double-layer megasonic cleaning system |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH368954A (en) * | 1959-04-10 | 1963-04-30 | Albert Dreyer Josef | Ultrasonic cleaning device |
| JPH07328572A (en) * | 1994-06-08 | 1995-12-19 | Hitachi Ltd | Ultrasonic washing method and apparatus |
| JP2009231668A (en) * | 2008-03-25 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | Substrate processing device and method |
| CN103223406A (en) * | 2012-01-27 | 2013-07-31 | 硅电子股份公司 | Cleaning apparatus, equipment, and method |
| CN107068595A (en) * | 2017-04-14 | 2017-08-18 | 常州亿晶光电科技有限公司 | Silicon chip ultrasonic wave cleaning device |
| CN110756513A (en) * | 2019-09-19 | 2020-02-07 | 上海提牛机电设备有限公司 | Wafer cleaning device with sound wave as kinetic energy |
| CN110813906A (en) * | 2019-11-26 | 2020-02-21 | 天津科技大学 | High-efficient ultrasonic cleaning device with diffusion field washing tank |
| CN110935686A (en) * | 2019-11-27 | 2020-03-31 | 北京工业大学 | Suspension type ultrasonic-low frequency vibration combined cleaning method and device |
| CN210788405U (en) * | 2019-09-26 | 2020-06-19 | 上海峰梅光学科技有限公司 | Cleaning transmission device of cleaning machine |
| CN211757275U (en) * | 2020-01-02 | 2020-10-27 | 苏州天士达精密机械有限公司 | Ultrasonic cleaning machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6314974B1 (en) * | 1999-06-28 | 2001-11-13 | Fairchild Semiconductor Corporation | Potted transducer array with matching network in a multiple pass configuration |
-
2021
- 2021-12-30 CN CN202111658773.5A patent/CN114273328B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH368954A (en) * | 1959-04-10 | 1963-04-30 | Albert Dreyer Josef | Ultrasonic cleaning device |
| JPH07328572A (en) * | 1994-06-08 | 1995-12-19 | Hitachi Ltd | Ultrasonic washing method and apparatus |
| JP2009231668A (en) * | 2008-03-25 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | Substrate processing device and method |
| CN103223406A (en) * | 2012-01-27 | 2013-07-31 | 硅电子股份公司 | Cleaning apparatus, equipment, and method |
| CN107068595A (en) * | 2017-04-14 | 2017-08-18 | 常州亿晶光电科技有限公司 | Silicon chip ultrasonic wave cleaning device |
| CN110756513A (en) * | 2019-09-19 | 2020-02-07 | 上海提牛机电设备有限公司 | Wafer cleaning device with sound wave as kinetic energy |
| CN210788405U (en) * | 2019-09-26 | 2020-06-19 | 上海峰梅光学科技有限公司 | Cleaning transmission device of cleaning machine |
| CN110813906A (en) * | 2019-11-26 | 2020-02-21 | 天津科技大学 | High-efficient ultrasonic cleaning device with diffusion field washing tank |
| CN110935686A (en) * | 2019-11-27 | 2020-03-31 | 北京工业大学 | Suspension type ultrasonic-low frequency vibration combined cleaning method and device |
| CN211757275U (en) * | 2020-01-02 | 2020-10-27 | 苏州天士达精密机械有限公司 | Ultrasonic cleaning machine |
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| CN114273328A (en) | 2022-04-05 |
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