JPH0679773B2 - Soldering iron tip - Google Patents
Soldering iron tipInfo
- Publication number
- JPH0679773B2 JPH0679773B2 JP1094457A JP9445789A JPH0679773B2 JP H0679773 B2 JPH0679773 B2 JP H0679773B2 JP 1094457 A JP1094457 A JP 1094457A JP 9445789 A JP9445789 A JP 9445789A JP H0679773 B2 JPH0679773 B2 JP H0679773B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- solder
- iron tip
- coating film
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は半田コテ先に係り、特に寸法精度が著しく改善
された半田コテ先に関する。TECHNICAL FIELD The present invention relates to a soldering iron tip, and more particularly to a soldering iron tip having remarkably improved dimensional accuracy.
［従来の技術］ 半田コテは、ヒータを内蔵する半田コテ本体の先端に半
田コテ先が取り付けられてなるものである。[Prior Art] A soldering iron has a soldering iron tip attached to the tip of a soldering iron body containing a heater.
従来の半田コテ先は、ヒータの熱伝導性の面から、その
本体は銅製（無酸素銅製）とされている。そして、半田
との濡れ性を確保するため、ハンダと銅との合金を形成
による銅の溶解を阻止するため、及び銅の高温酸化に伴
なう材料劣化を防止するために、先端部分には0.5〜1mm
厚さの鉄（純鉄）メッキが施されている。The body of the conventional soldering iron tip is made of copper (oxygen-free copper) from the viewpoint of the thermal conductivity of the heater. Then, in order to ensure wettability with solder, to prevent melting of copper due to the formation of an alloy of solder and copper, and to prevent material deterioration due to high temperature oxidation of copper, the tip portion is 0.5-1 mm
Thick iron (pure iron) plating is applied.
ところで、近年、半田により加工される被半田部につい
てより微細かつ複雑な構造のものが提供されるようにな
り、半田コテ先についても細く寸法精度の高い半田コテ
先が必要とされてきている。By the way, in recent years, a soldered portion processed by solder has a finer and more complicated structure, and a soldering iron tip that is thin and has high dimensional accuracy has been required.
［発明が解決しようとする課題］ しかしながら、銅製基体の表面に鉄メッキを施してなる
従来の半田コテ先では、十分に細いものを高い寸法精度
で製作することができない。この理由は、鉄メッキ部に
ハンダが濡れるため、及び鉄メッキの消耗と共に、ハン
ダ付部が大きくなる傾向にあるためである。このため、
従来の半田コテ先では微細かつ複雑な被半田部の半田付
けを正確に行なうことができないという欠点があった。[Problems to be Solved by the Invention] However, with a conventional soldering iron tip in which the surface of a copper base is plated with iron, a sufficiently thin soldering iron tip cannot be manufactured with high dimensional accuracy. The reason for this is that the iron-plated portion is wetted by the solder, and the soldered portion tends to become large as the iron plating is consumed. For this reason,
The conventional soldering iron tip has a drawback that it is not possible to accurately solder a fine and complicated soldered portion.
本発明は上記従来の問題点を解決し、細い半田コテ先で
あっても寸法精度良く製作することが可能な半田コテ先
を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above conventional problems and to provide a soldering iron tip that can be manufactured with high dimensional accuracy even with a thin soldering iron tip.
［課題を解決するための手段］ 本発明の半田コテ先は、銅又は銅合金製基体と、該基体
表面に形成された半田が付着し難いコーティング膜とか
ら実質的に構成される半田コテ先であって、該コーティ
ング膜は物理的蒸着法又は化学的蒸着法で形成された、
半田が付着し難いアモルファス合金又はセラミックスの
コーティング膜であることを特徴とする。[Means for Solving the Problem] The soldering iron tip of the present invention is a soldering iron tip that is substantially composed of a copper or copper alloy substrate and a coating film formed on the surface of the substrate to which the solder hardly adheres. The coating film is formed by a physical vapor deposition method or a chemical vapor deposition method,
It is characterized by being a coating film of an amorphous alloy or ceramics to which solder is hard to adhere.
［作用］ アモルファス合金又はセラミックスのコーティング膜は
スパッタ法等の物理的蒸着法やCVD法等の化学的蒸着法
により、容易かつ高精度に形成することができる。従っ
て、本発明の半田コテ先は、細いものであっても寸法精
度良く製作することができる。[Operation] A coating film of an amorphous alloy or ceramics can be easily and highly accurately formed by a physical vapor deposition method such as a sputtering method or a chemical vapor deposition method such as a CVD method. Therefore, the soldering iron tip of the present invention can be manufactured with high dimensional accuracy even if it is thin.
また、アモルファス合金又はセラミックスは、耐食性に
優れ、高硬度で機械的特性、化学的安定性に優れるもの
であることから、本発明の半田コテ先は耐久的にも優れ
たものとなる。Further, since the amorphous alloy or the ceramic is excellent in corrosion resistance, high in hardness, mechanical properties and chemical stability, the soldering iron tip of the present invention is also excellent in durability.
なお、本発明の半田コテ先に形成されるコーティング膜
は、半田が付着し難いアモルファス合金又はセラミック
スである。即ち、本発明の半田コテ先は、半田を加熱溶
融するためにのみ用いるタイプのものであって、その使
用に際しては、被半田部に予めクリーム半田のような半
田を塗布しておき、この被半田部のクリーム半田等を本
発明の半田コテ先により局所的に溶融し、その後放冷硬
化させることにより精密な高精度の半田付けを行なう。The coating film formed on the tip of the soldering iron of the present invention is an amorphous alloy or ceramic to which solder is hard to attach. That is, the soldering iron tip of the present invention is of a type that is used only for heating and melting solder, and when using it, solder such as cream solder is previously applied to the soldered portion and The cream solder or the like of the solder portion is locally melted by the soldering iron tip of the present invention and then allowed to cool and harden, whereby precise and highly accurate soldering is performed.
このような半田の付着し難いアモルファス合金又はセラ
ミックスのコーティング膜が形成された半田コテ先によ
れば、半田が半田コテ先にのぼることがなく、半田コテ
先により半田塗布部が乱されることもなく、且つ使用経
過と共にコテ先形状の変化もないため、微細な被半田部
も高精度で半田付けすることができ且つコテ先の耐久性
も向上できる。According to the soldering iron tip on which the coating film of the amorphous alloy or the ceramic which is hard to adhere to the solder is formed, the solder does not reach the soldering iron tip and the soldering tip may be disturbed by the soldering iron tip. Since there is no change in the shape of the iron tip over the course of use, it is possible to solder a fine soldered portion with high accuracy and improve the durability of the iron tip.
［実施例］ 以下に本発明の実施例につき詳細に説明する。[Examples] Examples of the present invention will be described in detail below.
本発明の半田コテ先は、無酸素銅等の銅又は銅合金製基
体の表面に、半田が付着し難いアモルファス合金又はセ
ラミックスのコーティング膜が形成されてなるものであ
る。The soldering iron tip of the present invention is formed by forming a coating film of an amorphous alloy or ceramics on which solder is unlikely to adhere, on the surface of a base made of copper or a copper alloy such as oxygen-free copper.
本発明において、コーティング膜を形成するアモルファ
ス合金又はセラミックスとしては、耐食性の高いもの程
好ましく、その半田の難付着性の程度は、クロムと同程
度の難濡れ性のものであって、フラックスに対して耐食
性のあるものであれば良く、特に制限はない。本発明に
おいて、半田の付着し難い、即ち、半田との濡れ性の低
く、且つ耐食性のあるアモルファス合金の組成としては
次の、、が例示される。In the present invention, as the amorphous alloy or ceramics for forming the coating film, the one having higher corrosion resistance is more preferable, and the degree of the difficulty of adhesion of the solder thereof is the same as that of chromium, which is hardly wettable, and the flux is against the flux. There is no particular limitation as long as it has corrosion resistance. In the present invention, the following is given as an example of the composition of the amorphous alloy which is less likely to be attached with solder, that is, has low wettability with solder and has corrosion resistance.
Ta:30〜60原子％ Fe:30〜50原子％ Ni: 3〜 7原子％ Cr: 7〜15原子％ W :10〜75原子％ Fe:30〜50原子％ Ni: 3〜10原子％ Cr: 7〜20原子％ Ti:10〜75原子％ Fe:30〜50原子％ Ni: 3〜10原子％ Cr: 7〜20原子％ また、半田の付着し難く耐食性の高いセラミックスとし
ては、Cr2O3，Si3N4,SiC,Al2O3等が挙げられる。Ta: 30 to 60 atomic% Fe: 30 to 50 atomic% Ni: 3 to 7 atomic% Cr: 7 to 15 atomic% W: 10 to 75 atomic% Fe: 30 to 50 atomic% Ni: 3 to 10 atomic% Cr : 7 to 20 atomic% Ti: 10 to 75 atomic% Fe: 30 to 50 atomic% Ni: 3 to 10 atomic% Cr: 7 to 20 atomic% Also, as a ceramic with high solder resistance and high corrosion resistance, Cr 2 Examples include O 3 , Si 3 N 4 , SiC, Al 2 O 3 .
なお、半田としては、通常使われている組成のものがあ
てはまる。具体的には、Pb−Sn系の半田が例示される。It should be noted that as the solder, a solder having a commonly used composition is applicable. Specifically, Pb-Sn based solder is exemplified.
これらのアモルファス合金又はセラミックスのコーティ
ング膜の厚さには特に制限はないが、薄過ぎると十分な
耐食性が得られず、厚過ぎると膜剥離等の問題が生じる
こととなる。このため、本発明においては、アモルファ
ス合金又はセラミックスのコーティング膜の厚さは、0.
1〜10μｍ程度の範囲で半田コテ先の使用目的等に応じ
て適宜決定する。The thickness of the coating film of these amorphous alloys or ceramics is not particularly limited, but if it is too thin, sufficient corrosion resistance cannot be obtained, and if it is too thick, problems such as film peeling occur. Therefore, in the present invention, the thickness of the coating film of the amorphous alloy or ceramics is 0.
It is appropriately determined in the range of about 1 to 10 μm according to the purpose of use of the soldering iron tip.
このようなアモルファス合金又はセラミックスのコーテ
ィング膜は、スパッタ法等の物理的蒸着法又はCVD法等
の化学的蒸着法により容易に形成することができる。Such an amorphous alloy or ceramic coating film can be easily formed by a physical vapor deposition method such as a sputtering method or a chemical vapor deposition method such as a CVD method.
本発明の半田コテ先は、通常、１ケ月あるいはそれ以上
の長期にわたって使用することができる。The soldering iron tip of the present invention can generally be used for a long period of one month or more.
［発明の効果］ 以上詳述した通り、本発明の半田コテ先は、細い半田コ
テ先であってもスパッタ法等により寸法精度良く製作す
ることが可能であり、微細かつ複雑な被半田部であって
も容易かつ高精度に良好な作業性にて半田付けを行なう
ことができる。しかも、耐食性、耐久性にも極めて優れ
るため、その寿命は大幅に延長され半田コテ先の取替作
業頻度を著しく低減し、半田付け作業効率を向上させる
ことができる。[Advantages of the Invention] As described in detail above, the soldering iron tip of the present invention can be manufactured with high dimensional accuracy by a sputtering method or the like even if it is a thin soldering iron tip, and it can be used for fine and complicated soldered portions Even if there is, soldering can be performed easily and with high accuracy and good workability. Moreover, since the corrosion resistance and the durability are extremely excellent, the life of the soldering iron is greatly extended, the frequency of solder iron tip replacement work is significantly reduced, and the soldering work efficiency can be improved.
Claims (1)
された半田が付着し難いコーティング膜とから実質的に
構成される半田コテ先であって、該コーティング膜は物
理的蒸着法又は化学的蒸着法で形成された、半田が付着
し難いアモルファス合金又はセラミックスのコーティン
グ膜であることを特徴とする半田コテ先。1. A soldering iron tip which is substantially composed of a copper or copper alloy substrate and a coating film formed on the surface of the substrate to which solder hardly adheres, the coating film being a physical vapor deposition method. Alternatively, a soldering iron tip formed of a chemical vapor deposition method is a coating film of an amorphous alloy or ceramics to which solder is hard to adhere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1094457A JPH0679773B2 (en) | 1989-04-14 | 1989-04-14 | Soldering iron tip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1094457A JPH0679773B2 (en) | 1989-04-14 | 1989-04-14 | Soldering iron tip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02274376A JPH02274376A (en) | 1990-11-08 |
| JPH0679773B2 true JPH0679773B2 (en) | 1994-10-12 |
Family
ID=14110797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1094457A Expired - Fee Related JPH0679773B2 (en) | 1989-04-14 | 1989-04-14 | Soldering iron tip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0679773B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5008113B2 (en) * | 2004-09-02 | 2012-08-22 | トピー工業株式会社 | Solder corrosion resistant material |
| US7618500B2 (en) * | 2005-11-14 | 2009-11-17 | Lawrence Livermore National Security, Llc | Corrosion resistant amorphous metals and methods of forming corrosion resistant amorphous metals |
| DE102008002988A1 (en) * | 2008-08-06 | 2010-02-11 | Solutions And Tools Gmbh | Soldering tip and method of making a soldering tip |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01309780A (en) * | 1988-02-22 | 1989-12-14 | Mitsui Eng & Shipbuild Co Ltd | Soldering iron tip |
| JPH01153859U (en) * | 1988-04-11 | 1989-10-23 | ||
| JPH06212Y2 (en) * | 1988-05-24 | 1994-01-05 | 株式会社ジャパンユニックス | Soldering iron tip |
-
1989
- 1989-04-14 JP JP1094457A patent/JPH0679773B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02274376A (en) | 1990-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |